DE2700466C2 - Verfahren zum Befestigen eines Schweißringes an einem Sockel zur Halterung von Halbleiterelementen - Google Patents
Verfahren zum Befestigen eines Schweißringes an einem Sockel zur Halterung von HalbleiterelementenInfo
- Publication number
- DE2700466C2 DE2700466C2 DE2700466A DE2700466A DE2700466C2 DE 2700466 C2 DE2700466 C2 DE 2700466C2 DE 2700466 A DE2700466 A DE 2700466A DE 2700466 A DE2700466 A DE 2700466A DE 2700466 C2 DE2700466 C2 DE 2700466C2
- Authority
- DE
- Germany
- Prior art keywords
- base
- welding ring
- holder
- temperature
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003466 welding Methods 0.000 title claims description 66
- 238000000034 method Methods 0.000 title claims description 29
- 239000004065 semiconductor Substances 0.000 title claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 15
- 229910002804 graphite Inorganic materials 0.000 claims description 15
- 239000010439 graphite Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000000284 resting effect Effects 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB597/76A GB1525431A (en) | 1976-01-08 | 1976-01-08 | Method of making semi-conductor mounts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE2700466A1 DE2700466A1 (de) | 1977-08-18 |
| DE2700466C2 true DE2700466C2 (de) | 1984-10-11 |
Family
ID=9707184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2700466A Expired DE2700466C2 (de) | 1976-01-08 | 1977-01-07 | Verfahren zum Befestigen eines Schweißringes an einem Sockel zur Halterung von Halbleiterelementen |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4072817A (enExample) |
| JP (1) | JPS5286066A (enExample) |
| DE (1) | DE2700466C2 (enExample) |
| FR (1) | FR2337943A1 (enExample) |
| GB (1) | GB1525431A (enExample) |
| IT (1) | IT1126706B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE438108B (sv) * | 1978-01-25 | 1985-04-01 | Hitachi Ltd | Metod att producera en magnetronanod |
| JPS54146959A (en) * | 1978-05-10 | 1979-11-16 | Hitachi Ltd | Production of semiconductor support electrode |
| CN102699601B (zh) * | 2012-06-16 | 2014-11-12 | 中国振华集团永光电子有限公司 | 二极管多管芯组装自对准模具及其使用方法 |
| US9953820B2 (en) * | 2012-09-21 | 2018-04-24 | Smiths Detection-Watford Limited | Sample collection thermal desorber |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1181741A (en) * | 1912-03-20 | 1916-05-02 | Gen Electric | Method of joining metals. |
| US1469043A (en) * | 1921-05-02 | 1923-09-25 | Independent Contact Mfg Co | Process for making electrical contacts |
| US2199240A (en) * | 1935-02-06 | 1940-04-30 | Mallory & Co Inc P R | Silver faced contact |
| US2049771A (en) * | 1935-02-06 | 1936-08-04 | Mallory & Co Inc P R | Method of making silver contacts |
| US3089067A (en) * | 1957-09-30 | 1963-05-07 | Gen Motors Corp | Semiconductor device |
| DE1250005B (enExample) * | 1961-02-06 | 1967-09-14 | ||
| US3197843A (en) * | 1961-05-19 | 1965-08-03 | Nippert Electric Products Comp | Method of forming a mount for semiconductors |
| US3197857A (en) * | 1962-12-21 | 1965-08-03 | Nippert Electric Products Comp | Method of producing cup-shaped conductive semi-conductor housing |
| NL129350C (enExample) * | 1962-12-26 | |||
| US3893226A (en) * | 1970-03-06 | 1975-07-08 | Gkn Floform Ltd | Method of making semi-conductor mounts |
| GB1352317A (en) * | 1970-03-06 | 1974-05-08 | Gkn Floform Ltd | Method of making semi-conductor mounts |
-
1976
- 1976-01-08 GB GB597/76A patent/GB1525431A/en not_active Expired
- 1976-12-20 US US05/752,290 patent/US4072817A/en not_active Expired - Lifetime
- 1976-12-31 FR FR7639792A patent/FR2337943A1/fr active Granted
-
1977
- 1977-01-07 DE DE2700466A patent/DE2700466C2/de not_active Expired
- 1977-01-07 JP JP45477A patent/JPS5286066A/ja active Granted
- 1977-01-07 IT IT47558/77A patent/IT1126706B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5755295B2 (enExample) | 1982-11-24 |
| DE2700466A1 (de) | 1977-08-18 |
| US4072817A (en) | 1978-02-07 |
| IT1126706B (it) | 1986-05-21 |
| FR2337943B1 (enExample) | 1983-10-28 |
| GB1525431A (en) | 1978-09-20 |
| FR2337943A1 (fr) | 1977-08-05 |
| JPS5286066A (en) | 1977-07-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OD | Request for examination | ||
| 8128 | New person/name/address of the agent |
Representative=s name: HACKER, H., RECHTSANW., 5200 SIEGBURG |
|
| 8127 | New person/name/address of the applicant |
Owner name: FLOFORM LTD., WELSHPOOL, MONTGOMERY, WALES, GB |
|
| 8128 | New person/name/address of the agent |
Representative=s name: MEINKE, J., DIPL.-ING. DABRINGHAUS, W., DIPL.-ING. |
|
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |