DE2105513C3 - Infrarotlötverfahren für das Befestigen von Bauteilen durch Wiederaufschmelzen von Lot sowie Lötvorrichtung zur Durchführung des Verfahrens - Google Patents
Infrarotlötverfahren für das Befestigen von Bauteilen durch Wiederaufschmelzen von Lot sowie Lötvorrichtung zur Durchführung des VerfahrensInfo
- Publication number
- DE2105513C3 DE2105513C3 DE2105513A DE2105513A DE2105513C3 DE 2105513 C3 DE2105513 C3 DE 2105513C3 DE 2105513 A DE2105513 A DE 2105513A DE 2105513 A DE2105513 A DE 2105513A DE 2105513 C3 DE2105513 C3 DE 2105513C3
- Authority
- DE
- Germany
- Prior art keywords
- infrared
- soldering
- carrier
- infrared light
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 title claims description 34
- 229910000679 solder Inorganic materials 0.000 title claims description 21
- 238000000034 method Methods 0.000 title claims description 17
- 239000011521 glass Substances 0.000 claims description 19
- 239000000919 ceramic Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000004313 glare Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 241000047428 Halter Species 0.000 description 1
- 241001370405 Lichia Species 0.000 description 1
- 235000010678 Paulownia tomentosa Nutrition 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0053—Soldering by means of radiant energy soldering by means of I.R.
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2105513A DE2105513C3 (de) | 1971-02-05 | 1971-02-05 | Infrarotlötverfahren für das Befestigen von Bauteilen durch Wiederaufschmelzen von Lot sowie Lötvorrichtung zur Durchführung des Verfahrens |
| GB6090871A GB1324348A (en) | 1971-02-05 | 1971-12-31 | Methods of securing electrical components to a carrier plate by infra-red soldering |
| NL7200194A NL7200194A (enExample) | 1971-02-05 | 1972-01-06 | |
| US00217727A US3764772A (en) | 1971-02-05 | 1972-01-14 | Apparatus for infrared soldering |
| IT20105/72A IT947213B (it) | 1971-02-05 | 1972-02-02 | Procedimento di saldatura a raggi infrarossi per fissare componenti mediante rifusione di materiale di saldatura nonche dispositivo di saldatura per attuare il pro cedimento |
| FR7203746A FR2124472B1 (enExample) | 1971-02-05 | 1972-02-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2105513A DE2105513C3 (de) | 1971-02-05 | 1971-02-05 | Infrarotlötverfahren für das Befestigen von Bauteilen durch Wiederaufschmelzen von Lot sowie Lötvorrichtung zur Durchführung des Verfahrens |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2105513A1 DE2105513A1 (de) | 1972-11-09 |
| DE2105513B2 DE2105513B2 (de) | 1973-03-08 |
| DE2105513C3 true DE2105513C3 (de) | 1973-09-27 |
Family
ID=5797930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2105513A Expired DE2105513C3 (de) | 1971-02-05 | 1971-02-05 | Infrarotlötverfahren für das Befestigen von Bauteilen durch Wiederaufschmelzen von Lot sowie Lötvorrichtung zur Durchführung des Verfahrens |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3764772A (enExample) |
| DE (1) | DE2105513C3 (enExample) |
| FR (1) | FR2124472B1 (enExample) |
| GB (1) | GB1324348A (enExample) |
| IT (1) | IT947213B (enExample) |
| NL (1) | NL7200194A (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4160893A (en) * | 1977-12-29 | 1979-07-10 | International Business Machines Corporation | Individual chip joining machine |
| US4356384A (en) * | 1980-03-03 | 1982-10-26 | Arnon Gat | Method and means for heat treating semiconductor material using high intensity CW lamps |
| US4685200A (en) * | 1982-01-18 | 1987-08-11 | Analog Devices, Incorporated | Low internal temperature technique for hermetic sealing of microelectronic enclosures |
| US4695705A (en) * | 1986-02-14 | 1987-09-22 | The J. M. Ney Company | Apparatus and method for localized heating of an object at precise temperatures |
| US4719810A (en) * | 1986-05-15 | 1988-01-19 | Usm Corporation | Drive mechanism for electrical component placement head |
| CA2069132C (en) * | 1991-08-29 | 1996-01-09 | Koji Fujii | Light-beam heating apparatus |
| US5457299A (en) * | 1993-10-29 | 1995-10-10 | International Business Machines Corporation | Semiconductor chip packaging method which heat cures an encapsulant deposited on a chip using a laser beam to heat the back side of the chip |
| WO1995018694A1 (en) * | 1994-01-04 | 1995-07-13 | Nauchno-Proizvodstvennaya Firma 'mgm' | Device for soldering with a light beam |
| DE19751352A1 (de) | 1997-11-20 | 1999-05-27 | Leica Geosystems Ag | Verfahren zur Lötbefestigung miniaturisierter Bauteile für eine Grundplatte |
| US6301436B1 (en) * | 2000-10-12 | 2001-10-09 | Yu-Ju Hsiao | Photothermic desoldering unit |
| US6956695B2 (en) * | 2001-03-19 | 2005-10-18 | Ikonisys, Inc. | System and method for increasing the contrast of an image produced by an epifluorescence microscope |
| US20090120916A1 (en) * | 2007-11-12 | 2009-05-14 | L3 Communications Corporation | Through-Via Laser Reflow Systems And Methods For Surface Mount Components |
| ITLE20080018A1 (it) * | 2008-10-08 | 2010-04-08 | Idaltermo S R L | Macchina saldatrice a raggi infrarossi per pannelli solari. |
| EP3015845A1 (en) * | 2014-11-03 | 2016-05-04 | Anton Paar TriTec SA | Heating arrangement for a material testing device |
| DE102015106298B4 (de) * | 2015-04-24 | 2017-01-26 | Semikron Elektronik Gmbh & Co. Kg | Vorrichtung, Verfahren und Anlage zur inhomogenen Abkühlung eines flächigen Gegenstandes |
| JP6866295B2 (ja) * | 2015-06-18 | 2021-04-28 | ダラン エス.ピー.エー. | 薄帯状シートに対して高精度なレーザ切断を実行するための方法及び該方法を実行するための装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2601011A (en) * | 1948-09-21 | 1952-06-17 | Westinghouse Electric Corp | Heating apparatus |
| BE627126A (enExample) * | 1962-01-15 | 1900-01-01 | ||
| US3486223A (en) * | 1967-04-27 | 1969-12-30 | Philco Ford Corp | Solder bonding |
| US3486004A (en) * | 1968-02-12 | 1969-12-23 | Time Research Lab Inc | High speed bonding apparatus |
| US3583063A (en) * | 1968-02-13 | 1971-06-08 | Motorola Inc | Process for soldering printed board assemblies utilizing paste solder and infrared radiation |
| US3562481A (en) * | 1969-04-29 | 1971-02-09 | Laurice J West | Substrate soldering system |
-
1971
- 1971-02-05 DE DE2105513A patent/DE2105513C3/de not_active Expired
- 1971-12-31 GB GB6090871A patent/GB1324348A/en not_active Expired
-
1972
- 1972-01-06 NL NL7200194A patent/NL7200194A/xx unknown
- 1972-01-14 US US00217727A patent/US3764772A/en not_active Expired - Lifetime
- 1972-02-02 IT IT20105/72A patent/IT947213B/it active
- 1972-02-04 FR FR7203746A patent/FR2124472B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2124472A1 (enExample) | 1972-09-22 |
| GB1324348A (en) | 1973-07-25 |
| IT947213B (it) | 1973-05-21 |
| DE2105513B2 (de) | 1973-03-08 |
| FR2124472B1 (enExample) | 1975-10-24 |
| DE2105513A1 (de) | 1972-11-09 |
| US3764772A (en) | 1973-10-09 |
| NL7200194A (enExample) | 1972-08-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C3 | Grant after two publication steps (3rd publication) | ||
| E77 | Valid patent as to the heymanns-index 1977 | ||
| 8339 | Ceased/non-payment of the annual fee |