IT947213B - Procedimento di saldatura a raggi infrarossi per fissare componenti mediante rifusione di materiale di saldatura nonche dispositivo di saldatura per attuare il pro cedimento - Google Patents

Procedimento di saldatura a raggi infrarossi per fissare componenti mediante rifusione di materiale di saldatura nonche dispositivo di saldatura per attuare il pro cedimento

Info

Publication number
IT947213B
IT947213B IT20105/72A IT2010572A IT947213B IT 947213 B IT947213 B IT 947213B IT 20105/72 A IT20105/72 A IT 20105/72A IT 2010572 A IT2010572 A IT 2010572A IT 947213 B IT947213 B IT 947213B
Authority
IT
Italy
Prior art keywords
welding
implement
procedure
well
refusing
Prior art date
Application number
IT20105/72A
Other languages
English (en)
Italian (it)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of IT947213B publication Critical patent/IT947213B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0053—Soldering by means of radiant energy soldering by means of I.R.
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
IT20105/72A 1971-02-05 1972-02-02 Procedimento di saldatura a raggi infrarossi per fissare componenti mediante rifusione di materiale di saldatura nonche dispositivo di saldatura per attuare il pro cedimento IT947213B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2105513A DE2105513C3 (de) 1971-02-05 1971-02-05 Infrarotlötverfahren für das Befestigen von Bauteilen durch Wiederaufschmelzen von Lot sowie Lötvorrichtung zur Durchführung des Verfahrens

Publications (1)

Publication Number Publication Date
IT947213B true IT947213B (it) 1973-05-21

Family

ID=5797930

Family Applications (1)

Application Number Title Priority Date Filing Date
IT20105/72A IT947213B (it) 1971-02-05 1972-02-02 Procedimento di saldatura a raggi infrarossi per fissare componenti mediante rifusione di materiale di saldatura nonche dispositivo di saldatura per attuare il pro cedimento

Country Status (6)

Country Link
US (1) US3764772A (enExample)
DE (1) DE2105513C3 (enExample)
FR (1) FR2124472B1 (enExample)
GB (1) GB1324348A (enExample)
IT (1) IT947213B (enExample)
NL (1) NL7200194A (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4160893A (en) * 1977-12-29 1979-07-10 International Business Machines Corporation Individual chip joining machine
US4356384A (en) * 1980-03-03 1982-10-26 Arnon Gat Method and means for heat treating semiconductor material using high intensity CW lamps
US4685200A (en) * 1982-01-18 1987-08-11 Analog Devices, Incorporated Low internal temperature technique for hermetic sealing of microelectronic enclosures
US4695705A (en) * 1986-02-14 1987-09-22 The J. M. Ney Company Apparatus and method for localized heating of an object at precise temperatures
US4719810A (en) * 1986-05-15 1988-01-19 Usm Corporation Drive mechanism for electrical component placement head
CA2069132C (en) * 1991-08-29 1996-01-09 Koji Fujii Light-beam heating apparatus
US5457299A (en) * 1993-10-29 1995-10-10 International Business Machines Corporation Semiconductor chip packaging method which heat cures an encapsulant deposited on a chip using a laser beam to heat the back side of the chip
WO1995018694A1 (en) * 1994-01-04 1995-07-13 Nauchno-Proizvodstvennaya Firma 'mgm' Device for soldering with a light beam
DE19751352A1 (de) 1997-11-20 1999-05-27 Leica Geosystems Ag Verfahren zur Lötbefestigung miniaturisierter Bauteile für eine Grundplatte
US6301436B1 (en) * 2000-10-12 2001-10-09 Yu-Ju Hsiao Photothermic desoldering unit
US6956695B2 (en) * 2001-03-19 2005-10-18 Ikonisys, Inc. System and method for increasing the contrast of an image produced by an epifluorescence microscope
US20090120916A1 (en) * 2007-11-12 2009-05-14 L3 Communications Corporation Through-Via Laser Reflow Systems And Methods For Surface Mount Components
ITLE20080018A1 (it) * 2008-10-08 2010-04-08 Idaltermo S R L Macchina saldatrice a raggi infrarossi per pannelli solari.
EP3015845A1 (en) * 2014-11-03 2016-05-04 Anton Paar TriTec SA Heating arrangement for a material testing device
DE102015106298B4 (de) * 2015-04-24 2017-01-26 Semikron Elektronik Gmbh & Co. Kg Vorrichtung, Verfahren und Anlage zur inhomogenen Abkühlung eines flächigen Gegenstandes
JP6866295B2 (ja) * 2015-06-18 2021-04-28 ダラン エス．ピー．エー． 薄帯状シートに対して高精度なレーザ切断を実行するための方法及び該方法を実行するための装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2601011A (en) * 1948-09-21 1952-06-17 Westinghouse Electric Corp Heating apparatus
BE627126A (enExample) * 1962-01-15 1900-01-01
US3486223A (en) * 1967-04-27 1969-12-30 Philco Ford Corp Solder bonding
US3486004A (en) * 1968-02-12 1969-12-23 Time Research Lab Inc High speed bonding apparatus
US3583063A (en) * 1968-02-13 1971-06-08 Motorola Inc Process for soldering printed board assemblies utilizing paste solder and infrared radiation
US3562481A (en) * 1969-04-29 1971-02-09 Laurice J West Substrate soldering system

Also Published As

Publication number Publication date
DE2105513C3 (de) 1973-09-27
FR2124472A1 (enExample) 1972-09-22
GB1324348A (en) 1973-07-25
DE2105513B2 (de) 1973-03-08
FR2124472B1 (enExample) 1975-10-24
DE2105513A1 (de) 1972-11-09
US3764772A (en) 1973-10-09
NL7200194A (enExample) 1972-08-08

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