DE2363229A1 - Anordnung zur einstellung von betriebsparametern an einer integrierten elektrischen schaltungseinheit - Google Patents
Anordnung zur einstellung von betriebsparametern an einer integrierten elektrischen schaltungseinheitInfo
- Publication number
- DE2363229A1 DE2363229A1 DE2363229A DE2363229A DE2363229A1 DE 2363229 A1 DE2363229 A1 DE 2363229A1 DE 2363229 A DE2363229 A DE 2363229A DE 2363229 A DE2363229 A DE 2363229A DE 2363229 A1 DE2363229 A1 DE 2363229A1
- Authority
- DE
- Germany
- Prior art keywords
- circuit
- arrangement according
- resistance
- elements
- connections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/34—DC amplifiers in which all stages are DC-coupled
- H03F3/343—DC amplifiers in which all stages are DC-coupled with semiconductor devices only
- H03F3/347—DC amplifiers in which all stages are DC-coupled with semiconductor devices only in integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Amplifiers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US31683372A | 1972-12-20 | 1972-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2363229A1 true DE2363229A1 (de) | 1974-06-27 |
Family
ID=23230893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2363229A Ceased DE2363229A1 (de) | 1972-12-20 | 1973-12-19 | Anordnung zur einstellung von betriebsparametern an einer integrierten elektrischen schaltungseinheit |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS4991385A (enExample) |
| CA (1) | CA997868A (enExample) |
| DE (1) | DE2363229A1 (enExample) |
| FR (1) | FR2211760B1 (enExample) |
| GB (1) | GB1421476A (enExample) |
| IT (1) | IT1000494B (enExample) |
| NL (1) | NL7316592A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4202260A1 (de) * | 1992-01-28 | 1993-07-29 | Thomson Brandt Gmbh | Verfahren und vorrichtung zur parameter-einstellung |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2468998B1 (fr) * | 1979-11-06 | 1985-10-25 | Burr Brown Corp | Circuit integre a element thermosensible |
| US4628272A (en) * | 1984-10-01 | 1986-12-09 | Motorola, Inc. | Tuned inductorless active phase shift demodulator |
| JPS6489338A (en) * | 1987-05-19 | 1989-04-03 | Gazelle Microcircuits Inc | Semiconductor device |
| WO1992007380A1 (fr) * | 1990-10-15 | 1992-04-30 | Seiko Epson Corporation | Dispositif a semi-conducteur comprenant un circuit de commutation commute par la lumiere et procede de fabrication du dispositif |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1145991A (en) * | 1965-03-12 | 1969-03-19 | Mullard Ltd | Improvements in and relating to methods of manufacturing electrical circuit arrangements |
| US3761787A (en) * | 1971-09-01 | 1973-09-25 | Motorola Inc | Method and apparatus for adjusting transistor current |
-
1973
- 1973-11-09 CA CA185,480A patent/CA997868A/en not_active Expired
- 1973-11-20 GB GB5380073A patent/GB1421476A/en not_active Expired
- 1973-12-04 NL NL7316592A patent/NL7316592A/xx not_active Application Discontinuation
- 1973-12-11 FR FR7344147A patent/FR2211760B1/fr not_active Expired
- 1973-12-18 IT IT54431/73A patent/IT1000494B/it active
- 1973-12-19 JP JP48142959A patent/JPS4991385A/ja active Pending
- 1973-12-19 DE DE2363229A patent/DE2363229A1/de not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4202260A1 (de) * | 1992-01-28 | 1993-07-29 | Thomson Brandt Gmbh | Verfahren und vorrichtung zur parameter-einstellung |
Also Published As
| Publication number | Publication date |
|---|---|
| CA997868A (en) | 1976-09-28 |
| JPS4991385A (enExample) | 1974-08-31 |
| IT1000494B (it) | 1976-03-30 |
| FR2211760B1 (enExample) | 1979-04-27 |
| NL7316592A (enExample) | 1974-06-24 |
| FR2211760A1 (enExample) | 1974-07-19 |
| GB1421476A (en) | 1976-01-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8125 | Change of the main classification | ||
| 8131 | Rejection |