GB1349478A - Semiconductor module - Google Patents

Semiconductor module

Info

Publication number
GB1349478A
GB1349478A GB2082671A GB2082671A GB1349478A GB 1349478 A GB1349478 A GB 1349478A GB 2082671 A GB2082671 A GB 2082671A GB 2082671 A GB2082671 A GB 2082671A GB 1349478 A GB1349478 A GB 1349478A
Authority
GB
United Kingdom
Prior art keywords
semiconductor module
semiconductor
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2082671A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of GB1349478A publication Critical patent/GB1349478A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
GB2082671A 1970-02-02 1971-04-19 Semiconductor module Expired GB1349478A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US745370A 1970-02-02 1970-02-02

Publications (1)

Publication Number Publication Date
GB1349478A true GB1349478A (en) 1974-04-03

Family

ID=21726248

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2082671A Expired GB1349478A (en) 1970-02-02 1971-04-19 Semiconductor module

Country Status (5)

Country Link
DE (2) DE2104726A1 (https=)
FR (1) FR2079196A1 (https=)
GB (1) GB1349478A (https=)
IE (1) IE34925B1 (https=)
SE (1) SE372847B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4442295A1 (de) * 1993-11-29 1995-06-01 Mitsubishi Electric Corp Halbleitervorrichtung in Druckverbindungsausführung und Verfahren zu deren Herstellung
EP2278616A3 (de) * 2009-07-22 2011-04-20 SEMIKRON Elektronik GmbH & Co. KG Leistungshalbleitermodul mit einem Sandwich mit einem Leistungshalbleiterbauelement

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2728313A1 (de) * 1977-06-23 1979-01-04 Siemens Ag Halbleiterbauelement
US4274106A (en) * 1977-11-07 1981-06-16 Mitsubishi Denki Kabushiki Kaisha Explosion proof vibration resistant flat package semiconductor device
FR2412168A1 (fr) * 1977-12-15 1979-07-13 Silicium Semiconducteur Ssc Diodes ecreteuses de surtension
DE2812700A1 (de) * 1978-03-23 1979-12-06 Bbc Brown Boveri & Cie Halbleiteranordnung mit zwei halbleiterelementen
JPS55500163A (https=) * 1978-03-23 1980-03-27
JPH0714029B2 (ja) * 1990-02-07 1995-02-15 日本碍子株式会社 電力用半導体素子
US5229915A (en) * 1990-02-07 1993-07-20 Ngk Insulators, Ltd. Power semiconductor device with heat dissipating property
DE102004058946B4 (de) * 2004-12-08 2009-06-18 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Hilfsanschluss

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4442295A1 (de) * 1993-11-29 1995-06-01 Mitsubishi Electric Corp Halbleitervorrichtung in Druckverbindungsausführung und Verfahren zu deren Herstellung
EP2278616A3 (de) * 2009-07-22 2011-04-20 SEMIKRON Elektronik GmbH & Co. KG Leistungshalbleitermodul mit einem Sandwich mit einem Leistungshalbleiterbauelement

Also Published As

Publication number Publication date
SE372847B (https=) 1975-01-13
IE34925B1 (en) 1975-09-17
DE2104726A1 (de) 1972-08-10
IE34925L (en) 1971-08-02
FR2079196A1 (https=) 1971-11-12
DE7103749U (de) 1971-10-28

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees