DE2145091A1 - Zinn Blei Indium Legierung - Google Patents
Zinn Blei Indium LegierungInfo
- Publication number
- DE2145091A1 DE2145091A1 DE19712145091 DE2145091A DE2145091A1 DE 2145091 A1 DE2145091 A1 DE 2145091A1 DE 19712145091 DE19712145091 DE 19712145091 DE 2145091 A DE2145091 A DE 2145091A DE 2145091 A1 DE2145091 A1 DE 2145091A1
- Authority
- DE
- Germany
- Prior art keywords
- tin
- indium
- lead
- percent
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000846 In alloy Inorganic materials 0.000 title description 5
- WBGNVADHURSIJJ-UHFFFAOYSA-N [In].[Pb].[Sn] Chemical compound [In].[Pb].[Sn] WBGNVADHURSIJJ-UHFFFAOYSA-N 0.000 title description 3
- 229910052738 indium Inorganic materials 0.000 claims description 18
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 18
- 230000008018 melting Effects 0.000 claims description 18
- 238000002844 melting Methods 0.000 claims description 18
- 229910045601 alloy Inorganic materials 0.000 claims description 15
- 239000000956 alloy Substances 0.000 claims description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 13
- 238000005476 soldering Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 description 16
- 230000005496 eutectics Effects 0.000 description 12
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 9
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- QXMJBXBECHTHAX-UHFFFAOYSA-N [Au].[Bi].[In] Chemical compound [Au].[Bi].[In] QXMJBXBECHTHAX-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000010587 phase diagram Methods 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Physical Vapour Deposition (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Conductive Materials (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7291270A | 1970-09-17 | 1970-09-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2145091A1 true DE2145091A1 (de) | 1972-03-23 |
Family
ID=22110514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19712145091 Pending DE2145091A1 (de) | 1970-09-17 | 1971-09-09 | Zinn Blei Indium Legierung |
Country Status (6)
| Country | Link |
|---|---|
| BE (1) | BE769784A (enExample) |
| DE (1) | DE2145091A1 (enExample) |
| ES (1) | ES395141A1 (enExample) |
| FR (1) | FR2105808A5 (enExample) |
| GB (1) | GB1294801A (enExample) |
| NL (1) | NL7111357A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5011658A (en) * | 1989-05-31 | 1991-04-30 | International Business Machines Corporation | Copper doped low melt solder for component assembly and rework |
| CN117488111A (zh) * | 2023-10-12 | 2024-02-02 | 中交天津港湾工程研究院有限公司 | 一种低熔点超塑性合金及其制备方法 |
-
1971
- 1971-06-18 GB GB2859771A patent/GB1294801A/en not_active Expired
- 1971-07-06 FR FR7126009A patent/FR2105808A5/fr not_active Expired
- 1971-07-09 BE BE769784A patent/BE769784A/xx unknown
- 1971-08-18 NL NL7111357A patent/NL7111357A/xx unknown
- 1971-09-09 DE DE19712145091 patent/DE2145091A1/de active Pending
- 1971-09-16 ES ES395141A patent/ES395141A1/es not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2105808A5 (enExample) | 1972-04-28 |
| NL7111357A (enExample) | 1972-03-21 |
| BE769784A (fr) | 1971-11-16 |
| GB1294801A (en) | 1972-11-01 |
| ES395141A1 (es) | 1973-12-16 |
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