DE3009163A1 - Messwertaufnehmer fuer druck - Google Patents
Messwertaufnehmer fuer druckInfo
- Publication number
- DE3009163A1 DE3009163A1 DE19803009163 DE3009163A DE3009163A1 DE 3009163 A1 DE3009163 A1 DE 3009163A1 DE 19803009163 DE19803009163 DE 19803009163 DE 3009163 A DE3009163 A DE 3009163A DE 3009163 A1 DE3009163 A1 DE 3009163A1
- Authority
- DE
- Germany
- Prior art keywords
- carrier
- face
- membrane
- semiconductor
- piezo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19803009163 DE3009163A1 (de) | 1980-03-10 | 1980-03-10 | Messwertaufnehmer fuer druck |
JP3446181A JPS56142431A (en) | 1980-03-10 | 1981-03-10 | Pressure sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19803009163 DE3009163A1 (de) | 1980-03-10 | 1980-03-10 | Messwertaufnehmer fuer druck |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3009163A1 true DE3009163A1 (de) | 1981-09-24 |
DE3009163C2 DE3009163C2 (fr) | 1989-03-09 |
Family
ID=6096770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19803009163 Granted DE3009163A1 (de) | 1980-03-10 | 1980-03-10 | Messwertaufnehmer fuer druck |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS56142431A (fr) |
DE (1) | DE3009163A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0140992A1 (fr) * | 1983-11-10 | 1985-05-15 | Kristal Instrumente AG | Elément transducteur, méthode de sa fabrication et utilisation pour un capteur de pression |
DE4207848A1 (de) * | 1992-03-12 | 1993-09-16 | Jenoptik Jena Gmbh | Einrichtung zur kraft- und druckmessung in mindestens einer komponente |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5889873A (ja) * | 1981-11-24 | 1983-05-28 | Nippon Denso Co Ltd | 半導体圧力変換器 |
JP4685662B2 (ja) * | 2005-03-03 | 2011-05-18 | エア・ウォーター株式会社 | ガス分離方法およびそれに用いる装置 |
JP2009053005A (ja) * | 2007-08-27 | 2009-03-12 | Hitachi Metals Ltd | 半導体歪センサーおよび半導体歪センサーの取付け方法 |
KR101151125B1 (ko) | 2007-08-27 | 2012-06-01 | 가부시키가이샤 히타치세이사쿠쇼 | 반도체 왜곡 센서 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2248004A1 (de) * | 1971-10-01 | 1973-04-19 | Hitachi Ltd | Halbleiter-druckwandler |
DE2617731B2 (de) * | 1976-04-23 | 1978-09-14 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Miniaturdruckmeßwandler |
-
1980
- 1980-03-10 DE DE19803009163 patent/DE3009163A1/de active Granted
-
1981
- 1981-03-10 JP JP3446181A patent/JPS56142431A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2248004A1 (de) * | 1971-10-01 | 1973-04-19 | Hitachi Ltd | Halbleiter-druckwandler |
DE2617731B2 (de) * | 1976-04-23 | 1978-09-14 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Miniaturdruckmeßwandler |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0140992A1 (fr) * | 1983-11-10 | 1985-05-15 | Kristal Instrumente AG | Elément transducteur, méthode de sa fabrication et utilisation pour un capteur de pression |
US4675643A (en) * | 1983-11-10 | 1987-06-23 | Kristal Instrumente Ag | Pressure transducer utilizing a transduction element |
DE4207848A1 (de) * | 1992-03-12 | 1993-09-16 | Jenoptik Jena Gmbh | Einrichtung zur kraft- und druckmessung in mindestens einer komponente |
Also Published As
Publication number | Publication date |
---|---|
DE3009163C2 (fr) | 1989-03-09 |
JPS56142431A (en) | 1981-11-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
D2 | Grant after examination | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |