DE29704522U1 - Anordnung zur Integration einer Schaltung mit einem wärmeabführenden Gebläse - Google Patents

Anordnung zur Integration einer Schaltung mit einem wärmeabführenden Gebläse

Info

Publication number
DE29704522U1
DE29704522U1 DE29704522U DE29704522U DE29704522U1 DE 29704522 U1 DE29704522 U1 DE 29704522U1 DE 29704522 U DE29704522 U DE 29704522U DE 29704522 U DE29704522 U DE 29704522U DE 29704522 U1 DE29704522 U1 DE 29704522U1
Authority
DE
Germany
Prior art keywords
integrating
arrangement
heat
circuit
dissipating fan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29704522U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motor One Electronics Inc
Original Assignee
Motor One Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to GB9704357A priority Critical patent/GB2322962B/en
Priority to US08/805,905 priority patent/US5828550A/en
Application filed by Motor One Electronics Inc filed Critical Motor One Electronics Inc
Priority to DE29704522U priority patent/DE29704522U1/de
Priority to FR9704005A priority patent/FR2761854B3/fr
Publication of DE29704522U1 publication Critical patent/DE29704522U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE29704522U 1997-03-03 1997-03-13 Anordnung zur Integration einer Schaltung mit einem wärmeabführenden Gebläse Expired - Lifetime DE29704522U1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB9704357A GB2322962B (en) 1997-03-03 1997-03-03 Heat dissipating fan/integrated circuit assemblies
US08/805,905 US5828550A (en) 1997-03-03 1997-03-04 Heat dissipating fan/integrated circuit assemblies
DE29704522U DE29704522U1 (de) 1997-03-03 1997-03-13 Anordnung zur Integration einer Schaltung mit einem wärmeabführenden Gebläse
FR9704005A FR2761854B3 (fr) 1997-03-03 1997-04-02 Ensembles de ventilateur dissipant la chaleur/circuit integre

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB9704357A GB2322962B (en) 1997-03-03 1997-03-03 Heat dissipating fan/integrated circuit assemblies
US08/805,905 US5828550A (en) 1997-03-03 1997-03-04 Heat dissipating fan/integrated circuit assemblies
DE29704522U DE29704522U1 (de) 1997-03-03 1997-03-13 Anordnung zur Integration einer Schaltung mit einem wärmeabführenden Gebläse
FR9704005A FR2761854B3 (fr) 1997-03-03 1997-04-02 Ensembles de ventilateur dissipant la chaleur/circuit integre

Publications (1)

Publication Number Publication Date
DE29704522U1 true DE29704522U1 (de) 1997-05-15

Family

ID=27439148

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29704522U Expired - Lifetime DE29704522U1 (de) 1997-03-03 1997-03-13 Anordnung zur Integration einer Schaltung mit einem wärmeabführenden Gebläse

Country Status (4)

Country Link
US (1) US5828550A (de)
DE (1) DE29704522U1 (de)
FR (1) FR2761854B3 (de)
GB (1) GB2322962B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19856955A1 (de) * 1998-12-10 2000-06-15 Ameur Raouf Ben Gehäuse für einen Kühlkörper

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6012510A (en) * 1997-05-28 2000-01-11 Aavid Engineering, Inc. Torsion bar clamp apparatus and method for improving thermal and mechanical contact between stacked electronic components
US6037660A (en) * 1998-05-06 2000-03-14 Liu; Yen-Wen Device for securing a finned radiating structure to a computer chip
US6282091B1 (en) * 1999-11-11 2001-08-28 Sunonwealth Electric Machine Industry Co. Ltd Mounting devices for a heat-generating element and a heat-dissipating device
CA2447913A1 (en) * 2001-05-30 2002-12-05 Ats Automation Tooling Systems Inc. Folded-fin heat sink assembly and method of manufacturing same
GB2379266B (en) * 2001-08-29 2005-10-19 Sunonwealth Electr Mach Ind Co Heat dissipating device
US6519155B1 (en) * 2001-09-24 2003-02-11 Hon Hai Precision Ind. Co., Ltd. Retainer device for heat sink assembly
US7813129B2 (en) 2002-03-31 2010-10-12 J. Van Der Werff Holding B.V. Cooling of electrical and/or electronic components, specifically computer equipment
US6650541B1 (en) * 2002-06-25 2003-11-18 Hewlett-Packard Development Company, L.P. Fan-securing device for use with a heat transfer device
TW551810U (en) * 2002-12-31 2003-09-01 Hon Hai Prec Ind Co Ltd Fan assembly
CN2694488Y (zh) * 2004-03-18 2005-04-20 鸿富锦精密工业（深圳）有限公司 散热装置
CN100410544C (zh) * 2005-08-25 2008-08-13 建凖电机工业股份有限公司 鼓风扇
US7373718B2 (en) * 2006-01-06 2008-05-20 Asia Vital Components Co., Ltd. Test device for a heat dissipating fan
CN101316492B (zh) * 2007-06-01 2012-03-21 富准精密工业(深圳)有限公司 散热器扣具及散热装置组合
US8274793B2 (en) * 2008-12-23 2012-09-25 Intricast Company, Inc. Heatsink mounting system

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3247459C2 (de) * 1982-12-22 1985-11-21 Lindauer Dornier Gmbh, 8990 Lindau Vorrichtung zum Behandeln von bahnförmigen Materialien mit einem gasförmigen Medium
US5309983B1 (en) * 1992-06-23 1997-02-04 Pcubid Computer Tech Low profile integrated heat sink and fan assembly
US5299632A (en) * 1993-02-19 1994-04-05 Lee Lien Jung Fin device for an integrated circuit
US5287249A (en) * 1993-07-07 1994-02-15 Global Win Technology Co., Ltd. Fin assembly for an integrated circuit
US5335722A (en) * 1993-09-30 1994-08-09 Global Win Technology Co., Ltd Cooling assembly for an integrated circuit
US5368094A (en) * 1993-11-02 1994-11-29 Hung; Chin-Ping Bipartite heat sink positioning device for computer chips
US5409352A (en) * 1994-04-18 1995-04-25 Lin; Mike CPU heat dissipating device
US5421402A (en) * 1994-11-22 1995-06-06 Lin; Chuen-Sheng Heat sink apparatus
US5495392A (en) * 1995-03-06 1996-02-27 Shen; Tsan-Jung CPU heat dissipating apparatus
US5678627A (en) * 1996-01-03 1997-10-21 Lee; Richard CPU heat sink mounting structure
GB2312324B (en) * 1996-04-19 2000-11-15 Hong Chen Fu In Fan/pins seat assembly for an integrated circuit
US5708564A (en) * 1996-05-07 1998-01-13 Lin; Andy Heat sink mounting structure
US5664622A (en) * 1996-05-30 1997-09-09 Chiou; Ming Der Heat sink with deformable hangers for mounting
US5664624A (en) * 1996-11-04 1997-09-09 Chin-Fu Tsai Sloped wall type heat radiating member for chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19856955A1 (de) * 1998-12-10 2000-06-15 Ameur Raouf Ben Gehäuse für einen Kühlkörper

Also Published As

Publication number Publication date
GB2322962B (en) 2001-10-10
FR2761854B3 (fr) 1999-02-19
FR2761854A3 (fr) 1998-10-09
US5828550A (en) 1998-10-27
GB9704357D0 (en) 1997-04-23
GB2322962A (en) 1998-09-09

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19970626

R150 Utility model maintained after payment of first maintenance fee after three years

Effective date: 20000405

R151 Utility model maintained after payment of second maintenance fee after six years

Effective date: 20030313

R158 Lapse of ip right after 8 years

Effective date: 20051001