DE2823360C3 - Vorrichtung zur Überführung von Gegenständen - Google Patents

Vorrichtung zur Überführung von Gegenständen

Info

Publication number
DE2823360C3
DE2823360C3 DE2823360A DE2823360A DE2823360C3 DE 2823360 C3 DE2823360 C3 DE 2823360C3 DE 2823360 A DE2823360 A DE 2823360A DE 2823360 A DE2823360 A DE 2823360A DE 2823360 C3 DE2823360 C3 DE 2823360C3
Authority
DE
Germany
Prior art keywords
head
frame
adjustment
half cycle
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2823360A
Other languages
German (de)
English (en)
Other versions
DE2823360A1 (de
DE2823360B2 (de
Inventor
Georg 8051 Inkofen Fischer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Deutschland GmbH
Original Assignee
Texas Instruments Deutschland GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Deutschland GmbH filed Critical Texas Instruments Deutschland GmbH
Priority to DE2823360A priority Critical patent/DE2823360C3/de
Priority to CH684478A priority patent/CH612612A5/xx
Priority to US05/931,336 priority patent/US4221533A/en
Publication of DE2823360A1 publication Critical patent/DE2823360A1/de
Publication of DE2823360B2 publication Critical patent/DE2823360B2/de
Application granted granted Critical
Publication of DE2823360C3 publication Critical patent/DE2823360C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
DE2823360A 1978-05-29 1978-05-29 Vorrichtung zur Überführung von Gegenständen Expired DE2823360C3 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE2823360A DE2823360C3 (de) 1978-05-29 1978-05-29 Vorrichtung zur Überführung von Gegenständen
CH684478A CH612612A5 (enExample) 1978-05-29 1978-06-22
US05/931,336 US4221533A (en) 1978-05-29 1978-08-07 Apparatus for transferring objects

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2823360A DE2823360C3 (de) 1978-05-29 1978-05-29 Vorrichtung zur Überführung von Gegenständen

Publications (3)

Publication Number Publication Date
DE2823360A1 DE2823360A1 (de) 1979-12-06
DE2823360B2 DE2823360B2 (de) 1980-10-23
DE2823360C3 true DE2823360C3 (de) 1981-06-25

Family

ID=6040432

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2823360A Expired DE2823360C3 (de) 1978-05-29 1978-05-29 Vorrichtung zur Überführung von Gegenständen

Country Status (3)

Country Link
US (1) US4221533A (enExample)
CH (1) CH612612A5 (enExample)
DE (1) DE2823360C3 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2935081C2 (de) * 1979-08-30 1985-12-19 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zur Bestückung von Leiterplatten.
US4364707A (en) * 1980-05-06 1982-12-21 Advanced Semiconductor Materials Die Bonding Inc. Object transport apparatus
NL8201532A (nl) * 1982-04-13 1983-11-01 Philips Nv Werkwijze en inrichting voor het controleren van de aanwezigheid respectievelijk afwezigheid van een voorwerp op het uiteinde van een vacuuem-opnemer.
US4498833A (en) * 1982-05-24 1985-02-12 Varian Associates, Inc. Wafer orientation system
US4520834A (en) * 1983-11-08 1985-06-04 Dicicco Paolo S Apparatus for processing articles in a series of process solution containers
US4557663A (en) * 1984-01-09 1985-12-10 Westinghouse Electric Corp. Modular, low cost, pogrammable assembly system
US4604910A (en) * 1984-02-22 1986-08-12 Kla Instruments Corporation Apparatus for accurately positioning an object at each of two locations
US4627787A (en) * 1984-03-22 1986-12-09 Thomson Components-Mostek Corporation Chip selection in automatic assembly of integrated circuit
FR2563343B1 (fr) * 1984-04-19 1986-06-13 Rhone Poulenc Sante Dispositif pour effectuer des prelevements dans des milieux semi-solides
GB9624927D0 (en) 1996-11-29 1997-01-15 Oxford Glycosciences Uk Ltd Gels and their use
US6554991B1 (en) 1997-06-24 2003-04-29 Large Scale Proteomics Corporation Automated system for two-dimensional electrophoresis
US5993627A (en) 1997-06-24 1999-11-30 Large Scale Biology Corporation Automated system for two-dimensional electrophoresis
EP0923111B1 (de) * 1997-12-07 2007-05-02 Oerlikon Assembly Equipment AG, Steinhausen Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer
GB9811656D0 (en) 1998-05-29 1998-07-29 Oxford Glycosciences Uk Ltd Gels, methods and apparatus for identification and characterization of biomolecules
US6727970B2 (en) 2001-06-25 2004-04-27 Avery Dennison Corporation Method of making a hybrid display device having a rigid substrate and a flexible substrate
US6856086B2 (en) * 2001-06-25 2005-02-15 Avery Dennison Corporation Hybrid display device
US6811815B2 (en) 2002-06-14 2004-11-02 Avery Dennison Corporation Method for roll-to-roll deposition of optically transparent and high conductivity metallic thin films
US7101141B2 (en) * 2003-03-31 2006-09-05 Intel Corporation System for handling microelectronic dies having a compact die ejector
CN111702543A (zh) * 2020-07-02 2020-09-25 潘家祥 一种用于曲轴滚压机床加工的上下料设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3648143A (en) * 1969-08-25 1972-03-07 Harper Associates Inc Automatic work-repeating mechanism
AT336926B (de) * 1972-12-22 1977-06-10 Siemens Ag Inspektions- und reparatureinrichtung fur dampferzeuger
US4005782A (en) * 1974-03-04 1977-02-01 Engineered Metal Products Company, Inc. Picker
US4146924A (en) * 1975-09-22 1979-03-27 Board Of Regents For Education Of The State Of Rhode Island System for visually determining position in space and/or orientation in space and apparatus employing same
US4119211A (en) * 1976-10-22 1978-10-10 Western Electric Company, Inc. Method and apparatus for transferring articles while re-establishing their orientation

Also Published As

Publication number Publication date
CH612612A5 (enExample) 1979-08-15
DE2823360A1 (de) 1979-12-06
US4221533A (en) 1980-09-09
DE2823360B2 (de) 1980-10-23

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Legal Events

Date Code Title Description
OAP Request for examination filed
OD Request for examination
C3 Grant after two publication steps (3rd publication)