DE2645947C2 - Verfahren zur Herstellung einer gedruckten Schaltung - Google Patents
Verfahren zur Herstellung einer gedruckten SchaltungInfo
- Publication number
- DE2645947C2 DE2645947C2 DE2645947A DE2645947A DE2645947C2 DE 2645947 C2 DE2645947 C2 DE 2645947C2 DE 2645947 A DE2645947 A DE 2645947A DE 2645947 A DE2645947 A DE 2645947A DE 2645947 C2 DE2645947 C2 DE 2645947C2
- Authority
- DE
- Germany
- Prior art keywords
- holes
- carrier material
- layer
- exposed
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB43289/75A GB1497312A (en) | 1975-10-22 | 1975-10-22 | Production of printed circuit arrangements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE2645947A1 DE2645947A1 (de) | 1977-04-28 |
| DE2645947C2 true DE2645947C2 (de) | 1983-01-27 |
Family
ID=10428105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2645947A Expired DE2645947C2 (de) | 1975-10-22 | 1976-10-12 | Verfahren zur Herstellung einer gedruckten Schaltung |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5271681A (ref) |
| AU (1) | AU498261B2 (ref) |
| DE (1) | DE2645947C2 (ref) |
| GB (1) | GB1497312A (ref) |
| ZA (1) | ZA765930B (ref) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2988576B1 (de) * | 2014-08-20 | 2022-04-13 | Automotive Lighting Reutlingen GmbH | Anordnung aufweisend eine leiterplatte für kraftfahrzeugbeleuchtungseinrichtungen |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4501638A (en) * | 1983-12-05 | 1985-02-26 | E. I. Du Pont De Nemours And Company | Liquid chemical process for forming conductive through-holes through a dielectric layer |
| US4472238A (en) * | 1983-12-05 | 1984-09-18 | E. I. Du Pont De Nemours And Company | Process using plasma for forming conductive through-holes through a dielectric layer |
| US4517050A (en) * | 1983-12-05 | 1985-05-14 | E. I. Du Pont De Nemours And Company | Process for forming conductive through-holes through a dielectric layer |
| RU2138140C1 (ru) * | 1998-11-30 | 1999-09-20 | Самарцев Николай Борисович | Способ изготовления гибридных интегральных схем и печатных плат на полимерной подложке |
| CN112235951B (zh) * | 2020-10-20 | 2021-09-21 | 盐城维信电子有限公司 | 一种不同铜厚的线路板制作方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3319317A (en) * | 1963-12-23 | 1967-05-16 | Ibm | Method of making a multilayered laminated circuit board |
| US3268653A (en) * | 1964-04-29 | 1966-08-23 | Ibm | Printed circuit board with solder resistant coating in the through-hole connectors |
| US3471631A (en) * | 1968-04-03 | 1969-10-07 | Us Air Force | Fabrication of microminiature multilayer circuit boards |
| US3871930A (en) * | 1973-12-19 | 1975-03-18 | Texas Instruments Inc | Method of etching films made of polyimide based polymers |
-
1975
- 1975-10-22 GB GB43289/75A patent/GB1497312A/en not_active Expired
-
1976
- 1976-10-04 ZA ZA765930A patent/ZA765930B/xx unknown
- 1976-10-12 DE DE2645947A patent/DE2645947C2/de not_active Expired
- 1976-10-13 AU AU18624/76A patent/AU498261B2/en not_active Expired
- 1976-10-21 JP JP51125546A patent/JPS5271681A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2988576B1 (de) * | 2014-08-20 | 2022-04-13 | Automotive Lighting Reutlingen GmbH | Anordnung aufweisend eine leiterplatte für kraftfahrzeugbeleuchtungseinrichtungen |
Also Published As
| Publication number | Publication date |
|---|---|
| AU1862476A (en) | 1978-04-20 |
| ZA765930B (en) | 1977-09-28 |
| JPS5731667B2 (ref) | 1982-07-06 |
| GB1497312A (en) | 1978-01-05 |
| JPS5271681A (en) | 1977-06-15 |
| AU498261B2 (en) | 1979-02-22 |
| DE2645947A1 (de) | 1977-04-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69111890T2 (de) | Verfahren zur Herstellung einer Mehrschichtleiterplatte. | |
| DE69728234T2 (de) | Verfahren zur herstellung von erhöhten metallischen kontakten auf elektrischen schaltungen | |
| DE2810054C2 (de) | Elektronische Schaltungsanordnung und Verfahren zu deren Herstellung | |
| DE69937153T2 (de) | Gedruckte leiterplatte und verfahren zu deren herstellung | |
| DE69111004T2 (de) | Durch Elektroformung hergestellte dreidimensionale Schaltung. | |
| DE1271235B (de) | Verfahren zur Herstellung von leitenden Verbindungen zwischen den leitenden Schichten einer elektrischen Schaltungsplatte | |
| DE69030867T2 (de) | Verfahren zur Herstellung einer anisotrop leitenden Folie | |
| DE69012444T2 (de) | Excimer-induzierte flexible Zusammenschaltungsstruktur. | |
| DE2125511A1 (de) | Verfahren zur Herstellung von elektrischen Verbindungen mit zumindest einer öffnung einer Trägerschicht sowie mit diesen Verbindungen versehene Schaltungsplatte | |
| DE2144137A1 (de) | Verfahren zum Herstellen der Löcher für die Verbindungen zwischen elektrischen, parallel übereinander liegenden Schaltungslagen einer Mehrlagen-Schaltungspackung | |
| DE2017613B2 (de) | Verfahren zum Herstellen von Koaxial-Schal tungsanordnungen | |
| DE2650761A1 (de) | Metallmaske zur verwendung beim siebdruck | |
| DE2926335A1 (de) | Verfahren zur herstellung gedruckter schaltungen | |
| DE69620273T2 (de) | Verfahren zur Herstellung von Abstandshaltern auf einer elektrischen Leiterplatte | |
| DE3502744C2 (ref) | ||
| DE1817434B2 (de) | Verfahren zur Herstellung einer elektrischen Leitungsanordnung | |
| DE3013667C2 (de) | Leiterplatte und Verfahren zu deren Herstellung | |
| DE69730291T2 (de) | Verfahren zum ausbilden einer bezugsmarkierung in einer harzschablone und die dabei hergestellte schablone | |
| DE1085209B (de) | Gedruckte elektrische Leiterplatte | |
| DE69207996T2 (de) | Semi-additive elektrische Schaltungen mit erhöhten Einzelheiten unter Verwendung geformter Matrizen | |
| DE4406397A1 (de) | Substrat für elektrische Schaltkreise sowie Verfahren zum Herstellen des Substrates | |
| DE3121131C2 (de) | Verfahren zur Herstellung von mit Leiterbahnen versehenen Schaltungsplatten mit metallischen Durchkontaktierungen | |
| DE69931551T2 (de) | Verfahren zur Herstellung einer mit elektroplattiertem Sackloch versehenen mehrschichtigen Leiterplatte | |
| DE2645947A1 (de) | Verfahren zur herstellung gedruckter schaltungen | |
| DE2014138C3 (de) | Verfahren zur Herstellung von gedruckten Leiterplatten |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OD | Request for examination | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |