DE2153345A1 - Klemmvorrichtung für Halbleitereinrichtungen - Google Patents
Klemmvorrichtung für HalbleitereinrichtungenInfo
- Publication number
- DE2153345A1 DE2153345A1 DE19712153345 DE2153345A DE2153345A1 DE 2153345 A1 DE2153345 A1 DE 2153345A1 DE 19712153345 DE19712153345 DE 19712153345 DE 2153345 A DE2153345 A DE 2153345A DE 2153345 A1 DE2153345 A1 DE 2153345A1
- Authority
- DE
- Germany
- Prior art keywords
- springs
- spring
- screws
- clamping
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 51
- 239000002184 metal Substances 0.000 claims description 11
- 210000003746 feather Anatomy 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 claims description 2
- 238000010073 coating (rubber) Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 230000001105 regulatory effect Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 230000006835 compression Effects 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 238000002955 isolation Methods 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 101100129922 Caenorhabditis elegans pig-1 gene Proteins 0.000 description 1
- 101100520057 Drosophila melanogaster Pig1 gene Proteins 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 150000001412 amines Chemical group 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000411 inducer Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 230000002688 persistence Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8455670A | 1970-10-28 | 1970-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2153345A1 true DE2153345A1 (de) | 1972-05-10 |
Family
ID=22185714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19712153345 Pending DE2153345A1 (de) | 1970-10-28 | 1971-10-26 | Klemmvorrichtung für Halbleitereinrichtungen |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US3688159A (en:Method) |
| DE (1) | DE2153345A1 (en:Method) |
| FR (1) | FR2112349B1 (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3429269A1 (de) * | 1984-08-08 | 1986-02-20 | Siemens AG, 1000 Berlin und 8000 München | Gehaeuse mit rippen und/oder spitzen |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CS180334B1 (en) * | 1975-11-28 | 1977-12-30 | Jiri Kovar | Power semiconducting disc elements suppressing and jigging equipment |
| US4224663A (en) * | 1979-02-01 | 1980-09-23 | Power Control Corporation | Mounting assembly for semiconductive controlled rectifiers |
| US4333101A (en) * | 1979-07-19 | 1982-06-01 | Flight Systems, Inc. | Semiconductor heat sink mounting assembly |
| US5305185A (en) * | 1992-09-30 | 1994-04-19 | Samarov Victor M | Coplanar heatsink and electronics assembly |
| US5696664A (en) * | 1996-03-27 | 1997-12-09 | Siemens Energy & Automation, Inc. | Basepan with integrally formed posts for mounting components by heat staking |
| US5940273A (en) * | 1998-06-08 | 1999-08-17 | Inductotherm Corp. | Semiconductor clamping device |
| US6324073B1 (en) * | 1998-12-22 | 2001-11-27 | S&C Electric Co. | Clamping arrangement for compression-mounted power electronic devices |
| EP1376179A3 (en) * | 2002-06-27 | 2004-04-14 | Toyoda Koki Kabushiki Kaisha | Laminated optical waveguide array, optical beam collecting device and laser emission device |
| EP1494278A1 (de) * | 2003-07-04 | 2005-01-05 | Siemens Aktiengesellschaft | Elektronisches Leistungsmodul mit Gummidichtung und entsprechendes Herstellungsverfahren |
| DE102005050028A1 (de) * | 2005-10-14 | 2007-04-19 | Robert Bosch Gmbh | Elektrische Vorrichtung, insbesondere zur Ansteuerung einer motorisch und/oder generatorisch betreibbaren elektrischen Maschine |
| BRPI0806533B1 (pt) * | 2007-01-26 | 2018-10-09 | Inductotherm Corp | dispositivo de fixação de semicondutor para fixar um conjunto semicondutor e método de fixar um conjunto semicondutor |
| DE202012007280U1 (de) | 2012-07-30 | 2012-09-26 | Abb Technology Ag | Leistungshalbleiterspannstapel |
| US9655280B1 (en) * | 2015-12-31 | 2017-05-16 | Lockheed Martin Corporation | Multi-directional force generating line-replaceable unit chassis by means of a linear spring |
| US12397362B2 (en) * | 2021-07-01 | 2025-08-26 | Mks Inc. | GaN clamp with uniform pressure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3536960A (en) * | 1968-06-26 | 1970-10-27 | Electric Regulator Corp | Heat sink module |
| US3571663A (en) * | 1969-01-08 | 1971-03-23 | Chemetron Corp | Releasable clamp assembly for a solid state circuit element |
-
1970
- 1970-10-28 US US3688159D patent/US3688159A/en not_active Expired - Lifetime
-
1971
- 1971-09-09 FR FR7132569A patent/FR2112349B1/fr not_active Expired
- 1971-10-26 DE DE19712153345 patent/DE2153345A1/de active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3429269A1 (de) * | 1984-08-08 | 1986-02-20 | Siemens AG, 1000 Berlin und 8000 München | Gehaeuse mit rippen und/oder spitzen |
Also Published As
| Publication number | Publication date |
|---|---|
| US3688159A (en) | 1972-08-29 |
| FR2112349A1 (en:Method) | 1972-06-16 |
| FR2112349B1 (en:Method) | 1976-09-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OHJ | Non-payment of the annual fee |