CA1057421A - Mode de fabrication d'electrode a conducteur brase - Google Patents

Mode de fabrication d'electrode a conducteur brase

Info

Publication number
CA1057421A
CA1057421A CA264,663A CA264663A CA1057421A CA 1057421 A CA1057421 A CA 1057421A CA 264663 A CA264663 A CA 264663A CA 1057421 A CA1057421 A CA 1057421A
Authority
CA
Canada
Prior art keywords
joining
joining surface
brazing alloy
copper
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA264,663A
Other languages
English (en)
Inventor
Monroe B. Goldberg
William B. Voorhis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arris Technology Inc
Original Assignee
General Instrument Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/642,588 external-priority patent/US4017266A/en
Application filed by General Instrument Corp filed Critical General Instrument Corp
Application granted granted Critical
Publication of CA1057421A publication Critical patent/CA1057421A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
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    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13062—Junction field-effect transistor [JFET]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacture Of Switches (AREA)
  • Ceramic Products (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Fuses (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
CA264,663A 1975-12-19 1976-11-02 Mode de fabrication d'electrode a conducteur brase Expired CA1057421A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/642,588 US4017266A (en) 1974-04-24 1975-12-19 Process for making a brazed lead electrode, and product thereof

Publications (1)

Publication Number Publication Date
CA1057421A true CA1057421A (fr) 1979-06-26

Family

ID=24577211

Family Applications (1)

Application Number Title Priority Date Filing Date
CA264,663A Expired CA1057421A (fr) 1975-12-19 1976-11-02 Mode de fabrication d'electrode a conducteur brase

Country Status (6)

Country Link
AU (1) AU505174B2 (fr)
CA (1) CA1057421A (fr)
DE (1) DE2619869A1 (fr)
FR (1) FR2335954A2 (fr)
IT (1) IT1069952B (fr)
MX (1) MX3349E (fr)

Also Published As

Publication number Publication date
MX3349E (es) 1980-10-06
FR2335954A2 (fr) 1977-07-15
DE2619869A1 (de) 1977-06-30
IT1069952B (it) 1985-03-25
AU505174B2 (en) 1979-11-08
AU1377576A (en) 1977-11-17

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