IE34925B1 - Semiconductor module - Google Patents

Semiconductor module

Info

Publication number
IE34925B1
IE34925B1 IE123/71A IE12371A IE34925B1 IE 34925 B1 IE34925 B1 IE 34925B1 IE 123/71 A IE123/71 A IE 123/71A IE 12371 A IE12371 A IE 12371A IE 34925 B1 IE34925 B1 IE 34925B1
Authority
IE
Ireland
Prior art keywords
semiconductor module
semiconductor
module
Prior art date
Application number
IE123/71A
Other languages
English (en)
Other versions
IE34925L (en
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of IE34925L publication Critical patent/IE34925L/xx
Publication of IE34925B1 publication Critical patent/IE34925B1/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
IE123/71A 1970-02-02 1971-02-02 Semiconductor module IE34925B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US745370A 1970-02-02 1970-02-02

Publications (2)

Publication Number Publication Date
IE34925L IE34925L (en) 1971-08-02
IE34925B1 true IE34925B1 (en) 1975-09-17

Family

ID=21726248

Family Applications (1)

Application Number Title Priority Date Filing Date
IE123/71A IE34925B1 (en) 1970-02-02 1971-02-02 Semiconductor module

Country Status (5)

Country Link
DE (2) DE2104726A1 (https=)
FR (1) FR2079196A1 (https=)
GB (1) GB1349478A (https=)
IE (1) IE34925B1 (https=)
SE (1) SE372847B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2728313A1 (de) * 1977-06-23 1979-01-04 Siemens Ag Halbleiterbauelement
US4274106A (en) * 1977-11-07 1981-06-16 Mitsubishi Denki Kabushiki Kaisha Explosion proof vibration resistant flat package semiconductor device
FR2412168A1 (fr) * 1977-12-15 1979-07-13 Silicium Semiconducteur Ssc Diodes ecreteuses de surtension
DE2812700A1 (de) * 1978-03-23 1979-12-06 Bbc Brown Boveri & Cie Halbleiteranordnung mit zwei halbleiterelementen
JPS55500163A (https=) * 1978-03-23 1980-03-27
JPH0714029B2 (ja) * 1990-02-07 1995-02-15 日本碍子株式会社 電力用半導体素子
US5229915A (en) * 1990-02-07 1993-07-20 Ngk Insulators, Ltd. Power semiconductor device with heat dissipating property
JP2845739B2 (ja) * 1993-11-29 1999-01-13 三菱電機株式会社 圧接型半導体装置及びその製造方法
DE102004058946B4 (de) * 2004-12-08 2009-06-18 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Hilfsanschluss
DE102009034138B4 (de) * 2009-07-22 2011-06-01 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit einem Sandwich mit einem Leistungshalbleiterbauelement

Also Published As

Publication number Publication date
SE372847B (https=) 1975-01-13
DE2104726A1 (de) 1972-08-10
IE34925L (en) 1971-08-02
FR2079196A1 (https=) 1971-11-12
GB1349478A (en) 1974-04-03
DE7103749U (de) 1971-10-28

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