DE2163970C3 - Prüfeinrichtung zur Prüfung von Leiterplatten - Google Patents

Prüfeinrichtung zur Prüfung von Leiterplatten

Info

Publication number
DE2163970C3
DE2163970C3 DE2163970A DE2163970A DE2163970C3 DE 2163970 C3 DE2163970 C3 DE 2163970C3 DE 2163970 A DE2163970 A DE 2163970A DE 2163970 A DE2163970 A DE 2163970A DE 2163970 C3 DE2163970 C3 DE 2163970C3
Authority
DE
Germany
Prior art keywords
test
needles
testing
compressed air
testing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2163970A
Other languages
German (de)
English (en)
Other versions
DE2163970B2 (de
DE2163970A1 (de
Inventor
Michio Hirakata Kato
Tadashi Katano Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP14121270U external-priority patent/JPS5011972Y1/ja
Priority claimed from JP14121570U external-priority patent/JPS5011974Y1/ja
Priority claimed from JP14121370U external-priority patent/JPS5011973Y1/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE2163970A1 publication Critical patent/DE2163970A1/de
Publication of DE2163970B2 publication Critical patent/DE2163970B2/de
Application granted granted Critical
Publication of DE2163970C3 publication Critical patent/DE2163970C3/de
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/145—Indicating the presence of current or voltage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2805—Bare printed circuit boards

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
DE2163970A 1970-12-25 1971-12-22 Prüfeinrichtung zur Prüfung von Leiterplatten Expired DE2163970C3 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP14121270U JPS5011972Y1 (enExample) 1970-12-25 1970-12-25
JP14121570U JPS5011974Y1 (enExample) 1970-12-25 1970-12-25
JP14121470 1970-12-25
JP14121370U JPS5011973Y1 (enExample) 1970-12-25 1970-12-25
JP13006970 1970-12-25

Publications (3)

Publication Number Publication Date
DE2163970A1 DE2163970A1 (de) 1972-09-21
DE2163970B2 DE2163970B2 (de) 1973-05-30
DE2163970C3 true DE2163970C3 (de) 1973-12-20

Family

ID=27527223

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2163970A Expired DE2163970C3 (de) 1970-12-25 1971-12-22 Prüfeinrichtung zur Prüfung von Leiterplatten

Country Status (7)

Country Link
US (1) US3787768A (enExample)
CA (1) CA944435A (enExample)
DE (1) DE2163970C3 (enExample)
FR (1) FR2119050B1 (enExample)
GB (1) GB1364109A (enExample)
NL (1) NL157989B (enExample)
SE (1) SE371700B (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1399877A (en) * 1972-12-02 1975-07-02 Honeywell Inf Systems Solderability testing
DE2800775A1 (de) * 1978-01-09 1979-07-12 Luther & Maelzer Gmbh Verfahrensanordnung und vorrichtung zur aufnahme und funktionsmessueberpruefung von unbestueckten leiterplatten
US4357062A (en) * 1979-12-10 1982-11-02 John Fluke Mfg. Co., Inc. Universal circuit board test fixture
US4362991A (en) * 1980-12-12 1982-12-07 Burroughs Corporation Integrated circuit test probe assembly
US4531799A (en) * 1982-01-04 1985-07-30 Raytheon Company Electrical connector
US4508405A (en) * 1982-04-29 1985-04-02 Augat Inc. Electronic socket having spring probe contacts
DE3405566C2 (de) * 1984-02-14 1986-09-25 Siemens AG, 1000 Berlin und 8000 München Verriegelungseinrichtung für eine Vorrichtung zur automatischen Prüfung von Flachbaugruppen
SE448404B (sv) * 1985-02-04 1987-02-16 Probe Hb Anordning for temporer sammankoppling av ett metinstrument med en elektronisk enhet
US4818933A (en) * 1986-10-08 1989-04-04 Hewlett-Packard Company Board fixturing system
DE8703044U1 (de) * 1987-02-27 1988-03-31 WE-Electronic GmbH, 3320 Salzgitter Vorrichtung zum Prüfen elektronischer Leiterplatten
DE3784710D1 (de) * 1987-05-26 1993-04-15 Ibm Deutschland Kontaktsonden-anordnung mit feinpositionier-vorrichtung.
EP0296884A3 (en) * 1987-06-24 1991-01-16 Schlumberger Technologies, Inc. Method for in-circuit testing of electronic devices
EP0309109B1 (en) * 1987-09-21 1995-03-15 AT&T Corp. Testing process for electronic devices
US4935694A (en) * 1988-09-20 1990-06-19 Electro Scientific Industries, Inc. Probe card fixture
US5408189A (en) * 1990-05-25 1995-04-18 Everett Charles Technologies, Inc. Test fixture alignment system for printed circuit boards
GB2276281B (en) * 1993-03-03 1995-04-12 Centalic Tech Dev Ltd Testing apparatus for printed circuit boards and the like
DE9408512U1 (de) * 1994-05-24 1995-09-21 Höflschweiger, Nikolaus, 85408 Gammelsdorf Teststation
US6201402B1 (en) * 1997-04-08 2001-03-13 Celadon Systems, Inc. Probe tile and platform for large area wafer probing
US6586954B2 (en) * 1998-02-10 2003-07-01 Celadon Systems, Inc. Probe tile for probing semiconductor wafer
US7215131B1 (en) 1999-06-07 2007-05-08 Formfactor, Inc. Segmented contactor
JP2001228192A (ja) * 2000-02-18 2001-08-24 Oht Inc 検査装置及び検査装置の保持具
US6992495B2 (en) * 2002-06-28 2006-01-31 Celadon Systems, Inc. Shielded probe apparatus for probing semiconductor wafer
US7250781B2 (en) * 2002-12-19 2007-07-31 Fuji Xerox Co., Ltd. Circuit board inspection device
US6975128B1 (en) 2003-03-28 2005-12-13 Celadon Systems, Inc. Electrical, high temperature test probe with conductive driven guard
US7355418B2 (en) * 2004-02-12 2008-04-08 Applied Materials, Inc. Configurable prober for TFT LCD array test
US7319335B2 (en) * 2004-02-12 2008-01-15 Applied Materials, Inc. Configurable prober for TFT LCD array testing
US7656179B2 (en) * 2006-11-10 2010-02-02 Yokowo Co., Ltd. Relay connector having a pin block and a floating guide with guide hole
US7728609B2 (en) * 2007-05-25 2010-06-01 Celadon Systems, Inc. Replaceable probe apparatus for probing semiconductor wafer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2887622A (en) * 1953-08-07 1959-05-19 Charles C Rayburn Electrical circuit pattern tester
US3437929A (en) * 1965-08-05 1969-04-08 Electroglas Inc Automatically indexed probe assembly for testing semiconductor wafers and the like
US3412333A (en) * 1965-11-15 1968-11-19 Philco Ford Corp Apparatus for sequentially testing electrical components under controlled environment conditions
US3654585A (en) * 1970-03-11 1972-04-04 Brooks Research And Mfg Inc Coordinate conversion for the testing of printed circuit boards

Also Published As

Publication number Publication date
DE2163970B2 (de) 1973-05-30
GB1364109A (en) 1974-08-21
FR2119050B1 (enExample) 1975-07-04
NL7117823A (enExample) 1972-06-27
DE2163970A1 (de) 1972-09-21
SE371700B (enExample) 1974-11-25
US3787768A (en) 1974-01-22
CA944435A (en) 1974-03-26
FR2119050A1 (enExample) 1972-08-04
NL157989B (nl) 1978-09-15

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
E77 Valid patent as to the heymanns-index 1977
EF Willingness to grant licences
8339 Ceased/non-payment of the annual fee