DE2204490A1 - Halbleiterbauelement mit druckkontakt - Google Patents

Halbleiterbauelement mit druckkontakt

Info

Publication number
DE2204490A1
DE2204490A1 DE2204490A DE2204490A DE2204490A1 DE 2204490 A1 DE2204490 A1 DE 2204490A1 DE 2204490 A DE2204490 A DE 2204490A DE 2204490 A DE2204490 A DE 2204490A DE 2204490 A1 DE2204490 A1 DE 2204490A1
Authority
DE
Germany
Prior art keywords
electrode
pressure
semiconductor
semiconductor component
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE2204490A
Other languages
German (de)
English (en)
Inventor
Reimer Dipl Phys Dr Emeis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DE2204490A priority Critical patent/DE2204490A1/de
Priority to CH1440772A priority patent/CH541869A/de
Priority to GB4756872A priority patent/GB1397430A/en
Priority to NL7217019A priority patent/NL7217019A/xx
Priority to FR7245017A priority patent/FR2169819B1/fr
Priority to IT33234/72A priority patent/IT972620B/it
Priority to JP48012828A priority patent/JPS4885079A/ja
Publication of DE2204490A1 publication Critical patent/DE2204490A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
DE2204490A 1972-01-31 1972-01-31 Halbleiterbauelement mit druckkontakt Pending DE2204490A1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE2204490A DE2204490A1 (de) 1972-01-31 1972-01-31 Halbleiterbauelement mit druckkontakt
CH1440772A CH541869A (de) 1972-01-31 1972-10-03 Halbleiterbauelement
GB4756872A GB1397430A (en) 1972-01-31 1972-10-16 Semiconductor components
NL7217019A NL7217019A (cg-RX-API-DMAC7.html) 1972-01-31 1972-12-14
FR7245017A FR2169819B1 (cg-RX-API-DMAC7.html) 1972-01-31 1972-12-18
IT33234/72A IT972620B (it) 1972-01-31 1972-12-20 Componente a semiconduttori con contatto a pressione
JP48012828A JPS4885079A (cg-RX-API-DMAC7.html) 1972-01-31 1973-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2204490A DE2204490A1 (de) 1972-01-31 1972-01-31 Halbleiterbauelement mit druckkontakt

Publications (1)

Publication Number Publication Date
DE2204490A1 true DE2204490A1 (de) 1973-08-09

Family

ID=5834583

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2204490A Pending DE2204490A1 (de) 1972-01-31 1972-01-31 Halbleiterbauelement mit druckkontakt

Country Status (7)

Country Link
JP (1) JPS4885079A (cg-RX-API-DMAC7.html)
CH (1) CH541869A (cg-RX-API-DMAC7.html)
DE (1) DE2204490A1 (cg-RX-API-DMAC7.html)
FR (1) FR2169819B1 (cg-RX-API-DMAC7.html)
GB (1) GB1397430A (cg-RX-API-DMAC7.html)
IT (1) IT972620B (cg-RX-API-DMAC7.html)
NL (1) NL7217019A (cg-RX-API-DMAC7.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2727319A1 (de) * 1977-06-16 1979-01-04 Nippon Electric Co Halbleiteranordnung mit einer hoeckerfoermigen anschlusselektrode
DE3009511A1 (de) * 1979-03-13 1980-09-18 Tokyo Shibaura Electric Co Kompressions-halbleitervorrichtung
DE10330053A1 (de) * 2003-07-03 2005-02-10 Infineon Technologies Ag Halbleiterbauelement mit einem Druckkontakt und Ronde für einen Druckkontakt eines Halbleiterbauelements
DE102004059389A1 (de) * 2004-12-09 2006-06-14 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Kontaktierung eines Halbleiterbauelements

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5871633A (ja) * 1981-10-23 1983-04-28 Toshiba Corp 圧接型半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS413220Y1 (cg-RX-API-DMAC7.html) * 1965-01-02 1966-02-23

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2727319A1 (de) * 1977-06-16 1979-01-04 Nippon Electric Co Halbleiteranordnung mit einer hoeckerfoermigen anschlusselektrode
DE3009511A1 (de) * 1979-03-13 1980-09-18 Tokyo Shibaura Electric Co Kompressions-halbleitervorrichtung
DE10330053A1 (de) * 2003-07-03 2005-02-10 Infineon Technologies Ag Halbleiterbauelement mit einem Druckkontakt und Ronde für einen Druckkontakt eines Halbleiterbauelements
DE102004059389A1 (de) * 2004-12-09 2006-06-14 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Kontaktierung eines Halbleiterbauelements
DE102004059389B4 (de) * 2004-12-09 2012-02-23 Infineon Technologies Ag Halbleiterbauelement mit Ausgleichsmetallisierung

Also Published As

Publication number Publication date
IT972620B (it) 1974-05-31
FR2169819A1 (cg-RX-API-DMAC7.html) 1973-09-14
FR2169819B1 (cg-RX-API-DMAC7.html) 1977-12-30
CH541869A (de) 1973-09-15
NL7217019A (cg-RX-API-DMAC7.html) 1973-08-02
GB1397430A (en) 1975-06-11
JPS4885079A (cg-RX-API-DMAC7.html) 1973-11-12

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Legal Events

Date Code Title Description
OHA Expiration of time for request for examination