DE2534853A1 - Thermo-drucker mit integrierten halbleiter-heizelementen - Google Patents
Thermo-drucker mit integrierten halbleiter-heizelementenInfo
- Publication number
- DE2534853A1 DE2534853A1 DE19752534853 DE2534853A DE2534853A1 DE 2534853 A1 DE2534853 A1 DE 2534853A1 DE 19752534853 DE19752534853 DE 19752534853 DE 2534853 A DE2534853 A DE 2534853A DE 2534853 A1 DE2534853 A1 DE 2534853A1
- Authority
- DE
- Germany
- Prior art keywords
- silicon
- heating elements
- areas
- substrate
- polycrystalline silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000010438 heat treatment Methods 0.000 title claims description 65
- 239000004065 semiconductor Substances 0.000 title claims description 28
- 239000000758 substrate Substances 0.000 claims description 44
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 28
- 229910052710 silicon Inorganic materials 0.000 claims description 28
- 239000010703 silicon Substances 0.000 claims description 28
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 13
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- 235000012239 silicon dioxide Nutrition 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 238000009792 diffusion process Methods 0.000 claims description 6
- 230000003647 oxidation Effects 0.000 claims description 6
- 238000007254 oxidation reaction Methods 0.000 claims description 6
- 238000005498 polishing Methods 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000009499 grossing Methods 0.000 claims description 3
- 229910017604 nitric acid Inorganic materials 0.000 claims description 3
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 2
- 239000005977 Ethylene Substances 0.000 claims description 2
- 230000004913 activation Effects 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 230000000873 masking effect Effects 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 238000007740 vapor deposition Methods 0.000 claims description 2
- 238000005755 formation reaction Methods 0.000 claims 2
- 239000013078 crystal Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 6
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 3
- 229940012017 ethylenediamine Drugs 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000007651 thermal printing Methods 0.000 description 2
- 101100136648 Mus musculus Pign gene Proteins 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010405 reoxidation reaction Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/34—Structure of thermal heads comprising semiconductors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/969—Simultaneous formation of monocrystalline and polycrystalline regions
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Facsimile Heads (AREA)
- Non-Adjustable Resistors (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/501,567 US3953264A (en) | 1974-08-29 | 1974-08-29 | Integrated heater element array and fabrication method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2534853A1 true DE2534853A1 (de) | 1976-03-11 |
Family
ID=23994092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19752534853 Withdrawn DE2534853A1 (de) | 1974-08-29 | 1975-08-05 | Thermo-drucker mit integrierten halbleiter-heizelementen |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3953264A (enExample) |
| JP (1) | JPS5139135A (enExample) |
| AR (1) | AR215423A1 (enExample) |
| BR (1) | BR7505510A (enExample) |
| DE (1) | DE2534853A1 (enExample) |
| FR (1) | FR2283004A1 (enExample) |
| GB (1) | GB1479111A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2739857A1 (de) * | 1976-09-16 | 1978-03-30 | Energy Conversion Devices Inc | System zum herstellen von mikroregistrierungen bzw. kleinformat-aufzeichnungen |
| DE3142121A1 (de) * | 1980-10-23 | 1982-06-09 | Canon K.K., Tokyo | "fluidstrahl-aufzeichnungseinrichtung" |
| DE3623467A1 (de) * | 1985-07-12 | 1987-01-15 | Canon Kk | Verfahren zur thermo-rbertragungsaufzeichnung |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1109927A (en) * | 1978-06-26 | 1981-09-29 | Edmund T. Marciniec | Manufacture of thin film thermal print head |
| US4206541A (en) * | 1978-06-26 | 1980-06-10 | Extel Corporation | Method of manufacturing thin film thermal print heads |
| US4348254A (en) * | 1978-12-27 | 1982-09-07 | Solarex Corporation | Method of making solar cell |
| JPS57103367A (en) * | 1980-12-18 | 1982-06-26 | Clarion Co Ltd | Variable-capacitance device |
| US4719477A (en) * | 1986-01-17 | 1988-01-12 | Hewlett-Packard Company | Integrated thermal ink jet printhead and method of manufacture |
| US6136662A (en) * | 1999-05-13 | 2000-10-24 | Lsi Logic Corporation | Semiconductor wafer having a layer-to-layer alignment mark and method for fabricating the same |
| US7704847B2 (en) * | 2006-05-19 | 2010-04-27 | International Business Machines Corporation | On-chip heater and methods for fabrication thereof and use thereof |
| US8629038B2 (en) * | 2012-01-05 | 2014-01-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | FinFETs with vertical fins and methods for forming the same |
| US8994260B1 (en) * | 2012-10-06 | 2015-03-31 | Srinivas H. Kumar | Structure and method for single crystal silicon-based plasma light source and flat panel display panels and micro plasma sources |
| WO2020013822A1 (en) * | 2018-07-11 | 2020-01-16 | Hewlett-Packard Development Company, L.P. | Annealing devices including thermal heaters |
| CN113854641A (zh) * | 2021-11-04 | 2021-12-31 | 深圳市克莱鹏科技有限公司 | 基于单晶硅渗透结构的发热元件及制备方法和电子烟 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3466510A (en) * | 1967-01-07 | 1969-09-09 | Telefunken Patent | Integrated graetz rectifier circuit |
| US3447235A (en) * | 1967-07-21 | 1969-06-03 | Raytheon Co | Isolated cathode array semiconductor |
| US3574008A (en) * | 1968-08-19 | 1971-04-06 | Trw Semiconductors Inc | Mushroom epitaxial growth in tier-type shaped holes |
| US3844858A (en) * | 1968-12-31 | 1974-10-29 | Texas Instruments Inc | Process for controlling the thickness of a thin layer of semiconductor material and semiconductor substrate |
| US3632970A (en) * | 1969-05-08 | 1972-01-04 | Texas Instruments Inc | Method and apparatus for protecting electronic printheads |
| US3559283A (en) * | 1969-06-16 | 1971-02-02 | Dionics Inc | Method of producing air-isolated integrated circuits |
| US3892033A (en) * | 1970-02-05 | 1975-07-01 | Philips Corp | Method of manufacturing a semiconductor device |
| US3728179A (en) * | 1970-05-20 | 1973-04-17 | Radiation Inc | Method of etching silicon crystals |
| US3689357A (en) * | 1970-12-10 | 1972-09-05 | Gen Motors Corp | Glass-polysilicon dielectric isolation |
| US3911559A (en) * | 1973-12-10 | 1975-10-14 | Texas Instruments Inc | Method of dielectric isolation to provide backside collector contact and scribing yield |
-
1974
- 1974-08-29 US US05/501,567 patent/US3953264A/en not_active Expired - Lifetime
-
1975
- 1975-07-03 FR FR7521480A patent/FR2283004A1/fr active Granted
- 1975-07-15 JP JP50085924A patent/JPS5139135A/ja active Pending
- 1975-07-22 GB GB30555/75A patent/GB1479111A/en not_active Expired
- 1975-08-05 DE DE19752534853 patent/DE2534853A1/de not_active Withdrawn
- 1975-08-28 BR BR7505510*A patent/BR7505510A/pt unknown
- 1975-08-28 AR AR260176A patent/AR215423A1/es active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2739857A1 (de) * | 1976-09-16 | 1978-03-30 | Energy Conversion Devices Inc | System zum herstellen von mikroregistrierungen bzw. kleinformat-aufzeichnungen |
| DE3142121A1 (de) * | 1980-10-23 | 1982-06-09 | Canon K.K., Tokyo | "fluidstrahl-aufzeichnungseinrichtung" |
| DE3623467A1 (de) * | 1985-07-12 | 1987-01-15 | Canon Kk | Verfahren zur thermo-rbertragungsaufzeichnung |
Also Published As
| Publication number | Publication date |
|---|---|
| US3953264A (en) | 1976-04-27 |
| JPS5139135A (enExample) | 1976-04-01 |
| FR2283004B1 (enExample) | 1977-07-22 |
| AR215423A1 (es) | 1979-10-15 |
| GB1479111A (en) | 1977-07-06 |
| FR2283004A1 (fr) | 1976-03-26 |
| BR7505510A (pt) | 1976-08-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8139 | Disposal/non-payment of the annual fee |