DE2138554A1 - Tragaufbau fur eine elektronische Schaltung und Verfahren zu dessen Her stellung - Google Patents

Tragaufbau fur eine elektronische Schaltung und Verfahren zu dessen Her stellung

Info

Publication number
DE2138554A1
DE2138554A1 DE19712138554 DE2138554A DE2138554A1 DE 2138554 A1 DE2138554 A1 DE 2138554A1 DE 19712138554 DE19712138554 DE 19712138554 DE 2138554 A DE2138554 A DE 2138554A DE 2138554 A1 DE2138554 A1 DE 2138554A1
Authority
DE
Germany
Prior art keywords
lead frame
housing
electronic circuit
lines
support structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19712138554
Other languages
German (de)
English (en)
Inventor
David Anaheim Lee Chune Costa Mesa Calif Nixen (V St A)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Boeing North American Inc
Original Assignee
North American Rockwell Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by North American Rockwell Corp filed Critical North American Rockwell Corp
Publication of DE2138554A1 publication Critical patent/DE2138554A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE19712138554 1970-08-10 1971-08-02 Tragaufbau fur eine elektronische Schaltung und Verfahren zu dessen Her stellung Pending DE2138554A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US6237570A 1970-08-10 1970-08-10

Publications (1)

Publication Number Publication Date
DE2138554A1 true DE2138554A1 (de) 1972-02-17

Family

ID=22042069

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712138554 Pending DE2138554A1 (de) 1970-08-10 1971-08-02 Tragaufbau fur eine elektronische Schaltung und Verfahren zu dessen Her stellung

Country Status (5)

Country Link
JP (1) JPS5139509B1 (https=)
CA (1) CA931284A (https=)
DE (1) DE2138554A1 (https=)
FR (1) FR2104144A5 (https=)
GB (1) GB1320835A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2368175A1 (fr) * 1976-10-13 1978-05-12 Matra Engins Convertisseur statique modulaire pour machines a reluctance variable
JPS5733459U (https=) * 1980-07-30 1982-02-22

Also Published As

Publication number Publication date
JPS5139509B1 (https=) 1976-10-28
CA931284A (en) 1973-07-31
FR2104144A5 (https=) 1972-04-14
GB1320835A (en) 1973-06-20

Similar Documents

Publication Publication Date Title
DE69430513T2 (de) Harzvergossenes Halbleiterbauteil und dessen Herstellungsverfahren
DE102009032973B4 (de) Leistungshalbleitervorrichtung
DE10066442B4 (de) Halbleitervorrichtung mit Abstrahlungs-Struktur
DE69224343T2 (de) Halbleiteranordnung mit Kühlerstruktur und Verfahren zur Herstellung
DE19708002B4 (de) Anschlußrahmen für Halbleiterbauelement
DE102009055691B4 (de) Leistungshalbleitermodul
DE68910385T2 (de) Herstellungsverfahren einer elektronischen Speicherkarte und elektronische Speicherkarte, die nach diesem Verfahren hergestellt ist.
DE10149093A1 (de) Halbleiterbauelement und Verfahren zu dessen Herstellung
DE69528960T2 (de) Leiterrahmen mit mehreren leitenden schichten
DE102009044659A1 (de) Leistungshalbleitermodul
DE112008000229T5 (de) Leistungshalbleitervorrichtung
DE102005050330A1 (de) Halbleitervorrichtung und Herstellungsverfahren dafür
DE69534483T2 (de) Leiterrahmen und Halbleiterbauelement
DE102009035623B4 (de) Verfahren zum Herstellen einer Halbleitervorrichtung, Anordnung aus integrierten Leistungsgehäusen, integriertes Leistungshalbleitergehäuse und Verfahren zum Herstellen von Halbleitergehäusen
DE112006003372T5 (de) Vorrichtung und Verfahren zur Montage eines oben und unten freiliegenden eingehausten Halbleiters
DE968077C (de) Verfahren zur Herstellung von Kristallgleichrichtern
DE2937050A1 (de) Flachpaket zur aufnahme von elektrischen mikroschaltkreisen und verfahren zu seiner herstellung
DE69417329T2 (de) In Harz versiegelte Halbleiteranordnung
DE102013100339A1 (de) Elektronisches Bauelement und ein Verfahren zur Herstellung eines elektronischen Bauelements
DE2937051A1 (de) Flachpaket zur aufnahme von elektrischen mikroschaltkreisen und verfahren zu seiner herstellung
DE2925509A1 (de) Packung fuer schaltungselemente
DE2117365A1 (de) Integrierte Schaltung und Verfahren zu ihrer Herstellung
DE2306288A1 (de) Traeger fuer integrierte schaltungen
DE3884019T2 (de) Verfahren zum Herstellen einer Modul-Halbleiter-Leistungsanordnung und hergestellte Anordnung.
DE2318736A1 (de) Verfahren zum abdichten von umhuellungen fuer elektrische teile

Legal Events

Date Code Title Description
OHA Expiration of time for request for examination