DE20302177U1 - Rahmen und damit hergestellter, mikrotechnischer Baustein sowie aus derartigen Bausteinen zusammengesetzte Systemkomponente - Google Patents

Rahmen und damit hergestellter, mikrotechnischer Baustein sowie aus derartigen Bausteinen zusammengesetzte Systemkomponente

Info

Publication number
DE20302177U1
DE20302177U1 DE20302177U DE20302177U DE20302177U1 DE 20302177 U1 DE20302177 U1 DE 20302177U1 DE 20302177 U DE20302177 U DE 20302177U DE 20302177 U DE20302177 U DE 20302177U DE 20302177 U1 DE20302177 U1 DE 20302177U1
Authority
DE
Germany
Prior art keywords
frame
passages
micro
components
frame part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20302177U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EFM SYSTEMS GmbH
Original Assignee
EFM SYSTEMS GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EFM SYSTEMS GmbH filed Critical EFM SYSTEMS GmbH
Priority to DE20302177U priority Critical patent/DE20302177U1/de
Priority to DE20308235U priority patent/DE20308235U1/de
Publication of DE20302177U1 publication Critical patent/DE20302177U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/0651—Wire or wire-like electrical connections from device to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06527—Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/1627—Disposition stacked type assemblies, e.g. stacked multi-cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Packaging Frangible Articles (AREA)
  • Combinations Of Printed Boards (AREA)

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt

Claims (11)

1. Rahmen für den modularen, vertikalen Aufbau von mikrotechnischen Bausteinen (1, 1a) mit einem aus einem elektrisch nicht leitenden Material hergestellten Rahmenteil (9) und einer Mehrzahl von mit diesem verbundenen, elektrisch leitenden Durchkon­ taktierungen (10), wobei das Rahmenteil (9) mit je einer oberen und unteren Breitseite (18, 19) und mit je einer äußeren und inneren Umfangsfläche (21, 22) versehen ist und die Durchkontaktierungen (10) an der oberen und unteren Breitseite (18, 19) angeordnete Kontaktflächen (10a) und diese verbindende Kontaktmittel aufweisen, dadurch gekennzeichnet, daß die Durchkontaktierungen (10) U-förmig ausgebildet sind und an der äußeren Umfangsfläche (22) verlegte, die Kontaktflächen (10a) verbinden­ de Leiterbahnen (10b) aufweisen.
2. Rahmen nach Anspruch 1, dadurch gekennzeichnet, daß das Rahmenteil (9) mit wenigstens zwei, im wesentlichen senkrecht zu den Breitseiten (18, 19) angeordneten, als Positionierhilfen dienenden Durchgängen (24) versehen ist.
3. Rahmen nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß das Rahmenteil (9) mit nutenartigen, zur Aufnahme der Durchkontaktierungen (10) bestimmten Aus­ nehmungen (23) versehen ist.
4. Rahmen nach Anspruch 2 oder 3, dadurch gekennzeichnet, daß das Rahmenteil (9) eine rechteckige oder quadratische Grundform besitzt und die Durchgänge (24) an wenigstens zwei Ecken vorgesehen sind.
5. Rahmen nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß das Rahmenteil (9) aus einem Kunststoff-Spritzgußteil besteht.
6. Mikrotechnischer Baustein mit modularem, vertikalem Aufbau, enthaltend wenig­ stens eine Trägerplatine (2) mit wenigstens einem mikrotechnischen Funktionselement (6), wenigstens einen auf die Trägerplatine (2) aufgesetzten, das Funktionselement (6) umgebenden Rahmen (3) und je eine mit der Trägerplatine (2) bzw. dem Rahmen (3) verbindende Boden- und Deckelplatine (4, 5), dadurch gekennzeichnet, daß der Rahmen (3) nach wenigstens einem der Ansprüche 1 bis 5 ausgebildet ist.
7. Baustein nach Anspruch 6, dadurch gekennzeichnet, daß die Träger-, Boden-, und/oder Deckelplatinen (2, 4, 5) wenigstens je drei, auf die Durchgänge (24) des Rahmens (3) ausgerichtete Durchgänge (25) aufweisen.
8. Baustein nach Anspruch 6 oder 7, dadurch gekennzeichnet, daß die Träger-, Boden, und Deckelplatinen (2, 4, 5) durch Löten fest miteinander verbunden sind.
9. Mikrotechnische Systemkomponente mit wenigstens zwei übereinander angeord­ neten Bausteinen (1, 1a), dadurch gekennzeichnet, daß die Bausteine (1, 1a) nach wenigstens einem der Ansprüche 6 bis 8 ausgebildet und die Durchgänge (24, 25) von Positionierungsstiften (30) durchragt sind.
10. Systemkomponente nach Anspruch 9, dadurch gekennzeichnet, daß zwischen je zwei Bausteinen (1, 1a) ein elektrisch anisotrop leitfähiges Kontaktelement (31) angeordnet ist.
11. Systemkomponente nach Anspruch 9 oder 10, dadurch gekennzeichnet, daß die Bausteine (1, 1a) durch eine Spannvorrichtung (34) lösbar miteinander verbunden sind.
DE20302177U 2003-02-07 2003-02-07 Rahmen und damit hergestellter, mikrotechnischer Baustein sowie aus derartigen Bausteinen zusammengesetzte Systemkomponente Expired - Lifetime DE20302177U1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE20302177U DE20302177U1 (de) 2003-02-07 2003-02-07 Rahmen und damit hergestellter, mikrotechnischer Baustein sowie aus derartigen Bausteinen zusammengesetzte Systemkomponente
DE20308235U DE20308235U1 (de) 2003-02-07 2003-05-22 Einrichtung zur lösbaren Verbindung eines Stapels von übereinander angeordneten mikrotechnischen Bausteinen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20302177U DE20302177U1 (de) 2003-02-07 2003-02-07 Rahmen und damit hergestellter, mikrotechnischer Baustein sowie aus derartigen Bausteinen zusammengesetzte Systemkomponente

Publications (1)

Publication Number Publication Date
DE20302177U1 true DE20302177U1 (de) 2003-06-05

Family

ID=7979937

Family Applications (2)

Application Number Title Priority Date Filing Date
DE20302177U Expired - Lifetime DE20302177U1 (de) 2003-02-07 2003-02-07 Rahmen und damit hergestellter, mikrotechnischer Baustein sowie aus derartigen Bausteinen zusammengesetzte Systemkomponente
DE20308235U Expired - Lifetime DE20308235U1 (de) 2003-02-07 2003-05-22 Einrichtung zur lösbaren Verbindung eines Stapels von übereinander angeordneten mikrotechnischen Bausteinen

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE20308235U Expired - Lifetime DE20308235U1 (de) 2003-02-07 2003-05-22 Einrichtung zur lösbaren Verbindung eines Stapels von übereinander angeordneten mikrotechnischen Bausteinen

Country Status (1)

Country Link
DE (2) DE20302177U1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10353139B4 (de) * 2003-11-14 2008-12-04 Fachhochschule Stralsund Stapelbares modulares Gehäusesystem und ein Verfahren zu dessen Herstellung

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080164606A1 (en) * 2007-01-08 2008-07-10 Christoffer Graae Greisen Spacers for wafer bonding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10353139B4 (de) * 2003-11-14 2008-12-04 Fachhochschule Stralsund Stapelbares modulares Gehäusesystem und ein Verfahren zu dessen Herstellung

Also Published As

Publication number Publication date
DE20308235U1 (de) 2003-08-28

Similar Documents

Publication Publication Date Title
DE102009046403B4 (de) Leistungshalbleitermodul in Druckkontakttechnik
DE102006048230A1 (de) Leuchtdiodensystem, Verfahren zur Herstellung eines solchen und Hinterleuchtungseinrichtung
DE10325550A1 (de) Elektrisches Kontaktierungsverfahren
DE2634452A1 (de) Programmierbares dip-steckgehaeuse
DE20205787U1 (de) Modularer Steckverbinder
DE4021871A1 (de) Hochintegriertes elektronisches bauteil
CH667562A5 (de) Verfahren zum aendern einer elektrischen flachbaugruppe.
DE20300686U1 (de) Kartensteckverbinder
DE2407738A1 (de) Anordnung zur verbindung von einander gegenueberliegenden elektrischen leitern und verfahren zu deren herstellung
WO2015052117A1 (de) Elektronische schaltung
DE3710394A1 (de) Elektrische anschlussklemme fuer leiterplatten
DE20115659U1 (de) Gehäuse für ein elektronisches Steuergerät in Fahrzeugen
DE20302177U1 (de) Rahmen und damit hergestellter, mikrotechnischer Baustein sowie aus derartigen Bausteinen zusammengesetzte Systemkomponente
DE3524138C2 (de)
DE3641353C2 (de)
DE3614086C2 (de) Vorrichtung zur Wärmeableitung von einer elektronische Komponenten enthaltenden Baueinheit und Verfahren zum thermischen Koppeln einer elektronische Komponenten enthaltenden Baueinheit
DE102012104138B3 (de) Anschlusssystem für Solargeneratoren
DE102007035794A1 (de) Leiterplattenverbund sowie Verfahren zum Herstellen eines Leiterplattenverbundes
DE10010542A1 (de) Elektrische Komponente zum Oberflächenmontieren auf einer Leiterplatte
DE102005055487B3 (de) Elektronische Struktur mit über lötbare Verbindungselemente verbundenen Komponenten sowie Verfahren zu seiner Herstellung
DE1246836B (de) Steckbarer Baustein in Form einer gedruckten Schaltungskarte
DE3231380C2 (de) Verfahren zur Herstellung eines elektrischen Anschlusses
DE19939584A1 (de) Zur Montage auf eine Leiterplatte ausgelegtes Bauteil
DE1940160U (de) Elektronischer baustein.
EP1577916A1 (de) Schaltereinheit für ein Kraftfahrzeug

Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20030710

R156 Lapse of ip right after 3 years

Effective date: 20060901