DE69102022T2 - Automatisierte verbindende Speisung für Band. - Google Patents

Automatisierte verbindende Speisung für Band.

Info

Publication number
DE69102022T2
DE69102022T2 DE69102022T DE69102022T DE69102022T2 DE 69102022 T2 DE69102022 T2 DE 69102022T2 DE 69102022 T DE69102022 T DE 69102022T DE 69102022 T DE69102022 T DE 69102022T DE 69102022 T2 DE69102022 T2 DE 69102022T2
Authority
DE
Germany
Prior art keywords
strip
connecting feed
automated
automated connecting
feed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69102022T
Other languages
English (en)
Other versions
DE69102022D1 (de
Inventor
Thomas Mario Cipolla
Raymond Robert Horton
Alphonso Phillip Lanzetta
Michael Jon Palmer
Mark B Ritter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE69102022D1 publication Critical patent/DE69102022D1/de
Application granted granted Critical
Publication of DE69102022T2 publication Critical patent/DE69102022T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1712—Indefinite or running length work
    • Y10T156/1734—Means bringing articles into association with web

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
DE69102022T 1990-06-29 1991-05-24 Automatisierte verbindende Speisung für Band. Expired - Fee Related DE69102022T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/546,496 US5052606A (en) 1990-06-29 1990-06-29 Tape automated bonding feeder

Publications (2)

Publication Number Publication Date
DE69102022D1 DE69102022D1 (de) 1994-06-23
DE69102022T2 true DE69102022T2 (de) 1994-11-17

Family

ID=24180697

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69102022T Expired - Fee Related DE69102022T2 (de) 1990-06-29 1991-05-24 Automatisierte verbindende Speisung für Band.

Country Status (4)

Country Link
US (1) US5052606A (de)
EP (1) EP0463364B1 (de)
JP (1) JPH0732171B2 (de)
DE (1) DE69102022T2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2617356B2 (ja) * 1989-06-07 1997-06-04 株式会社新川 タブテ−プボンディング装置
US5294282A (en) * 1991-04-17 1994-03-15 Herd Manufacturing, Inc. Tape handling apparatus
US5370754A (en) * 1991-06-27 1994-12-06 Pfizer Inc. Automatic motorless label applying system
JP2952365B2 (ja) * 1991-07-15 1999-09-27 株式会社新川 テープ搬送装置
JP2890334B2 (ja) * 1991-07-15 1999-05-10 株式会社新川 テープ搬送装置
US5238174A (en) * 1991-11-15 1993-08-24 Kulicke And Soffa Investments, Inc. Smart indexing head for universal lead frame work station
EP1251550B1 (de) 1994-04-18 2005-03-30 Micron Technology, Inc. Verfahren und Vorrichtung zum automatischen Positionieren elektronischer Würfel in Bauteilverpackungen
US5941674A (en) * 1996-06-12 1999-08-24 Tempo G Interchangeable electronic carrier tape feeder adaptable to various surface mount assembly machines
DE19826538A1 (de) * 1998-06-15 1999-12-16 Bayerische Motoren Werke Ag Klappbares Fahrrad
MY127433A (en) * 2001-05-29 2006-12-29 Integrated Device Tech Die bonding apparatus with automatic die and lead frame image matching system.
CN100438743C (zh) * 2001-10-16 2008-11-26 松下电器产业株式会社 运送带送带器和电子部件安装装置及电子部件输送方法
JP2008142875A (ja) * 2006-12-13 2008-06-26 Hitachi Cable Ltd 個片切断用金型および半導体装置の製造方法
WO2015019456A1 (ja) * 2013-08-07 2015-02-12 富士機械製造株式会社 リード位置検出装置及び部品挿入機

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1236375A (en) * 1967-07-19 1971-06-23 Eastman Kodak Co Film advancing mechanism
US3753522A (en) * 1971-02-19 1973-08-21 Red Bud Ind Inc Sheet transferring device and method
US3937388A (en) * 1971-09-15 1976-02-10 The Johns Hopkins University Method for sealing packages
US3791567A (en) * 1971-12-17 1974-02-12 Gloucester Eng Co Inc Web gripping, advancing apparatus
US3735907A (en) * 1972-01-20 1973-05-29 Whitney Corp W Machine for intermittently feeding elongated articles
US3998370A (en) * 1975-09-15 1976-12-21 Micro Forms, Inc. Feed apparatus
US4095733A (en) * 1977-05-25 1978-06-20 Scribner Albert W Stock feeder for punch presses
US4194673A (en) * 1977-11-09 1980-03-25 Union Carbide Corporation Stress relieving of metal/ceramic abradable seals
DE2851475A1 (de) * 1978-11-28 1980-06-04 Heinz Finzer Kg Maschinenfabri Vorschubeinrichtung fuer den materialeinzug an metallbearbeitungsmaschinen
DE2851746C2 (de) * 1978-11-30 1983-12-08 Kurt Stoll Kg, 7311 Neidlingen Bandvorschubgerät
US4218004A (en) * 1978-12-21 1980-08-19 American Can Company Incremental strip feeder
US4513899A (en) * 1982-08-10 1985-04-30 Plessey Incorporated Stock feeder with adjustable width feed path
US4580710A (en) * 1982-08-10 1986-04-08 Plessey Incorporated Stock feeder with hydraulic shock absorber
US4493447A (en) * 1983-05-11 1985-01-15 Plessey Incorporated High speed article feeding apparatus
US4619390A (en) * 1984-04-26 1986-10-28 Scribner Albert W Pneumatic feeder for punch presses
US4851902A (en) * 1986-10-29 1989-07-25 Electroplating Engineers Of Japan, Limited Auatomatic inspection system for IC lead frames and visual inspection method thereof
US4765531A (en) * 1987-05-14 1988-08-23 Kulicke And Soffa Industries Inc. Quick change work station apparatus for automatic wire bonders
US4926677A (en) * 1987-12-03 1990-05-22 Kurt Waldner Die apparatus
US4875614A (en) * 1988-10-31 1989-10-24 International Business Machines Corporation Alignment device

Also Published As

Publication number Publication date
JPH0732171B2 (ja) 1995-04-10
DE69102022D1 (de) 1994-06-23
JPH04233246A (ja) 1992-08-21
EP0463364B1 (de) 1994-05-18
EP0463364A1 (de) 1992-01-02
US5052606A (en) 1991-10-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee