DE2804956A1 - Halbleiteranordnung und verfahren zum umhuellen der halbleiteranordnung - Google Patents
Halbleiteranordnung und verfahren zum umhuellen der halbleiteranordnungInfo
- Publication number
- DE2804956A1 DE2804956A1 DE19782804956 DE2804956A DE2804956A1 DE 2804956 A1 DE2804956 A1 DE 2804956A1 DE 19782804956 DE19782804956 DE 19782804956 DE 2804956 A DE2804956 A DE 2804956A DE 2804956 A1 DE2804956 A1 DE 2804956A1
- Authority
- DE
- Germany
- Prior art keywords
- die
- semiconductor
- semiconductor arrangement
- encapsulation
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000004065 semiconductor Substances 0.000 title claims description 53
- 238000000034 method Methods 0.000 title claims description 10
- 238000005538 encapsulation Methods 0.000 claims description 20
- 239000004033 plastic Substances 0.000 claims description 17
- 239000012815 thermoplastic material Substances 0.000 claims description 16
- 239000004088 foaming agent Substances 0.000 claims description 14
- 229920001169 thermoplastic Polymers 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 12
- 230000007613 environmental effect Effects 0.000 claims description 9
- 238000001746 injection moulding Methods 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 239000004952 Polyamide Substances 0.000 claims description 4
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000006260 foam Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 229910000010 zinc carbonate Inorganic materials 0.000 claims description 4
- 235000004416 zinc carbonate Nutrition 0.000 claims description 4
- 239000011667 zinc carbonate Substances 0.000 claims description 4
- 239000004156 Azodicarbonamide Substances 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 claims description 3
- 235000019399 azodicarbonamide Nutrition 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 239000012141 concentrate Substances 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 description 15
- 239000004416 thermosoftening plastic Substances 0.000 description 10
- 238000003825 pressing Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 238000002156 mixing Methods 0.000 description 5
- 230000002349 favourable effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 206010013647 Drowning Diseases 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000006223 plastic coating Substances 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/03—Injection moulding apparatus
- B29C45/04—Injection moulding apparatus using movable moulds or mould halves
- B29C45/0408—Injection moulding apparatus using movable moulds or mould halves involving at least a linear movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
- C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
- C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/03—Injection moulding apparatus
- B29C45/04—Injection moulding apparatus using movable moulds or mould halves
- B29C2045/0475—Injection moulding apparatus using movable moulds or mould halves continuously movable moulds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
- C08J2381/04—Polysulfides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Molding Of Porous Articles (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7701283A NL7701283A (nl) | 1977-02-08 | 1977-02-08 | Werkwijze voor het vervaardigen van geheel of ge- deeltelijk uit geschuimd thermoplastisch materiaal bestaande voorwerpen, voorwerpen vervaardigd volgens die werkwijze en inrichting voor het uitvoeren van de werkwijze. |
| NL7701284A NL7701284A (en) | 1977-02-08 | 1977-02-08 | Encapsulating transistors using epoxide! fluidised bed - producing inner protection which is encapsulated using injected foam thermoplastic inside mould (BE 7.8.78) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2804956A1 true DE2804956A1 (de) | 1978-08-10 |
Family
ID=26645284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19782804956 Ceased DE2804956A1 (de) | 1977-02-08 | 1978-02-06 | Halbleiteranordnung und verfahren zum umhuellen der halbleiteranordnung |
Country Status (12)
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2930760A1 (de) * | 1979-07-28 | 1981-02-12 | Itt Ind Gmbh Deutsche | Verfahren zum umhuellen von halbleiterbauelementen mittels spritzgiessens |
| DE3019239A1 (de) * | 1980-05-20 | 1981-11-26 | SIEMENS AG AAAAA, 1000 Berlin und 8000 München | Umhuellung fuer halbleiterbauelement |
| DE4331518A1 (de) * | 1992-09-17 | 1994-03-24 | Mitsubishi Electric Corp | Dünne plattenförmige Halbleitervorrichtung und Herstellungsverfahren hierfür |
| US6126428A (en) * | 1994-12-29 | 2000-10-03 | Tessera, Inc. | Vacuum dispense apparatus for dispensing an encapsulant |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4460537A (en) * | 1982-07-26 | 1984-07-17 | Motorola, Inc. | Slot transfer molding apparatus and methods |
| JPS63112923U (US07922777-20110412-C00004.png) * | 1987-01-16 | 1988-07-20 | ||
| DE3922038A1 (de) * | 1989-07-05 | 1991-01-17 | Bayer Ag | Verwendung von polyarylensulfiden zur herstellung eines hochtemperaturbestaendigen tsg schaumes, verfahren zur herstellung dieses schaumes sowie damit erhaeltliche formkoerper |
-
1978
- 1978-02-03 IT IT19995/78A patent/IT1092425B/it active
- 1978-02-03 BR BR7800732A patent/BR7800732A/pt unknown
- 1978-02-03 GB GB4418/78A patent/GB1594892A/en not_active Expired
- 1978-02-06 AU AU33038/78A patent/AU513092B2/en not_active Expired
- 1978-02-06 JP JP1158278A patent/JPS53112063A/ja active Granted
- 1978-02-06 FR FR7803222A patent/FR2379910A1/fr active Granted
- 1978-02-06 SE SE7801325A patent/SE7801325L/xx unknown
- 1978-02-06 ES ES466679A patent/ES466679A1/es not_active Expired
- 1978-02-06 AR AR270981A patent/AR214553A1/es active
- 1978-02-06 DE DE19782804956 patent/DE2804956A1/de not_active Ceased
- 1978-02-08 AT AT0087478A patent/ATA87478A/de not_active IP Right Cessation
- 1978-02-08 CA CA296,495A patent/CA1093704A/en not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2930760A1 (de) * | 1979-07-28 | 1981-02-12 | Itt Ind Gmbh Deutsche | Verfahren zum umhuellen von halbleiterbauelementen mittels spritzgiessens |
| DE3019239A1 (de) * | 1980-05-20 | 1981-11-26 | SIEMENS AG AAAAA, 1000 Berlin und 8000 München | Umhuellung fuer halbleiterbauelement |
| DE4331518A1 (de) * | 1992-09-17 | 1994-03-24 | Mitsubishi Electric Corp | Dünne plattenförmige Halbleitervorrichtung und Herstellungsverfahren hierfür |
| US5520863A (en) * | 1992-09-17 | 1996-05-28 | Mitsubishi Denki Kabushiki Kaisha | Method of making IC card |
| US6126428A (en) * | 1994-12-29 | 2000-10-03 | Tessera, Inc. | Vacuum dispense apparatus for dispensing an encapsulant |
Also Published As
| Publication number | Publication date |
|---|---|
| AU3303878A (en) | 1979-08-16 |
| JPS5722420B2 (US07922777-20110412-C00004.png) | 1982-05-13 |
| IT1092425B (it) | 1985-07-12 |
| ES466679A1 (es) | 1979-07-01 |
| BR7800732A (pt) | 1978-10-10 |
| GB1594892A (en) | 1981-08-05 |
| AR214553A1 (es) | 1979-06-29 |
| AU513092B2 (en) | 1980-11-13 |
| SE7801325L (sv) | 1978-08-09 |
| JPS53112063A (en) | 1978-09-30 |
| CA1093704A (en) | 1981-01-13 |
| ATA87478A (de) | 1982-07-15 |
| FR2379910A1 (fr) | 1978-09-01 |
| FR2379910B1 (US07922777-20110412-C00004.png) | 1984-05-04 |
| IT7819995A0 (it) | 1978-02-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| 8131 | Rejection |