DE2104726A1 - Halbleiterbauelement - Google Patents
HalbleiterbauelementInfo
- Publication number
- DE2104726A1 DE2104726A1 DE19712104726 DE2104726A DE2104726A1 DE 2104726 A1 DE2104726 A1 DE 2104726A1 DE 19712104726 DE19712104726 DE 19712104726 DE 2104726 A DE2104726 A DE 2104726A DE 2104726 A1 DE2104726 A1 DE 2104726A1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor
- thyristor
- semiconductor component
- surface part
- component according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
Landscapes
- Thyristors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US745370A | 1970-02-02 | 1970-02-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2104726A1 true DE2104726A1 (de) | 1972-08-10 |
Family
ID=21726248
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19712104726 Pending DE2104726A1 (de) | 1970-02-02 | 1971-02-02 | Halbleiterbauelement |
| DE19717103749U Expired DE7103749U (de) | 1970-02-02 | 1971-02-02 | Halbleiterbauelement |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19717103749U Expired DE7103749U (de) | 1970-02-02 | 1971-02-02 | Halbleiterbauelement |
Country Status (5)
| Country | Link |
|---|---|
| DE (2) | DE2104726A1 (https=) |
| FR (1) | FR2079196A1 (https=) |
| GB (1) | GB1349478A (https=) |
| IE (1) | IE34925B1 (https=) |
| SE (1) | SE372847B (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2728313A1 (de) * | 1977-06-23 | 1979-01-04 | Siemens Ag | Halbleiterbauelement |
| DE2848252A1 (de) * | 1977-11-07 | 1979-05-10 | Mitsubishi Electric Corp | Flachpack-halbleitervorrichtung |
| EP1670056B1 (de) * | 2004-12-08 | 2014-06-11 | Semikron Elektronik GmbH & Co. KG Patentabteilung | Leistungshalbleitermodul mit Hilfsanschluss |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2412168A1 (fr) * | 1977-12-15 | 1979-07-13 | Silicium Semiconducteur Ssc | Diodes ecreteuses de surtension |
| DE2812700A1 (de) * | 1978-03-23 | 1979-12-06 | Bbc Brown Boveri & Cie | Halbleiteranordnung mit zwei halbleiterelementen |
| JPS55500163A (https=) * | 1978-03-23 | 1980-03-27 | ||
| JPH0714029B2 (ja) * | 1990-02-07 | 1995-02-15 | 日本碍子株式会社 | 電力用半導体素子 |
| US5229915A (en) * | 1990-02-07 | 1993-07-20 | Ngk Insulators, Ltd. | Power semiconductor device with heat dissipating property |
| JP2845739B2 (ja) * | 1993-11-29 | 1999-01-13 | 三菱電機株式会社 | 圧接型半導体装置及びその製造方法 |
| DE102009034138B4 (de) * | 2009-07-22 | 2011-06-01 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit einem Sandwich mit einem Leistungshalbleiterbauelement |
-
1971
- 1971-02-02 DE DE19712104726 patent/DE2104726A1/de active Pending
- 1971-02-02 DE DE19717103749U patent/DE7103749U/de not_active Expired
- 1971-02-02 SE SE7101263A patent/SE372847B/xx unknown
- 1971-02-02 IE IE123/71A patent/IE34925B1/xx unknown
- 1971-02-02 FR FR7103493A patent/FR2079196A1/fr not_active Withdrawn
- 1971-04-19 GB GB2082671A patent/GB1349478A/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2728313A1 (de) * | 1977-06-23 | 1979-01-04 | Siemens Ag | Halbleiterbauelement |
| DE2848252A1 (de) * | 1977-11-07 | 1979-05-10 | Mitsubishi Electric Corp | Flachpack-halbleitervorrichtung |
| EP1670056B1 (de) * | 2004-12-08 | 2014-06-11 | Semikron Elektronik GmbH & Co. KG Patentabteilung | Leistungshalbleitermodul mit Hilfsanschluss |
Also Published As
| Publication number | Publication date |
|---|---|
| SE372847B (https=) | 1975-01-13 |
| IE34925B1 (en) | 1975-09-17 |
| IE34925L (en) | 1971-08-02 |
| FR2079196A1 (https=) | 1971-11-12 |
| GB1349478A (en) | 1974-04-03 |
| DE7103749U (de) | 1971-10-28 |
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