DE2837841A1 - Kontaktiereinrichtung fuer die herstellung einer drahtverbindung an einem mikroschaltkreis - Google Patents

Kontaktiereinrichtung fuer die herstellung einer drahtverbindung an einem mikroschaltkreis

Info

Publication number
DE2837841A1
DE2837841A1 DE19782837841 DE2837841A DE2837841A1 DE 2837841 A1 DE2837841 A1 DE 2837841A1 DE 19782837841 DE19782837841 DE 19782837841 DE 2837841 A DE2837841 A DE 2837841A DE 2837841 A1 DE2837841 A1 DE 2837841A1
Authority
DE
Germany
Prior art keywords
wire
clamp
contacting
clamp element
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19782837841
Other languages
German (de)
English (en)
Inventor
Karl Niklaus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Esec Sales SA
Original Assignee
Esec Sales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Sales SA filed Critical Esec Sales SA
Publication of DE2837841A1 publication Critical patent/DE2837841A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Wire Bonding (AREA)
DE19782837841 1977-09-07 1978-08-30 Kontaktiereinrichtung fuer die herstellung einer drahtverbindung an einem mikroschaltkreis Withdrawn DE2837841A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1096377A CH619334A5 (https=) 1977-09-07 1977-09-07

Publications (1)

Publication Number Publication Date
DE2837841A1 true DE2837841A1 (de) 1979-03-15

Family

ID=4368639

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19782837841 Withdrawn DE2837841A1 (de) 1977-09-07 1978-08-30 Kontaktiereinrichtung fuer die herstellung einer drahtverbindung an einem mikroschaltkreis

Country Status (4)

Country Link
US (1) US4205773A (https=)
CH (1) CH619334A5 (https=)
DE (1) DE2837841A1 (https=)
GB (1) GB2004222B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4527730A (en) * 1982-02-10 1985-07-09 Hitachi, Ltd. Wire bonding apparatus

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4475681A (en) * 1982-05-24 1984-10-09 The Micromanipulator Co., Inc. Bonder apparatus
US4550871A (en) * 1982-08-24 1985-11-05 Asm Assembly Automation Ltd. Four-motion wire bonder
GB2125720B (en) * 1982-08-24 1986-11-05 Asm Assembly Automation Ltd Wire bonding apparatus
US4603803A (en) * 1982-08-24 1986-08-05 Asm Assembly Automation, Ltd. Wire bonding apparatus
US4597522A (en) * 1983-12-26 1986-07-01 Kabushiki Kaisha Toshiba Wire bonding method and device
US4600138A (en) * 1984-07-25 1986-07-15 Hughes Aircraft Company Bonding tool and clamp assembly and wire handling method
DE3672530D1 (de) * 1985-05-31 1990-08-16 Dynapert Delvotec Sa Verbindungskopf.
DE19812706A1 (de) * 1998-03-23 1999-10-07 F&K Delvotec Bondtechnik Gmbh Verfahren und Vorrichtung zum "ball-bonden"
US20060219754A1 (en) * 2005-03-31 2006-10-05 Horst Clauberg Bonding wire cleaning unit and method of wire bonding using same
CN112872537A (zh) * 2019-11-29 2021-06-01 晋城三赢精密电子有限公司 具有清洁功能的焊线机
US11842978B1 (en) * 2022-07-15 2023-12-12 Asmpt Singapore Pte. Ltd. Wire bonding system including a wire biasing tool

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1707943A (en) * 1929-04-02 pocovl
US2308606A (en) * 1941-05-08 1943-01-19 Bell Telephone Labor Inc Method of making solder connections
US3520459A (en) * 1967-09-29 1970-07-14 Texas Instruments Inc Tape advance system
US3643321A (en) * 1970-06-17 1972-02-22 Kulicke & Soffa Ind Inc Method and apparatus for tailless wire bonding
US3672556A (en) * 1970-07-13 1972-06-27 John C Diepeveen Wire clamp
US3863827A (en) * 1972-11-10 1975-02-04 Mech El Ind Inc Tailless wire bonder
US3941486A (en) * 1974-06-03 1976-03-02 The Computervision Corporation Wire bonder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4527730A (en) * 1982-02-10 1985-07-09 Hitachi, Ltd. Wire bonding apparatus

Also Published As

Publication number Publication date
US4205773A (en) 1980-06-03
GB2004222A (en) 1979-03-28
CH619334A5 (https=) 1980-09-15
GB2004222B (en) 1982-03-24

Similar Documents

Publication Publication Date Title
DE2837841A1 (de) Kontaktiereinrichtung fuer die herstellung einer drahtverbindung an einem mikroschaltkreis
DE69012438T2 (de) Verfahren zum Herstellen einer Unebenheit auf einer Halbleiterchip-Elektrode und Apparat zur Anwendung dafür.
EP0330053B1 (de) Vorrichtung und Verfahren zur gesteuerten Zuführung eines Bonddrahtes zum wedge oder zur Kapillare eines Bondkopfes
DE2654471A1 (de) Kontaktierkopf fuer die herstellung einer drahtverbindung an einem mikroschaltkreis
DE2330674A1 (de) Vorrichtung zum bewegen eines gegenstandes ueber einen bestimmten weg
DE102012112667A1 (de) Verfahren und Vorrichtung zum Ausbilden eines Nagelbondhügels
DE10042661B4 (de) Verfahren und Vorrichtungen für die Montage von Halbleiterchips
DE3215573C2 (de) Einzelspuler mit automatischem Spulenwechsel zum Aufwickeln von Stranggut, insbesondere von Draht
DE466100C (de) Haltereinsetzmaschine fuer die Traggestelle elektrischer Gluehlampen
DE2322064C3 (de) Spulenwickelmaschine
DE2528806A1 (de) Thermokompressions-schweissvorrichtung
CH675035A5 (https=)
WO2000041834A1 (de) Verfahren und vorrichtung zur thermischen verbindung von anschlussflächen zweier substrate
CH698828B1 (de) Drahtklammer für einen Wire Bonder.
DE4307080C2 (de) Verfahren und Vorrichtung zur Herstellung einer Spulenanordnung mit mindestens einem elektronischen Bauelement (IC), wobei eine Bildverarbeitungseinrichtung zur Bauelementpositionierung zum Einsatz kommen kann
CH697200A5 (de) Klemmvorrichtung und Transportvorrichtung zum Transportieren von Substraten.
DE2343365A1 (de) Elektroschweissgeraet
DE2058603A1 (de) Vorrichtung zum Fadenansetzen in einer Offen-End-Spinnvorrichtung
DE2701248C3 (de) Elektromagnetisches Relais
DE4002168C2 (https=)
WO1981003502A1 (fr) Metier a filer
DE19900165A1 (de) Verfahren zur Herstellung einer geformten Drahtverbindung
DE3224012A1 (de) Verfahren zum herstellen eines mehrphasigen thermischen ausloesers sowie ein nach diesem verfahren herstellbarer ausloeser
CH627212A5 (https=)
DE3044375A1 (de) Verfahren und vorrichtung zum verspleissen thermoplastischer garne

Legal Events

Date Code Title Description
8128 New person/name/address of the agent

Representative=s name: HANSMANN, A., DIPL.-WIRTSCH.-ING., PAT.-ANW., 8000

8139 Disposal/non-payment of the annual fee