DE3786951T2 - Leistungshalbleiteranordnung. - Google Patents

Leistungshalbleiteranordnung.

Info

Publication number
DE3786951T2
DE3786951T2 DE19873786951 DE3786951T DE3786951T2 DE 3786951 T2 DE3786951 T2 DE 3786951T2 DE 19873786951 DE19873786951 DE 19873786951 DE 3786951 T DE3786951 T DE 3786951T DE 3786951 T2 DE3786951 T2 DE 3786951T2
Authority
DE
Germany
Prior art keywords
power semiconductor
semiconductor arrangement
arrangement
power
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE19873786951
Other languages
English (en)
Other versions
DE3786951D1 (de
Inventor
Yasunori C O Patent Divis Usui
Hiroshi C O Patent Div Okamura
Yoshinari C O Patent Di Uetake
Takashi C O Patent Di Fujiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE3786951D1 publication Critical patent/DE3786951D1/de
Application granted granted Critical
Publication of DE3786951T2 publication Critical patent/DE3786951T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
DE19873786951 1986-05-17 1987-05-15 Leistungshalbleiteranordnung. Expired - Lifetime DE3786951T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61111808A JPS62269322A (ja) 1986-05-17 1986-05-17 電力用半導体装置

Publications (2)

Publication Number Publication Date
DE3786951D1 DE3786951D1 (de) 1993-09-16
DE3786951T2 true DE3786951T2 (de) 1994-01-05

Family

ID=14570674

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873786951 Expired - Lifetime DE3786951T2 (de) 1986-05-17 1987-05-15 Leistungshalbleiteranordnung.

Country Status (4)

Country Link
US (1) US4882612A (de)
EP (1) EP0246574B1 (de)
JP (1) JPS62269322A (de)
DE (1) DE3786951T2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3018971B2 (ja) * 1995-12-18 2000-03-13 富士電機株式会社 半導体装置
DE19903245A1 (de) * 1999-01-27 2000-08-03 Asea Brown Boveri Leistungshalbleitermodul
EP1291914A1 (de) * 2001-09-10 2003-03-12 ABB Schweiz AG Druckkontaktierbares Leistungshalbleitermodul
JP6688198B2 (ja) * 2016-09-27 2020-04-28 日本発條株式会社 圧接ユニットおよび電力用半導体装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1639402B2 (de) * 1968-02-08 1976-12-16 Siemens AG, 1000 Berlin und 8000 München Steuerbares halbleiterbauelement
US3585454A (en) * 1969-04-01 1971-06-15 Westinghouse Electric Corp Improved case member for a light activated semiconductor device
DE2014289A1 (de) * 1970-03-25 1971-10-14 Semikron Gleichrichterbau Scheibenförmiges Halbleiterbauele ment und Verfahren zu seiner Herstellung
DE2257078A1 (de) * 1972-11-21 1974-05-30 Siemens Ag Halbleiterbauelement mit druckkontakt
DE2556469C3 (de) * 1975-12-15 1978-09-07 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiterbauelement mit Druckkontakt
DE2902224A1 (de) * 1979-01-20 1980-07-24 Bbc Brown Boveri & Cie Kontaktsystem fuer leistungs-halbleiterbauelemente
SE429802B (sv) * 1979-02-21 1983-09-26 Asea Ab Halvledaranordning innefattande en tetande ringformad kropp av en sulfonpolymer eller av polyfenylensulfid
US4305087A (en) * 1979-06-29 1981-12-08 International Rectifier Corporation Stud-mounted pressure assembled semiconductor device
JPS5633886A (en) * 1979-08-28 1981-04-04 Mitsubishi Electric Corp Light drive semiconductor device
JPS60150670A (ja) * 1984-01-17 1985-08-08 Mitsubishi Electric Corp 半導体装置
JPS60194565A (ja) * 1984-03-15 1985-10-03 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
EP0246574B1 (de) 1993-08-11
US4882612A (en) 1989-11-21
EP0246574A2 (de) 1987-11-25
JPS62269322A (ja) 1987-11-21
DE3786951D1 (de) 1993-09-16
EP0246574A3 (en) 1988-09-21

Similar Documents

Publication Publication Date Title
DE3684557D1 (de) Waferintegrierte halbleiteranordnung.
DE3683316D1 (de) Halbleiteranordnung.
DE59008471D1 (de) Leistungshalbleitermodul.
DE3481957D1 (de) Halbleiteranordnung.
DE3778439D1 (de) Halbleiterspeicheranordnung.
DE3583302D1 (de) Halbleiteranordnung.
DE3679108D1 (de) Halbleiteranordnungen.
DE3667879D1 (de) Halbleiteranordnung.
DE3586735D1 (de) Abschaltbares leistungshalbleiterbauelement.
DE3761842D1 (de) Leistungsuebertragung.
DE3582653D1 (de) Halbleiteranordnung.
DE3772137D1 (de) Halbleiter-speicheranordnung.
DE3684184D1 (de) Verkapselte halbleiteranordnung.
DE3778408D1 (de) Halbleiterspeicheranordnung.
DE3783666D1 (de) Halbleiterspeicheranordnung.
DE3686490T2 (de) Halbleiterstruktur.
DE3783493D1 (de) Halbleiterspeicheranordnung.
DE3783507D1 (de) Zusammengesetztes halbleiterbauelement.
DE3774369D1 (de) Halbleiter-speicheranordnung.
DE3784247D1 (de) Halbleiter-zusammenbau.
DE3787137D1 (de) Halbleiteranordnung.
DE3685983T2 (de) Integrierte halbleiteranordnung.
DE3785488D1 (de) Abschaltbares leistungshalbleiterbauelement.
DE3771243D1 (de) Halbleiterspeicheranordnung.
DE3786028T2 (de) Heterouebergangshalbleiteranordnung.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)