DE3009163C2 - - Google Patents

Info

Publication number
DE3009163C2
DE3009163C2 DE3009163A DE3009163A DE3009163C2 DE 3009163 C2 DE3009163 C2 DE 3009163C2 DE 3009163 A DE3009163 A DE 3009163A DE 3009163 A DE3009163 A DE 3009163A DE 3009163 C2 DE3009163 C2 DE 3009163C2
Authority
DE
Germany
Prior art keywords
face
support
semiconductor
pressure
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3009163A
Other languages
German (de)
English (en)
Other versions
DE3009163A1 (de
Inventor
Reiner Dipl.-Phys. 7500 Karlsruhe De Krause
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19803009163 priority Critical patent/DE3009163A1/de
Priority to JP3446181A priority patent/JPS56142431A/ja
Publication of DE3009163A1 publication Critical patent/DE3009163A1/de
Application granted granted Critical
Publication of DE3009163C2 publication Critical patent/DE3009163C2/de
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
DE19803009163 1980-03-10 1980-03-10 Messwertaufnehmer fuer druck Granted DE3009163A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE19803009163 DE3009163A1 (de) 1980-03-10 1980-03-10 Messwertaufnehmer fuer druck
JP3446181A JPS56142431A (en) 1980-03-10 1981-03-10 Pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803009163 DE3009163A1 (de) 1980-03-10 1980-03-10 Messwertaufnehmer fuer druck

Publications (2)

Publication Number Publication Date
DE3009163A1 DE3009163A1 (de) 1981-09-24
DE3009163C2 true DE3009163C2 (fr) 1989-03-09

Family

ID=6096770

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19803009163 Granted DE3009163A1 (de) 1980-03-10 1980-03-10 Messwertaufnehmer fuer druck

Country Status (2)

Country Link
JP (1) JPS56142431A (fr)
DE (1) DE3009163A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5889873A (ja) * 1981-11-24 1983-05-28 Nippon Denso Co Ltd 半導体圧力変換器
EP0140992B1 (fr) * 1983-11-10 1988-05-25 Kristal Instrumente AG Elément transducteur, méthode de sa fabrication et utilisation pour un capteur de pression
DE4207848A1 (de) * 1992-03-12 1993-09-16 Jenoptik Jena Gmbh Einrichtung zur kraft- und druckmessung in mindestens einer komponente
JP4685662B2 (ja) * 2005-03-03 2011-05-18 エア・ウォーター株式会社 ガス分離方法およびそれに用いる装置
JP2009053005A (ja) * 2007-08-27 2009-03-12 Hitachi Metals Ltd 半導体歪センサーおよび半導体歪センサーの取付け方法
KR101151125B1 (ko) 2007-08-27 2012-06-01 가부시키가이샤 히타치세이사쿠쇼 반도체 왜곡 센서

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5112437B2 (fr) * 1971-10-01 1976-04-19
DE2617731C3 (de) * 1976-04-23 1979-06-07 Siemens Ag, 1000 Berlin Und 8000 Muenchen Miniaturdruckmeßwandler

Also Published As

Publication number Publication date
DE3009163A1 (de) 1981-09-24
JPS56142431A (en) 1981-11-06

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8320 Willingness to grant licences declared (paragraph 23)
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee