DE2134291A1 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung

Info

Publication number
DE2134291A1
DE2134291A1 DE19712134291 DE2134291A DE2134291A1 DE 2134291 A1 DE2134291 A1 DE 2134291A1 DE 19712134291 DE19712134291 DE 19712134291 DE 2134291 A DE2134291 A DE 2134291A DE 2134291 A1 DE2134291 A1 DE 2134291A1
Authority
DE
Germany
Prior art keywords
layer
molybdenum
silicon
nickel
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19712134291
Other languages
German (de)
English (en)
Inventor
Kiyotake Kokubunjji; Sano Hisumi Tokio; Itoh Yokichi Hachioji Tokio; Naraoka (Japan). M HOIl 1-10
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE2134291A1 publication Critical patent/DE2134291A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
DE19712134291 1970-07-10 1971-07-09 Halbleitervorrichtung Pending DE2134291A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP45059913A JPS506139B1 (enExample) 1970-07-10 1970-07-10

Publications (1)

Publication Number Publication Date
DE2134291A1 true DE2134291A1 (de) 1972-02-17

Family

ID=13126826

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712134291 Pending DE2134291A1 (de) 1970-07-10 1971-07-09 Halbleitervorrichtung

Country Status (3)

Country Link
US (1) US3746944A (enExample)
JP (1) JPS506139B1 (enExample)
DE (1) DE2134291A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0030634A1 (en) * 1979-12-17 1981-06-24 International Business Machines Corporation Nickel-X/gold/nickel-X conductors for solid state devices

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3886585A (en) * 1973-07-02 1975-05-27 Gen Motors Corp Solderable multilayer contact for silicon semiconductor
US4096510A (en) * 1974-08-19 1978-06-20 Matsushita Electric Industrial Co., Ltd. Thermal printing head
US4494136A (en) * 1979-10-04 1985-01-15 Wisconsin Alumni Research Foundation Semiconductor device having an amorphous metal layer contact
US4350994A (en) * 1979-10-04 1982-09-21 Wisconsin Alumni Research Foundation Semiconductor device having an amorphous metal layer contact
US4737839A (en) * 1984-03-19 1988-04-12 Trilogy Computer Development Partners, Ltd. Semiconductor chip mounting system
US5438244A (en) * 1994-09-02 1995-08-01 General Electric Company Use of silver and nickel silicide to control iodine level in electrodeless high intensity discharge lamps

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1570259A (enExample) * 1967-07-01 1969-06-06
US3545076A (en) * 1967-08-22 1970-12-08 Bosch Gmbh Robert Process of forming contacts on electrical parts,particularly silicon semiconductors
US3508124A (en) * 1968-03-11 1970-04-21 Sylvania Electric Prod Semiconductor device and method of manufacture
US3566209A (en) * 1968-08-28 1971-02-23 Westinghouse Electric Corp Double-sintered gold-nickel electrical contact for compression-bonded electrical devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0030634A1 (en) * 1979-12-17 1981-06-24 International Business Machines Corporation Nickel-X/gold/nickel-X conductors for solid state devices

Also Published As

Publication number Publication date
JPS506139B1 (enExample) 1975-03-11
US3746944A (en) 1973-07-17

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