DE2300653A1 - Mischungen mit gehalt an polyenen und polythiolen und deren verwendung - Google Patents

Mischungen mit gehalt an polyenen und polythiolen und deren verwendung

Info

Publication number
DE2300653A1
DE2300653A1 DE19732300653 DE2300653A DE2300653A1 DE 2300653 A1 DE2300653 A1 DE 2300653A1 DE 19732300653 DE19732300653 DE 19732300653 DE 2300653 A DE2300653 A DE 2300653A DE 2300653 A1 DE2300653 A1 DE 2300653A1
Authority
DE
Germany
Prior art keywords
mixture
circuit board
solder
printed circuit
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19732300653
Other languages
German (de)
English (en)
Inventor
Harold Adrian Kloczweski
David Edward Kramm
Joseph Donald Moyer
William Ross Schaeffer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WR Grace and Co
Original Assignee
WR Grace and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WR Grace and Co filed Critical WR Grace and Co
Publication of DE2300653A1 publication Critical patent/DE2300653A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/224—Anti-weld compositions; Braze stop-off compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/12—Polythioether-ethers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/0275—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with dithiol or polysulfide compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/117—Free radical
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/122—Sulfur compound containing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
DE19732300653 1972-01-10 1973-01-08 Mischungen mit gehalt an polyenen und polythiolen und deren verwendung Pending DE2300653A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21682472A 1972-01-10 1972-01-10

Publications (1)

Publication Number Publication Date
DE2300653A1 true DE2300653A1 (de) 1973-07-19

Family

ID=22808656

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19732300653 Pending DE2300653A1 (de) 1972-01-10 1973-01-08 Mischungen mit gehalt an polyenen und polythiolen und deren verwendung

Country Status (6)

Country Link
US (1) US3753720A (US06653308-20031125-C00199.png)
BE (1) BE793732A (US06653308-20031125-C00199.png)
DE (1) DE2300653A1 (US06653308-20031125-C00199.png)
FR (1) FR2167820B1 (US06653308-20031125-C00199.png)
GB (1) GB1354429A (US06653308-20031125-C00199.png)
IT (1) IT978048B (US06653308-20031125-C00199.png)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL177718C (nl) * 1973-02-22 1985-11-01 Siemens Ag Werkwijze ter vervaardiging van reliefstructuren uit warmte-bestendige polymeren.
US3847767A (en) * 1973-03-13 1974-11-12 Grace W R & Co Method of producing a screen printable photocurable solder resist
US3883352A (en) * 1973-04-05 1975-05-13 Grace W R & Co Process for forming a photocured solder resist
US4146916A (en) * 1974-03-26 1979-03-27 P. R. Mallory & Co. Inc. Radiation cured material disposed over an electrical device body to help maintain the configuration of the body and method
US3953214A (en) * 1974-05-24 1976-04-27 Dynachem Corporation Photopolymerizable screen printing inks and use thereof
US4039905A (en) * 1974-07-01 1977-08-02 P. R. Mallory & Co., Inc. Electrical device of the electrolytic type having means for confining mobile electrolyte and method of making same
USRE30186E (en) * 1974-08-02 1980-01-08 Siemens Aktiengesellschaft Method for the preparation of relief structures
DE2437348B2 (de) * 1974-08-02 1976-10-07 Ausscheidung in: 24 62 105 Verfahren zur herstellung von reliefstrukturen
AT341792B (de) * 1974-08-02 1978-02-27 Siemens Ag Verfahren zur herstellung von schichtstrukturen
AT352406B (de) * 1974-08-02 1979-09-25 Siemens Ag Verfahren zur herstellung von reliefstrukturen
US4644380A (en) * 1977-12-08 1987-02-17 University Of Pennsylvania Substance-sensitive electrical structures
US4270985A (en) * 1978-07-21 1981-06-02 Dynachem Corporation Screen printing of photopolymerizable inks
GB2030584B (en) * 1978-10-03 1983-03-23 Lankro Chem Ltd Photopolymerisable solder resist compositions
US4197173A (en) * 1978-10-19 1980-04-08 General Electric Company Photocurable polyene-polythiol-siloxane-polyester composition for coating
ZA8244B (en) * 1981-01-16 1982-11-24 Grace W R & Co Method and apparatus for making printed circuit boards
US4396140A (en) * 1981-01-27 1983-08-02 Bell Telephone Laboratories, Incorporated Method of bonding electronic components
DE3171729D1 (en) * 1981-02-23 1985-09-12 Matsushita Electric Ind Co Ltd Soldering apparatus
US4483759A (en) * 1982-07-02 1984-11-20 Thermedics, Inc. Actinic radiation cured polyurethane acrylic copolymer
US4836782A (en) * 1983-05-06 1989-06-06 Dentsply Research & Development Corp. Method for providing direct cool beam incident light on dental target
EP0207188B1 (en) * 1985-06-29 1996-06-19 Dainippon Ink And Chemicals, Inc. Resin composition for solder resist ink
JPS62290705A (ja) * 1986-06-10 1987-12-17 Mitsubishi Chem Ind Ltd 光重合性組成物
EP0409169A3 (en) * 1989-07-20 1992-03-25 Ciba-Geigy Ag Exposing method
JP2000502463A (ja) 1995-12-21 2000-02-29 ザ ダウ ケミカル カンパニー はんだマスク組成物
KR100267229B1 (ko) * 1997-09-03 2000-10-16 윤종용 인쇄회로기판의금도금단자부오염방지방법
US10080287B2 (en) * 2012-09-27 2018-09-18 Dell Products L.P. Blind via printed circuit board fabrication supporting press fit connectors

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3537853A (en) * 1968-02-21 1970-11-03 Grace W R & Co Process of forming printing plates,including the step of subjecting the mounted transparency to a surface static electricity eliminator
US3619393A (en) * 1969-12-04 1971-11-09 Grace W R & Co Process for the preparation of shelf-stable, photocurable polythiols
US3708413A (en) * 1970-06-23 1973-01-02 Grace W R & Co High energy curable liquid polyene-polythiol polymer composition
US3701721A (en) * 1971-12-06 1972-10-31 Grace W R & Co Curable liquid polyene-polythiol compositions containing polyacrylic acid and derivatives thereof

Also Published As

Publication number Publication date
GB1354429A (en) 1974-06-05
FR2167820B1 (US06653308-20031125-C00199.png) 1977-09-02
IT978048B (it) 1974-09-20
US3753720A (en) 1973-08-21
FR2167820A1 (US06653308-20031125-C00199.png) 1973-08-24
BE793732A (fr) 1973-05-02

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