DE2608415C2 - Verfahren zur Beschichtung eines Substrats mit einer Lage polymeren Materials - Google Patents
Verfahren zur Beschichtung eines Substrats mit einer Lage polymeren MaterialsInfo
- Publication number
- DE2608415C2 DE2608415C2 DE2608415A DE2608415A DE2608415C2 DE 2608415 C2 DE2608415 C2 DE 2608415C2 DE 2608415 A DE2608415 A DE 2608415A DE 2608415 A DE2608415 A DE 2608415A DE 2608415 C2 DE2608415 C2 DE 2608415C2
- Authority
- DE
- Germany
- Prior art keywords
- electrode
- substrate
- glow discharge
- deposited
- sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 title claims description 68
- 239000000463 material Substances 0.000 title claims description 54
- 238000000034 method Methods 0.000 title claims description 38
- 238000000576 coating method Methods 0.000 title claims description 18
- 239000011248 coating agent Substances 0.000 title claims description 17
- 230000008569 process Effects 0.000 title description 12
- 239000007789 gas Substances 0.000 claims description 46
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 40
- 238000004544 sputter deposition Methods 0.000 claims description 25
- 239000000126 substance Substances 0.000 claims description 8
- 239000011261 inert gas Substances 0.000 claims description 6
- 239000007772 electrode material Substances 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims description 2
- 238000000151 deposition Methods 0.000 description 31
- 230000008021 deposition Effects 0.000 description 29
- 239000010410 layer Substances 0.000 description 22
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
- 150000002500 ions Chemical class 0.000 description 13
- 230000004907 flux Effects 0.000 description 9
- 238000006116 polymerization reaction Methods 0.000 description 9
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 239000000178 monomer Substances 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000010891 electric arc Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000010849 ion bombardment Methods 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000005477 sputtering target Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- MJXJGDNGBPAIGS-UHFFFAOYSA-N [N].C=Cc1ccccc1 Chemical compound [N].C=Cc1ccccc1 MJXJGDNGBPAIGS-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 210000003608 fece Anatomy 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229920000592 inorganic polymer Polymers 0.000 description 1
- 230000002147 killing effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000013047 polymeric layer Substances 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/62—Plasma-deposition of organic layers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Physical Vapour Deposition (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/554,823 US4013532A (en) | 1975-03-03 | 1975-03-03 | Method for coating a substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE2608415A1 DE2608415A1 (de) | 1976-09-16 |
| DE2608415C2 true DE2608415C2 (de) | 1983-09-01 |
Family
ID=24214842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2608415A Expired DE2608415C2 (de) | 1975-03-03 | 1976-03-01 | Verfahren zur Beschichtung eines Substrats mit einer Lage polymeren Materials |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US4013532A (ref) |
| JP (1) | JPS51112489A (ref) |
| BE (1) | BE839057A (ref) |
| CA (1) | CA1044177A (ref) |
| DE (1) | DE2608415C2 (ref) |
| FR (1) | FR2303091A1 (ref) |
| GB (1) | GB1495480A (ref) |
| IT (1) | IT1055462B (ref) |
| NL (1) | NL176642C (ref) |
Families Citing this family (73)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4210701A (en) * | 1972-08-14 | 1980-07-01 | Precision Thin Film Corporation | Method and apparatus for depositing film on a substrate, and products produced thereby |
| FR2371524A1 (fr) * | 1976-11-18 | 1978-06-16 | Alsthom Atlantique | Procede de depot d'une couche mince par decomposition d'un gaz dans un plasma |
| JPS5391084A (en) * | 1977-01-20 | 1978-08-10 | Gnii Pi Redkometa | Method and apparatus for evaporating source matter to evaporation portion |
| FR2379889A1 (fr) * | 1977-02-08 | 1978-09-01 | Thomson Csf | Dielectrique constitue par un polymere en couche mince, procede de fabrication de ladite couche, et condensateurs electriques comportant un tel dielectrique |
| US4116806A (en) * | 1977-12-08 | 1978-09-26 | Battelle Development Corporation | Two-sided planar magnetron sputtering apparatus |
| US4175030A (en) * | 1977-12-08 | 1979-11-20 | Battelle Development Corporation | Two-sided planar magnetron sputtering apparatus |
| US4226896A (en) * | 1977-12-23 | 1980-10-07 | International Business Machines Corporation | Plasma method for forming a metal containing polymer |
| US4212719A (en) * | 1978-08-18 | 1980-07-15 | The Regents Of The University Of California | Method of plasma initiated polymerization |
| GB2028377B (en) * | 1978-08-21 | 1982-12-08 | Vac Tec Syst | Magnetically-enhanced sputtering device |
| US4194962A (en) * | 1978-12-20 | 1980-03-25 | Advanced Coating Technology, Inc. | Cathode for sputtering |
| US4183797A (en) * | 1978-12-22 | 1980-01-15 | International Business Machines Corporation | Two-sided bias sputter deposition method and apparatus |
| US4269896A (en) * | 1979-08-31 | 1981-05-26 | Hughes Aircraft Company | Surface passivated alkali halide infrared windows |
| US4422915A (en) * | 1979-09-04 | 1983-12-27 | Battelle Memorial Institute | Preparation of colored polymeric film-like coating |
| DE3107914A1 (de) * | 1981-03-02 | 1982-09-16 | Leybold-Heraeus GmbH, 5000 Köln | Verfahren und vorrichtung zum beschichten von formteilen durch katodenzerstaeubung |
| GB2119236A (en) * | 1982-03-26 | 1983-11-16 | Philips Electronic Associated | Magazine and disc holders for supporting discs in the magazine |
| US4415427A (en) * | 1982-09-30 | 1983-11-15 | Gte Products Corporation | Thin film deposition by sputtering |
| US4704339A (en) * | 1982-10-12 | 1987-11-03 | The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland | Infra-red transparent optical components |
| EP0106638A1 (en) * | 1982-10-12 | 1984-04-25 | National Research Development Corporation | Method and apparatus for growing material in a glow discharge |
| US4562091A (en) * | 1982-12-23 | 1985-12-31 | International Business Machines Corporation | Use of plasma polymerized orgaosilicon films in fabrication of lift-off masks |
| US4493855A (en) * | 1982-12-23 | 1985-01-15 | International Business Machines Corporation | Use of plasma polymerized organosilicon films in fabrication of lift-off masks |
| JPS59154643A (ja) * | 1983-02-24 | 1984-09-03 | Fuji Photo Film Co Ltd | 磁気記録媒体 |
| DE3316548C2 (de) * | 1983-03-25 | 1985-01-17 | Flachglas AG, 8510 Fürth | Verfahren zur Beschichtung eines transparenten Substrates |
| US4598022A (en) * | 1983-11-22 | 1986-07-01 | Olin Corporation | One-step plasma treatment of copper foils to increase their laminate adhesion |
| US4526806A (en) * | 1983-11-22 | 1985-07-02 | Olin Corporation | One-step plasma treatment of copper foils to increase their laminate adhesion |
| US4524089A (en) * | 1983-11-22 | 1985-06-18 | Olin Corporation | Three-step plasma treatment of copper foils to enhance their laminate adhesion |
| US4588641A (en) * | 1983-11-22 | 1986-05-13 | Olin Corporation | Three-step plasma treatment of copper foils to enhance their laminate adhesion |
| US4536271A (en) * | 1983-12-29 | 1985-08-20 | Mobil Oil Corporation | Method of plasma treating a polymer film to change its properties |
| US4609445A (en) * | 1983-12-29 | 1986-09-02 | Mobil Oil Corporation | Method of plasma treating a polymer film to change its properties |
| US4622120A (en) * | 1984-01-31 | 1986-11-11 | Ppg Industries, Inc. | Sputtered indium oxide films |
| US4515668A (en) * | 1984-04-25 | 1985-05-07 | Honeywell Inc. | Method of forming a dielectric layer comprising a gettering material |
| US4560577A (en) * | 1984-09-14 | 1985-12-24 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Oxidation protection coatings for polymers |
| US4604181A (en) * | 1984-09-14 | 1986-08-05 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Apparatus for producing oxidation protection coatings for polymers |
| US4618477A (en) * | 1985-01-17 | 1986-10-21 | International Business Machines Corporation | Uniform plasma for drill smear removal reactor |
| JPS61168922A (ja) | 1985-01-17 | 1986-07-30 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | プラズマ・エツチング装置 |
| DE3521318A1 (de) * | 1985-06-14 | 1986-12-18 | Leybold-Heraeus GmbH, 5000 Köln | Verfahren und vorrichtung zum behandeln, insbesondere zum beschichten, von substraten mittels einer plasmaentladung |
| US4816287A (en) * | 1985-08-30 | 1989-03-28 | Optical Materials, Inc. | Optical recording media with thermal insulation and method of making the media |
| JPH068503B2 (ja) * | 1987-03-31 | 1994-02-02 | セントラル硝子株式会社 | 含フツ素樹脂被膜の形成方法 |
| ZA884511B (en) * | 1987-07-15 | 1989-03-29 | Boc Group Inc | Method of plasma enhanced silicon oxide deposition |
| US4915805A (en) * | 1988-11-21 | 1990-04-10 | At&T Bell Laboratories | Hollow cathode type magnetron apparatus construction |
| US5047131A (en) * | 1989-11-08 | 1991-09-10 | The Boc Group, Inc. | Method for coating substrates with silicon based compounds |
| DE69032691T2 (de) * | 1989-12-07 | 1999-06-10 | Japan Science And Technology Corp., Kawaguchi, Saitama | Verfahren und Gerät zur Plasmabehandlung unter atmosphärischem Druck |
| JP2897055B2 (ja) * | 1990-03-14 | 1999-05-31 | 株式会社ブリヂストン | ゴム系複合材料の製造方法 |
| DE4009151A1 (de) * | 1990-03-22 | 1991-09-26 | Leybold Ag | Vorrichtung zum beschichten von substraten durch katodenzerstaeubung |
| US5407548A (en) * | 1990-10-26 | 1995-04-18 | Leybold Aktiengesellschaft | Method for coating a substrate of low resistance to corrosion |
| US5244730A (en) * | 1991-04-30 | 1993-09-14 | International Business Machines Corporation | Plasma deposition of fluorocarbon |
| DE4123274C2 (de) * | 1991-07-13 | 1996-12-19 | Leybold Ag | Vorrichtung zum Beschichten von Bauteilen bzw. Formteilen durch Kathodenzerstäubung |
| JPH07508617A (ja) | 1992-06-26 | 1995-09-21 | マティリアルズ リサーチ コーポレイション | ウエハ処理工程ラインのための輸送装置 |
| US5410425A (en) * | 1993-05-10 | 1995-04-25 | The United States Of America As Represented By The United States Department Of Energy | Magnetron cathodes in plasma electrode pockels cells |
| JP3204801B2 (ja) * | 1993-06-18 | 2001-09-04 | 富士写真フイルム株式会社 | 真空グロー放電処理装置及び処理方法 |
| US5464667A (en) * | 1994-08-16 | 1995-11-07 | Minnesota Mining And Manufacturing Company | Jet plasma process and apparatus |
| US6022595A (en) * | 1996-02-01 | 2000-02-08 | Rensselaer Polytechnic Institute | Increase of deposition rate of vapor deposited polymer by electric field |
| US5993598A (en) * | 1996-07-30 | 1999-11-30 | The Dow Chemical Company | Magnetron |
| US5900284A (en) * | 1996-07-30 | 1999-05-04 | The Dow Chemical Company | Plasma generating device and method |
| US5853894A (en) * | 1997-02-03 | 1998-12-29 | Cytonix Corporation | Laboratory vessel having hydrophobic coating and process for manufacturing same |
| US6495624B1 (en) * | 1997-02-03 | 2002-12-17 | Cytonix Corporation | Hydrophobic coating compositions, articles coated with said compositions, and processes for manufacturing same |
| US7268179B2 (en) * | 1997-02-03 | 2007-09-11 | Cytonix Corporation | Hydrophobic coating compositions, articles coated with said compositions, and processes for manufacturing same |
| US8653213B2 (en) | 1997-02-03 | 2014-02-18 | Cytonix, Llc | Hydrophobic coating compositions and articles coated with said compositions |
| US6156389A (en) | 1997-02-03 | 2000-12-05 | Cytonix Corporation | Hydrophobic coating compositions, articles coated with said compositions, and processes for manufacturing same |
| US6203898B1 (en) * | 1997-08-29 | 2001-03-20 | 3M Innovatave Properties Company | Article comprising a substrate having a silicone coating |
| US6055929A (en) * | 1997-09-24 | 2000-05-02 | The Dow Chemical Company | Magnetron |
| US6572825B1 (en) * | 1999-10-04 | 2003-06-03 | Sandia Corporation | Apparatus for thermally evolving chemical analytes from a removable substrate |
| US6375811B1 (en) * | 1999-08-12 | 2002-04-23 | Northrop Grumman Corporation | Flexible, highly durable, transparent optical coatings |
| US6811853B1 (en) | 2000-03-06 | 2004-11-02 | Shipley Company, L.L.C. | Single mask lithographic process for patterning multiple types of surface features |
| US6627096B2 (en) | 2000-05-02 | 2003-09-30 | Shipley Company, L.L.C. | Single mask technique for making positive and negative micromachined features on a substrate |
| KR20030030768A (ko) * | 2001-10-12 | 2003-04-18 | 주식회사 엘지이아이 | 마그네트를 가지는 플라즈마 연속증착장치 |
| US20050008919A1 (en) * | 2003-05-05 | 2005-01-13 | Extrand Charles W. | Lyophilic fuel cell component |
| JP2007193997A (ja) * | 2006-01-17 | 2007-08-02 | Tateyama Machine Kk | プラズマ処理装置 |
| JP4268195B2 (ja) * | 2007-02-13 | 2009-05-27 | 株式会社神戸製鋼所 | プラズマｃｖｄ装置 |
| EP1978038A1 (en) * | 2007-04-02 | 2008-10-08 | Vlaamse Instelling Voor Technologisch Onderzoek (Vito) | A method for producing a coating by atmospheric pressure plasma technology |
| WO2010052846A1 (ja) * | 2008-11-05 | 2010-05-14 | 株式会社アルバック | 巻取式真空処理装置 |
| DE102010015149A1 (de) | 2010-04-16 | 2011-10-20 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung zum Beschichten eines Substrates innerhalb einer Vakuumkammer mittels plasmaunterstützter chemischer Dampfabscheidung |
| GB201112516D0 (en) * | 2011-07-21 | 2011-08-31 | P2I Ltd | Surface coatings |
| US9250178B2 (en) * | 2011-10-07 | 2016-02-02 | Kla-Tencor Corporation | Passivation of nonlinear optical crystals |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3297465A (en) * | 1963-12-31 | 1967-01-10 | Ibm | Method for producing organic plasma and for depositing polymer films |
| US3318790A (en) * | 1964-04-29 | 1967-05-09 | Texas Instruments Inc | Production of thin organic polymer by screened glow discharge |
| US3475307A (en) * | 1965-02-04 | 1969-10-28 | Continental Can Co | Condensation of monomer vapors to increase polymerization rates in a glow discharge |
| US3471316A (en) * | 1965-06-14 | 1969-10-07 | Continental Can Co | Method of forming a flexible organic layer on metal by a pulsed electrical abnormal glow discharge |
| US3464907A (en) * | 1967-02-23 | 1969-09-02 | Victory Eng Corp | Triode sputtering apparatus and method using synchronized pulsating current |
| DE1809906B2 (de) * | 1968-11-20 | 1971-06-03 | Jenaer Glaswerk Schott & Gen , 6500 Mainz | Verfahren zum vakuumaufdampfen von haftfesten mischschichten aus anorganischen und organischen stoffen auf einem substrat |
| US3767559A (en) * | 1970-06-24 | 1973-10-23 | Eastman Kodak Co | Sputtering apparatus with accordion pleated anode means |
| US3666533A (en) * | 1970-11-16 | 1972-05-30 | North American Rockwell | Deposition of polymeric coatings utilizing electrical excitation |
| NL7202331A (ref) * | 1972-01-24 | 1973-07-26 | ||
| US3878085A (en) * | 1973-07-05 | 1975-04-15 | Sloan Technology Corp | Cathode sputtering apparatus |
-
1975
- 1975-03-03 US US05/554,823 patent/US4013532A/en not_active Expired - Lifetime
-
1976
- 1976-01-27 CA CA244,269A patent/CA1044177A/en not_active Expired
- 1976-02-26 IT IT20627/76A patent/IT1055462B/it active
- 1976-02-27 BE BE164750A patent/BE839057A/xx not_active IP Right Cessation
- 1976-03-01 FR FR7605753A patent/FR2303091A1/fr active Granted
- 1976-03-01 DE DE2608415A patent/DE2608415C2/de not_active Expired
- 1976-03-02 NL NLAANVRAGE7602156,A patent/NL176642C/xx not_active IP Right Cessation
- 1976-03-02 GB GB8294/76A patent/GB1495480A/en not_active Expired
- 1976-03-03 JP JP51023061A patent/JPS51112489A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5527626B2 (ref) | 1980-07-22 |
| GB1495480A (en) | 1977-12-21 |
| IT1055462B (it) | 1981-12-21 |
| CA1044177A (en) | 1978-12-12 |
| US4013532A (en) | 1977-03-22 |
| FR2303091A1 (fr) | 1976-10-01 |
| NL176642C (nl) | 1985-05-17 |
| NL176642B (nl) | 1984-12-17 |
| NL7602156A (nl) | 1976-09-07 |
| DE2608415A1 (de) | 1976-09-16 |
| JPS51112489A (en) | 1976-10-04 |
| BE839057A (fr) | 1976-08-27 |
| FR2303091B1 (ref) | 1979-02-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE2608415C2 (de) | Verfahren zur Beschichtung eines Substrats mit einer Lage polymeren Materials | |
| EP0235770B1 (de) | Vorrichtung zur Plasmabehandlung von Substraten in einer durch Hochfrequenz angeregten Plasmaentladung | |
| EP0279895B1 (de) | Enrichtung zum Herstellen eines Plasmas und zur Behandlung von Substraten darin | |
| DE2556607C2 (de) | Verfahren und Vorrichtung zur Kathodenzerstäubung | |
| DE69123808T2 (de) | Verfahren und Gerät zur Bearbeitung mittels Mikrowellenplasma | |
| DE69218924T2 (de) | System zur Erzeugung eines Plasmas mit hoher Dichte | |
| EP0228394B1 (de) | Verfahren und vorrichtung zum beschichten von substraten mittels einer plasmaentladung | |
| EP0339554A2 (de) | Hochfrequenz-Ionenstrahlquelle | |
| WO1995028508A1 (de) | Verfahren und einrichtung für die ionengestützte vakuumbeschichtung | |
| DE3521053A1 (de) | Vorrichtung zum aufbringen duenner schichten auf ein substrat | |
| DE19853943A1 (de) | Vorrichtung für Zerstäubung oder Bogenaufdampfung | |
| EP0489239A1 (de) | Anordnung zum Beschichten von Substraten mit Magnetronkathoden | |
| DE3136515A1 (de) | "zerstaeubungsvorrichtung und zerstaeubungsverfahren" | |
| CH707466B1 (de) | Vorrichtung zur Durchführung eines Plasma-unterstützten Prozesses. | |
| DE19540794A1 (de) | Vorrichtung zum Beschichten eines Substrats von einem elektrisch leitfähigen Target | |
| DE3615361A1 (de) | Vorrichtung zur oberflaechenbehandlung von werkstuecken | |
| DE4230291C2 (de) | Mikrowellenunterstützte Zerstäubungsanordnung | |
| DE69017555T2 (de) | Verfahren und Vorrichtung zum Sputterauftragen von Filmen. | |
| DE10196150B4 (de) | Magnetron-Sputtervorrichtung und Verfahren zum Steuern einer solchen Vorrichtung | |
| DE19543781A1 (de) | Vakuumbeschichtungsanlage mit einem in der Vakuumkammer angeordneten Tiegel zur Aufnahme von zu verdampfendem Material | |
| DE4230290A1 (de) | Vorrichtung zum Erzeugen eines Plasmas mittels Kathodenzerstäubung und Mikrowelleneinstrahlung | |
| DE19753684C1 (de) | Einrichtung zur Behandlung von Werkstücken in einem Niederdruck-Plasma | |
| EP1264330A1 (de) | Verfahren und vorrichtung zur plasmagestützten oberflächenbehandlung und verwendung des verfahrens | |
| EP2425445B1 (de) | Verfahren zur erzeugung eines plasmastrahls sowie plasmaquelle | |
| DE4239511A1 (de) | Verfahren und Vorrichtung zum Beschichten von Substraten |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |