JPS5755295B2 - - Google Patents
Info
- Publication number
- JPS5755295B2 JPS5755295B2 JP52000454A JP45477A JPS5755295B2 JP S5755295 B2 JPS5755295 B2 JP S5755295B2 JP 52000454 A JP52000454 A JP 52000454A JP 45477 A JP45477 A JP 45477A JP S5755295 B2 JPS5755295 B2 JP S5755295B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB597/76A GB1525431A (en) | 1976-01-08 | 1976-01-08 | Method of making semi-conductor mounts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5286066A JPS5286066A (en) | 1977-07-16 |
| JPS5755295B2 true JPS5755295B2 (enExample) | 1982-11-24 |
Family
ID=9707184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP45477A Granted JPS5286066A (en) | 1976-01-08 | 1977-01-07 | Method of manufacturing semiconductor mount |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4072817A (enExample) |
| JP (1) | JPS5286066A (enExample) |
| DE (1) | DE2700466C2 (enExample) |
| FR (1) | FR2337943A1 (enExample) |
| GB (1) | GB1525431A (enExample) |
| IT (1) | IT1126706B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE438108B (sv) * | 1978-01-25 | 1985-04-01 | Hitachi Ltd | Metod att producera en magnetronanod |
| JPS54146959A (en) * | 1978-05-10 | 1979-11-16 | Hitachi Ltd | Production of semiconductor support electrode |
| CN102699601B (zh) * | 2012-06-16 | 2014-11-12 | 中国振华集团永光电子有限公司 | 二极管多管芯组装自对准模具及其使用方法 |
| JP6270851B2 (ja) * | 2012-09-21 | 2018-01-31 | スミスズ ディテクション−ワトフォード リミテッド | 試料採取熱脱離装置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1181741A (en) * | 1912-03-20 | 1916-05-02 | Gen Electric | Method of joining metals. |
| US1469043A (en) * | 1921-05-02 | 1923-09-25 | Independent Contact Mfg Co | Process for making electrical contacts |
| US2199240A (en) * | 1935-02-06 | 1940-04-30 | Mallory & Co Inc P R | Silver faced contact |
| US2049771A (en) * | 1935-02-06 | 1936-08-04 | Mallory & Co Inc P R | Method of making silver contacts |
| US3089067A (en) * | 1957-09-30 | 1963-05-07 | Gen Motors Corp | Semiconductor device |
| DE1250005B (enExample) * | 1961-02-06 | 1967-09-14 | ||
| US3197843A (en) * | 1961-05-19 | 1965-08-03 | Nippert Electric Products Comp | Method of forming a mount for semiconductors |
| US3197857A (en) * | 1962-12-21 | 1965-08-03 | Nippert Electric Products Comp | Method of producing cup-shaped conductive semi-conductor housing |
| NL295109A (enExample) * | 1962-12-26 | |||
| GB1352317A (en) * | 1970-03-06 | 1974-05-08 | Gkn Floform Ltd | Method of making semi-conductor mounts |
| US3893226A (en) * | 1970-03-06 | 1975-07-08 | Gkn Floform Ltd | Method of making semi-conductor mounts |
-
1976
- 1976-01-08 GB GB597/76A patent/GB1525431A/en not_active Expired
- 1976-12-20 US US05/752,290 patent/US4072817A/en not_active Expired - Lifetime
- 1976-12-31 FR FR7639792A patent/FR2337943A1/fr active Granted
-
1977
- 1977-01-07 DE DE2700466A patent/DE2700466C2/de not_active Expired
- 1977-01-07 IT IT47558/77A patent/IT1126706B/it active
- 1977-01-07 JP JP45477A patent/JPS5286066A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| DE2700466C2 (de) | 1984-10-11 |
| GB1525431A (en) | 1978-09-20 |
| FR2337943A1 (fr) | 1977-08-05 |
| US4072817A (en) | 1978-02-07 |
| IT1126706B (it) | 1986-05-21 |
| JPS5286066A (en) | 1977-07-16 |
| FR2337943B1 (enExample) | 1983-10-28 |
| DE2700466A1 (de) | 1977-08-18 |