DE102005055487B3 - Elektronische Struktur mit über lötbare Verbindungselemente verbundenen Komponenten sowie Verfahren zu seiner Herstellung - Google Patents
Elektronische Struktur mit über lötbare Verbindungselemente verbundenen Komponenten sowie Verfahren zu seiner Herstellung Download PDFInfo
- Publication number
- DE102005055487B3 DE102005055487B3 DE200510055487 DE102005055487A DE102005055487B3 DE 102005055487 B3 DE102005055487 B3 DE 102005055487B3 DE 200510055487 DE200510055487 DE 200510055487 DE 102005055487 A DE102005055487 A DE 102005055487A DE 102005055487 B3 DE102005055487 B3 DE 102005055487B3
- Authority
- DE
- Germany
- Prior art keywords
- connecting elements
- electronic structure
- production
- connected via
- components connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1023—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
- H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0379—Stacked conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10242—Metallic cylinders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0597—Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Connecting Device With Holders (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Zur vertikalen elektrischen Verbindung mehrerer Komponenten weist eine elektronische Struktur mit mindestens zwei Komponenten lötbare Verbindungselemente auf, die mindestens ein Sockelelement (1) und eine auf das Sockelelement (1) gestapelte Lotkugel (17) umfassen, wobei das Sockelelement (1) einen zylindrischen Kern (2) aus einem elektrisch leitenden ersten Material mit einer Mantelfläche (3), einer Bodenfläche (4) und einer Deckelfläche (5) aufweist, wobei der Kern (3) mit einer Ummantelung (6) aus einem elektrisch isolierenden zweiten Material derart umgeben ist, dass die Mantelfläche (3) des Kerns (2) von der Ummantelung (6) bedeckt ist und die Deckelfläche (5) und die Bodenfläche (4) von der Ummantelung (6) freigehalten sind.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200510055487 DE102005055487B3 (de) | 2005-11-18 | 2005-11-18 | Elektronische Struktur mit über lötbare Verbindungselemente verbundenen Komponenten sowie Verfahren zu seiner Herstellung |
US11/601,540 US7666777B2 (en) | 2005-11-18 | 2006-11-17 | Electronic structure with components connected by way of solderable connecting elements and method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200510055487 DE102005055487B3 (de) | 2005-11-18 | 2005-11-18 | Elektronische Struktur mit über lötbare Verbindungselemente verbundenen Komponenten sowie Verfahren zu seiner Herstellung |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102005055487B3 true DE102005055487B3 (de) | 2007-05-16 |
Family
ID=37982898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200510055487 Expired - Fee Related DE102005055487B3 (de) | 2005-11-18 | 2005-11-18 | Elektronische Struktur mit über lötbare Verbindungselemente verbundenen Komponenten sowie Verfahren zu seiner Herstellung |
Country Status (2)
Country | Link |
---|---|
US (1) | US7666777B2 (de) |
DE (1) | DE102005055487B3 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7755261B2 (en) | 2007-10-19 | 2010-07-13 | Seiko Epson Corporation | Electronic component, mounting structure thereof, and method for mounting electronic component |
JP5320950B2 (ja) * | 2008-10-01 | 2013-10-23 | オムロン株式会社 | コネクタ用接続端子およびこれを用いたコネクタ |
KR20100095268A (ko) * | 2009-02-20 | 2010-08-30 | 삼성전자주식회사 | 반도체 패키지 및 그 제조 방법 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5222014A (en) * | 1992-03-02 | 1993-06-22 | Motorola, Inc. | Three-dimensional multi-chip pad array carrier |
US5641113A (en) * | 1994-06-30 | 1997-06-24 | Oki Electronic Industry Co., Ltd. | Method for fabricating an electronic device having solder joints |
US6097097A (en) * | 1996-08-20 | 2000-08-01 | Fujitsu Limited | Semiconductor device face-down bonded with pillars |
US6278184B1 (en) * | 1997-07-09 | 2001-08-21 | International Business Machines Corporation | Solder disc connection |
US6569753B1 (en) * | 2000-06-08 | 2003-05-27 | Micron Technology, Inc. | Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same |
US6740546B2 (en) * | 2002-08-21 | 2004-05-25 | Micron Technology, Inc. | Packaged microelectronic devices and methods for assembling microelectronic devices |
US6800169B2 (en) * | 2001-01-08 | 2004-10-05 | Fujitsu Limited | Method for joining conductive structures and an electrical conductive article |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2833326B2 (ja) * | 1992-03-03 | 1998-12-09 | 松下電器産業株式会社 | 電子部品実装接続体およびその製造方法 |
EP0747954A3 (de) | 1995-06-07 | 1997-05-07 | Ibm | Lötkugel mit einer Metallkappe niedrigen Schmelzpunktes |
US5841198A (en) | 1997-04-21 | 1998-11-24 | Lsi Logic Corporation | Ball grid array package employing solid core solder balls |
-
2005
- 2005-11-18 DE DE200510055487 patent/DE102005055487B3/de not_active Expired - Fee Related
-
2006
- 2006-11-17 US US11/601,540 patent/US7666777B2/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5222014A (en) * | 1992-03-02 | 1993-06-22 | Motorola, Inc. | Three-dimensional multi-chip pad array carrier |
US5641113A (en) * | 1994-06-30 | 1997-06-24 | Oki Electronic Industry Co., Ltd. | Method for fabricating an electronic device having solder joints |
US6097097A (en) * | 1996-08-20 | 2000-08-01 | Fujitsu Limited | Semiconductor device face-down bonded with pillars |
US6278184B1 (en) * | 1997-07-09 | 2001-08-21 | International Business Machines Corporation | Solder disc connection |
US6569753B1 (en) * | 2000-06-08 | 2003-05-27 | Micron Technology, Inc. | Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same |
US6800169B2 (en) * | 2001-01-08 | 2004-10-05 | Fujitsu Limited | Method for joining conductive structures and an electrical conductive article |
US6740546B2 (en) * | 2002-08-21 | 2004-05-25 | Micron Technology, Inc. | Packaged microelectronic devices and methods for assembling microelectronic devices |
Also Published As
Publication number | Publication date |
---|---|
US7666777B2 (en) | 2010-02-23 |
US20070117424A1 (en) | 2007-05-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE19940695B4 (de) | Elektronisches Mediagerät | |
DE112010005092T5 (de) | Leiterplatte | |
DE202018105085U1 (de) | Elektrischer Verbinder mit Filterfunktion | |
DE102006058694B4 (de) | Leistungshalbleitermodul mit Kontaktfedern | |
DE102015104185A1 (de) | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung | |
DE102008050627B4 (de) | Stromanschlusskasten | |
DE602005005138T2 (de) | Miniaturisiertes Bilderzeugungsmodul | |
DE102011086331A1 (de) | Anschlussklemme | |
DE10333328B3 (de) | Leistungshalbleitermodul in skalierbarer Aufbautechnik | |
DE202011104301U1 (de) | Elektrische Anschlussklemme | |
DE102005055487B3 (de) | Elektronische Struktur mit über lötbare Verbindungselemente verbundenen Komponenten sowie Verfahren zu seiner Herstellung | |
DE102013018518A1 (de) | IC-Modul für unterschiedliche Verbindungstechniken | |
DE202018105037U1 (de) | Filterverbinder | |
DE102014200936A1 (de) | Elektronikbaugruppe | |
DE4021872C2 (de) | Hochintegriertes elektronisches Bauteil | |
DE102016209604A1 (de) | Einpress-Anschluss, Halbleitervorrichtung, Leistungswandlungsvorrichtung und Verfahren zur Herstellung eines Einpress-Anschlusses | |
DE102014211524B4 (de) | Elektronikmodul mit einer Vorrichtung zur Wärmeabführung von durch eine in einem Kunststoffgehäuse angeordnete Halbleitereinrichtung erzeugter Wärme und Verfahren zur Herstellung eines Elektronikmoduls | |
DE60032766T2 (de) | Electronic starter und herstellungsmethode | |
DE102016101757A1 (de) | Schaltungsmodul mit oberflächenmontierbaren unterlagsblöcken zum anschliessen einer leiterplatte | |
DE102015007725B4 (de) | Elektrischer Steckverbinder | |
EP3379906B1 (de) | Verfahren zum herstellen von bonddrahtverbindungen mittels einer abstützung, sowie entsprechendes elektronisches bauteil | |
DE202016004404U1 (de) | Hochintegrierter Spannungsumsetzer | |
DE102010025258A1 (de) | Eingebetteter Sandwich-Hybridschaltkreis | |
DE1894359U (de) | Geraeteeinheit mit mehreren, bauelemente tragenden schalteinheiten. | |
DE102004002077A1 (de) | Anordnung von elektronischen Koppelmodulen und Durchschaltebrücke für diese |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8100 | Publication of the examined application without publication of unexamined application | ||
8364 | No opposition during term of opposition | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |