FR2112349A1 - - Google Patents

Info

Publication number
FR2112349A1
FR2112349A1 FR7132569A FR7132569A FR2112349A1 FR 2112349 A1 FR2112349 A1 FR 2112349A1 FR 7132569 A FR7132569 A FR 7132569A FR 7132569 A FR7132569 A FR 7132569A FR 2112349 A1 FR2112349 A1 FR 2112349A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7132569A
Other languages
French (fr)
Other versions
FR2112349B1 (en:Method
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cutler Hammer International Finance Inc
Original Assignee
Cutler Hammer International Finance Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cutler Hammer International Finance Inc filed Critical Cutler Hammer International Finance Inc
Publication of FR2112349A1 publication Critical patent/FR2112349A1/fr
Application granted granted Critical
Publication of FR2112349B1 publication Critical patent/FR2112349B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR7132569A 1970-10-28 1971-09-09 Expired FR2112349B1 (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US8455670A 1970-10-28 1970-10-28

Publications (2)

Publication Number Publication Date
FR2112349A1 true FR2112349A1 (en:Method) 1972-06-16
FR2112349B1 FR2112349B1 (en:Method) 1976-09-03

Family

ID=22185714

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7132569A Expired FR2112349B1 (en:Method) 1970-10-28 1971-09-09

Country Status (3)

Country Link
US (1) US3688159A (en:Method)
DE (1) DE2153345A1 (en:Method)
FR (1) FR2112349B1 (en:Method)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CS180334B1 (en) * 1975-11-28 1977-12-30 Jiri Kovar Power semiconducting disc elements suppressing and jigging equipment
US4224663A (en) * 1979-02-01 1980-09-23 Power Control Corporation Mounting assembly for semiconductive controlled rectifiers
US4333101A (en) * 1979-07-19 1982-06-01 Flight Systems, Inc. Semiconductor heat sink mounting assembly
DE3429269A1 (de) * 1984-08-08 1986-02-20 Siemens AG, 1000 Berlin und 8000 München Gehaeuse mit rippen und/oder spitzen
US5305185A (en) * 1992-09-30 1994-04-19 Samarov Victor M Coplanar heatsink and electronics assembly
US5696664A (en) * 1996-03-27 1997-12-09 Siemens Energy & Automation, Inc. Basepan with integrally formed posts for mounting components by heat staking
US5940273A (en) * 1998-06-08 1999-08-17 Inductotherm Corp. Semiconductor clamping device
US6324073B1 (en) * 1998-12-22 2001-11-27 S&C Electric Co. Clamping arrangement for compression-mounted power electronic devices
EP1533637B1 (en) * 2002-06-27 2007-10-31 Jtekt Corporation Beam collecting device and laser emission device
EP1494278A1 (de) * 2003-07-04 2005-01-05 Siemens Aktiengesellschaft Elektronisches Leistungsmodul mit Gummidichtung und entsprechendes Herstellungsverfahren
DE102005050028A1 (de) * 2005-10-14 2007-04-19 Robert Bosch Gmbh Elektrische Vorrichtung, insbesondere zur Ansteuerung einer motorisch und/oder generatorisch betreibbaren elektrischen Maschine
AU2008207931B2 (en) * 2007-01-26 2014-05-22 Inductotherm Corp. Compression clamping of semiconductor components
DE202012007280U1 (de) 2012-07-30 2012-09-26 Abb Technology Ag Leistungshalbleiterspannstapel
US9655280B1 (en) * 2015-12-31 2017-05-16 Lockheed Martin Corporation Multi-directional force generating line-replaceable unit chassis by means of a linear spring
US12397362B2 (en) * 2021-07-01 2025-08-26 Mks Inc. GaN clamp with uniform pressure

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3536960A (en) * 1968-06-26 1970-10-27 Electric Regulator Corp Heat sink module
US3571663A (en) * 1969-01-08 1971-03-23 Chemetron Corp Releasable clamp assembly for a solid state circuit element

Also Published As

Publication number Publication date
US3688159A (en) 1972-08-29
FR2112349B1 (en:Method) 1976-09-03
DE2153345A1 (de) 1972-05-10

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Legal Events

Date Code Title Description
ST Notification of lapse