DE2612657A1 - Stiftbefestigung fuer laser - Google Patents
Stiftbefestigung fuer laserInfo
- Publication number
- DE2612657A1 DE2612657A1 DE19762612657 DE2612657A DE2612657A1 DE 2612657 A1 DE2612657 A1 DE 2612657A1 DE 19762612657 DE19762612657 DE 19762612657 DE 2612657 A DE2612657 A DE 2612657A DE 2612657 A1 DE2612657 A1 DE 2612657A1
- Authority
- DE
- Germany
- Prior art keywords
- pin
- base plate
- heat sink
- tab
- light guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 229910000906 Bronze Inorganic materials 0.000 claims description 2
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 claims description 2
- 239000010974 bronze Substances 0.000 claims description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- 239000012777 electrically insulating material Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000010276 construction Methods 0.000 description 11
- 239000004020 conductor Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000005253 cladding Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
- H01S5/02484—Sapphire or diamond heat spreaders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/02365—Fixing laser chips on mounts by clamping
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB13203/75A GB1487010A (en) | 1975-04-01 | 1975-04-01 | Laser stud mounts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2612657A1 true DE2612657A1 (de) | 1976-10-21 |
Family
ID=10018711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19762612657 Withdrawn DE2612657A1 (de) | 1975-04-01 | 1976-03-25 | Stiftbefestigung fuer laser |
Country Status (6)
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2916956A1 (de) * | 1978-04-28 | 1979-10-31 | Hitachi Ltd | Lichtemittierende halbleitervorrichtung |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5818793B2 (ja) * | 1975-08-22 | 1983-04-14 | 富士通株式会社 | ヒカリハンドウタイソシノ パツケ−ジ |
| GB1544241A (en) * | 1976-05-11 | 1979-04-19 | Standard Telephones Cables Ltd | Injection laser mount |
| US4130343A (en) * | 1977-02-22 | 1978-12-19 | Bell Telephone Laboratories, Incorporated | Coupling arrangements between a light-emitting diode and an optical fiber waveguide and between an optical fiber waveguide and a semiconductor optical detector |
| JPS53130993A (en) * | 1977-04-20 | 1978-11-15 | Nec Corp | Semiconductor laser |
| DE2827074A1 (de) * | 1977-06-21 | 1979-01-04 | Canon Kk | Aufzeichnungsgeraet |
| JPS622782Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1977-12-21 | 1987-01-22 | ||
| JPS54134585A (en) * | 1978-03-31 | 1979-10-19 | Int Standard Electric Corp | Injection laser mount |
| US4240098A (en) * | 1978-09-28 | 1980-12-16 | Exxon Research & Engineering Co. | Semiconductor optoelectronic device package |
| US4347655A (en) * | 1978-09-28 | 1982-09-07 | Optical Information Systems, Inc. | Mounting arrangement for semiconductor optoelectronic devices |
| US4393393A (en) * | 1979-08-13 | 1983-07-12 | Mcdonnell Douglas Corporation | Laser diode with double sided heat sink |
| JPS5749287A (en) * | 1980-09-09 | 1982-03-23 | Matsushita Electric Ind Co Ltd | Stem of semiconductor laser |
| JPS58145169A (ja) * | 1982-02-23 | 1983-08-29 | Nec Corp | 光半導体装置 |
| US4761788A (en) * | 1985-10-28 | 1988-08-02 | American Telephone And Telegraph Company | Stripline mount for semiconductor lasers |
| US4937660A (en) * | 1988-12-21 | 1990-06-26 | At&T Bell Laboratories | Silicon-based mounting structure for semiconductor optical devices |
| US5024966A (en) * | 1988-12-21 | 1991-06-18 | At&T Bell Laboratories | Method of forming a silicon-based semiconductor optical device mount |
| DE10064959C2 (de) | 2000-12-20 | 2003-01-02 | Infineon Technologies Ag | Koppelvorrichtung zum Anschluß eines Lichtwellenleiters an eine optische Sende- oder Empfangseinheit |
| US7061949B1 (en) | 2002-08-16 | 2006-06-13 | Jds Uniphase Corporation | Methods, apparatus, and systems with semiconductor laser packaging for high modulation bandwidth |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1127239A (fr) * | 1954-07-07 | 1956-12-11 | Benckiser Gmbh Joh A | Procédé de fabrication de saucisses enveloppées de boyaux naturels minces et tendres |
| US3445786A (en) * | 1965-02-09 | 1969-05-20 | Philco Ford Corp | Cryogenically cooled electro-optical apparatus |
| US3590248A (en) * | 1965-04-13 | 1971-06-29 | Massachusetts Inst Technology | Laser arrays |
| US3585454A (en) * | 1969-04-01 | 1971-06-15 | Westinghouse Electric Corp | Improved case member for a light activated semiconductor device |
| GB1295306A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1969-04-23 | 1972-11-08 | ||
| US3660669A (en) * | 1970-04-15 | 1972-05-02 | Motorola Inc | Optical coupler made by juxtaposition of lead frame mounted sensor and light emitter |
| US3760297A (en) * | 1972-01-20 | 1973-09-18 | Int Standard Electric Corp | Laser to optical fiber coupling |
| JPS4915390A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1972-05-17 | 1974-02-09 | ||
| US3803511A (en) * | 1972-10-18 | 1974-04-09 | Int Standard Electric Corp | Gallium arsenide laser fiber coupling |
| US3932184A (en) * | 1973-05-29 | 1976-01-13 | Bell Telephone Laboratories, Incorporated | Fabrication of microlenses |
| US3840889A (en) * | 1973-07-11 | 1974-10-08 | Rca Corp | Laser diode package formed of ceramic and metal materials having high electrical and thermal conductivity |
| JPS5041559A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1973-08-02 | 1975-04-16 |
-
1975
- 1975-04-01 GB GB13203/75A patent/GB1487010A/en not_active Expired
-
1976
- 1976-03-25 DE DE19762612657 patent/DE2612657A1/de not_active Withdrawn
- 1976-03-25 US US05/670,323 patent/US4097891A/en not_active Expired - Lifetime
- 1976-03-31 CH CH399676A patent/CH593574A5/xx not_active IP Right Cessation
- 1976-04-01 FR FR7609444A patent/FR2306549A1/fr active Granted
- 1976-04-01 JP JP51035222A patent/JPS51126783A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2916956A1 (de) * | 1978-04-28 | 1979-10-31 | Hitachi Ltd | Lichtemittierende halbleitervorrichtung |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51126783A (en) | 1976-11-05 |
| FR2306549B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1982-12-10 |
| FR2306549A1 (fr) | 1976-10-29 |
| JPS5639555B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1981-09-14 |
| US4097891A (en) | 1978-06-27 |
| CH593574A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1977-12-15 |
| GB1487010A (en) | 1977-09-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| 8130 | Withdrawal |