CH612612A5 - - Google Patents

Info

Publication number
CH612612A5
CH612612A5 CH684478A CH684478A CH612612A5 CH 612612 A5 CH612612 A5 CH 612612A5 CH 684478 A CH684478 A CH 684478A CH 684478 A CH684478 A CH 684478A CH 612612 A5 CH612612 A5 CH 612612A5
Authority
CH
Switzerland
Application number
CH684478A
Inventor
Richard Heim
Georg Fischer
Original Assignee
Texas Instruments Deutschland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Deutschland filed Critical Texas Instruments Deutschland
Publication of CH612612A5 publication Critical patent/CH612612A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01038—Strontium [Sr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
CH684478A 1978-05-29 1978-06-22 CH612612A5 (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2823360A DE2823360C3 (de) 1978-05-29 1978-05-29 Vorrichtung zur Überführung von Gegenständen

Publications (1)

Publication Number Publication Date
CH612612A5 true CH612612A5 (xx) 1979-08-15

Family

ID=6040432

Family Applications (1)

Application Number Title Priority Date Filing Date
CH684478A CH612612A5 (xx) 1978-05-29 1978-06-22

Country Status (3)

Country Link
US (1) US4221533A (xx)
CH (1) CH612612A5 (xx)
DE (1) DE2823360C3 (xx)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0177561A1 (en) * 1984-03-22 1986-04-16 Mostek Corp CHIP SELECTION IN THE AUTOMATIC MOUNTING OF AN INTEGRATED CIRCUIT.
CN111702543A (zh) * 2020-07-02 2020-09-25 潘家祥 一种用于曲轴滚压机床加工的上下料设备

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2935081C2 (de) * 1979-08-30 1985-12-19 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zur Bestückung von Leiterplatten.
US4364707A (en) * 1980-05-06 1982-12-21 Advanced Semiconductor Materials Die Bonding Inc. Object transport apparatus
NL8201532A (nl) * 1982-04-13 1983-11-01 Philips Nv Werkwijze en inrichting voor het controleren van de aanwezigheid respectievelijk afwezigheid van een voorwerp op het uiteinde van een vacuuem-opnemer.
US4498833A (en) * 1982-05-24 1985-02-12 Varian Associates, Inc. Wafer orientation system
US4520834A (en) * 1983-11-08 1985-06-04 Dicicco Paolo S Apparatus for processing articles in a series of process solution containers
US4557663A (en) * 1984-01-09 1985-12-10 Westinghouse Electric Corp. Modular, low cost, pogrammable assembly system
US4604910A (en) * 1984-02-22 1986-08-12 Kla Instruments Corporation Apparatus for accurately positioning an object at each of two locations
FR2563343B1 (fr) * 1984-04-19 1986-06-13 Rhone Poulenc Sante Dispositif pour effectuer des prelevements dans des milieux semi-solides
GB9624927D0 (en) 1996-11-29 1997-01-15 Oxford Glycosciences Uk Ltd Gels and their use
US5993627A (en) 1997-06-24 1999-11-30 Large Scale Biology Corporation Automated system for two-dimensional electrophoresis
US6554991B1 (en) 1997-06-24 2003-04-29 Large Scale Proteomics Corporation Automated system for two-dimensional electrophoresis
EP0923111B1 (de) * 1997-12-07 2007-05-02 Oerlikon Assembly Equipment AG, Steinhausen Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer
GB9811656D0 (en) 1998-05-29 1998-07-29 Oxford Glycosciences Uk Ltd Gels, methods and apparatus for identification and characterization of biomolecules
US6727970B2 (en) 2001-06-25 2004-04-27 Avery Dennison Corporation Method of making a hybrid display device having a rigid substrate and a flexible substrate
US6856086B2 (en) * 2001-06-25 2005-02-15 Avery Dennison Corporation Hybrid display device
US6811815B2 (en) 2002-06-14 2004-11-02 Avery Dennison Corporation Method for roll-to-roll deposition of optically transparent and high conductivity metallic thin films
US7101141B2 (en) * 2003-03-31 2006-09-05 Intel Corporation System for handling microelectronic dies having a compact die ejector

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3648143A (en) * 1969-08-25 1972-03-07 Harper Associates Inc Automatic work-repeating mechanism
AT336926B (de) * 1972-12-22 1977-06-10 Siemens Ag Inspektions- und reparatureinrichtung fur dampferzeuger
US4005782A (en) * 1974-03-04 1977-02-01 Engineered Metal Products Company, Inc. Picker
US4146924A (en) * 1975-09-22 1979-03-27 Board Of Regents For Education Of The State Of Rhode Island System for visually determining position in space and/or orientation in space and apparatus employing same
US4119211A (en) * 1976-10-22 1978-10-10 Western Electric Company, Inc. Method and apparatus for transferring articles while re-establishing their orientation

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0177561A1 (en) * 1984-03-22 1986-04-16 Mostek Corp CHIP SELECTION IN THE AUTOMATIC MOUNTING OF AN INTEGRATED CIRCUIT.
EP0177561A4 (en) * 1984-03-22 1989-03-22 Mostek Corp CHIP SELECTION WITH AUTOMATIC ASSEMBLY OF INTEGRATED CIRCUIT.
CN111702543A (zh) * 2020-07-02 2020-09-25 潘家祥 一种用于曲轴滚压机床加工的上下料设备

Also Published As

Publication number Publication date
DE2823360C3 (de) 1981-06-25
US4221533A (en) 1980-09-09
DE2823360B2 (de) 1980-10-23
DE2823360A1 (de) 1979-12-06

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Legal Events

Date Code Title Description
PL Patent ceased