DE2619869A1 - Verfahren zum herstellen einer anschlusselektrode und nach diesem verfahren hergestellte kontaktanordnung - Google Patents

Verfahren zum herstellen einer anschlusselektrode und nach diesem verfahren hergestellte kontaktanordnung

Info

Publication number
DE2619869A1
DE2619869A1 DE19762619869 DE2619869A DE2619869A1 DE 2619869 A1 DE2619869 A1 DE 2619869A1 DE 19762619869 DE19762619869 DE 19762619869 DE 2619869 A DE2619869 A DE 2619869A DE 2619869 A1 DE2619869 A1 DE 2619869A1
Authority
DE
Germany
Prior art keywords
conductor
contact member
connection
metal
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19762619869
Other languages
German (de)
English (en)
Inventor
Monroe B Goldberg
Wiliam B Voorhis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arris Technology Inc
Original Assignee
Arris Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/642,588 external-priority patent/US4017266A/en
Application filed by Arris Technology Inc filed Critical Arris Technology Inc
Publication of DE2619869A1 publication Critical patent/DE2619869A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
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    • H01L2924/01075—Rhenium [Re]
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    • H01L2924/01082—Lead [Pb]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
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    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13062—Junction field-effect transistor [JFET]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Fuses (AREA)
  • Ceramic Products (AREA)
  • Manufacture Of Switches (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE19762619869 1975-12-19 1976-05-05 Verfahren zum herstellen einer anschlusselektrode und nach diesem verfahren hergestellte kontaktanordnung Ceased DE2619869A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/642,588 US4017266A (en) 1974-04-24 1975-12-19 Process for making a brazed lead electrode, and product thereof

Publications (1)

Publication Number Publication Date
DE2619869A1 true DE2619869A1 (de) 1977-06-30

Family

ID=24577211

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19762619869 Ceased DE2619869A1 (de) 1975-12-19 1976-05-05 Verfahren zum herstellen einer anschlusselektrode und nach diesem verfahren hergestellte kontaktanordnung

Country Status (6)

Country Link
AU (1) AU505174B2 (fr)
CA (1) CA1057421A (fr)
DE (1) DE2619869A1 (fr)
FR (1) FR2335954A2 (fr)
IT (1) IT1069952B (fr)
MX (1) MX3349E (fr)

Also Published As

Publication number Publication date
MX3349E (es) 1980-10-06
FR2335954A2 (fr) 1977-07-15
IT1069952B (it) 1985-03-25
AU1377576A (en) 1977-11-17
CA1057421A (fr) 1979-06-26
AU505174B2 (en) 1979-11-08

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