JPS56142431A - Pressure sensor - Google Patents

Pressure sensor

Info

Publication number
JPS56142431A
JPS56142431A JP3446181A JP3446181A JPS56142431A JP S56142431 A JPS56142431 A JP S56142431A JP 3446181 A JP3446181 A JP 3446181A JP 3446181 A JP3446181 A JP 3446181A JP S56142431 A JPS56142431 A JP S56142431A
Authority
JP
Japan
Prior art keywords
pressure sensor
sensor
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3446181A
Other languages
Japanese (ja)
Inventor
Kurauze Rainaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS56142431A publication Critical patent/JPS56142431A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
JP3446181A 1980-03-10 1981-03-10 Pressure sensor Pending JPS56142431A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803009163 DE3009163A1 (en) 1980-03-10 1980-03-10 Piezo-resistive pressure sensor with semiconductor membrane - is provided with precious metal layer on periphery before soldering to carrier

Publications (1)

Publication Number Publication Date
JPS56142431A true JPS56142431A (en) 1981-11-06

Family

ID=6096770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3446181A Pending JPS56142431A (en) 1980-03-10 1981-03-10 Pressure sensor

Country Status (2)

Country Link
JP (1) JPS56142431A (en)
DE (1) DE3009163A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5889873A (en) * 1981-11-24 1983-05-28 Nippon Denso Co Ltd Semiconductor pressure transducer
JP2006272325A (en) * 2005-03-03 2006-10-12 Air Water Inc Gas separation method and apparatus used for it
JP2009053005A (en) * 2007-08-27 2009-03-12 Hitachi Metals Ltd Semiconductor strain sensor, and mounting method of semiconductor strain sensor
US8438931B2 (en) 2007-08-27 2013-05-14 Hitachi, Ltd. Semiconductor strain sensor

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE34613T1 (en) * 1983-11-10 1988-06-15 Kristal Instr Ag TRANSDUCER ELEMENT, PROCESS FOR ITS MANUFACTURE AND USE FOR A PRESSURE TRANSDUCER.
DE4207848A1 (en) * 1992-03-12 1993-09-16 Jenoptik Jena Gmbh Force and pressure meter - contains thrust generating drive whose drive energy is used as measured variable by sensing voltage and current.

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5112437B2 (en) * 1971-10-01 1976-04-19
DE2617731C3 (en) * 1976-04-23 1979-06-07 Siemens Ag, 1000 Berlin Und 8000 Muenchen Miniature pressure transducer

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5889873A (en) * 1981-11-24 1983-05-28 Nippon Denso Co Ltd Semiconductor pressure transducer
JP2006272325A (en) * 2005-03-03 2006-10-12 Air Water Inc Gas separation method and apparatus used for it
JP4685662B2 (en) * 2005-03-03 2011-05-18 エア・ウォーター株式会社 Gas separation method and apparatus used therefor
JP2009053005A (en) * 2007-08-27 2009-03-12 Hitachi Metals Ltd Semiconductor strain sensor, and mounting method of semiconductor strain sensor
US8438931B2 (en) 2007-08-27 2013-05-14 Hitachi, Ltd. Semiconductor strain sensor

Also Published As

Publication number Publication date
DE3009163C2 (en) 1989-03-09
DE3009163A1 (en) 1981-09-24

Similar Documents

Publication Publication Date Title
GB2071853B (en) Pressure sensor
JPS5779419A (en) Pressure sensor assembly
JPS57149933A (en) Capacitive pressure sensor
GB2042258B (en) Pressure sensor
GB2047465B (en) Pressure sensor
IL63858A0 (en) Optical pressure sensor
JPS57813A (en) Sensor
DE3161635D1 (en) Finger-print sensor
JPS5742830A (en) Pressure sensing capsule
GB2063486B (en) Pressure sensor
JPS56132536A (en) Pressure sensing system
EP0146709A3 (en) Pressure sensor
EP0088270A3 (en) Pressure sensor
JPS57108734A (en) Sensor
GB8305851D0 (en) Pressure sensor
DE3169023D1 (en) Sensor
GB2039414B (en) Pressure sensor
EP0036285A3 (en) Flueric partial pressure sensors
JPS5791431A (en) Double hollow pressure sensor
JPS5720633A (en) Fluid pressure sensor
JPS57108735A (en) Sensor
GB2054864B (en) Pressure sensor
JPS5717830A (en) Semiconductor pressure sensor
DE3066672D1 (en) Pressure sensor
IL62654A (en) Pressure transducer