DE2022717A1 - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
DE2022717A1
DE2022717A1 DE19702022717 DE2022717A DE2022717A1 DE 2022717 A1 DE2022717 A1 DE 2022717A1 DE 19702022717 DE19702022717 DE 19702022717 DE 2022717 A DE2022717 A DE 2022717A DE 2022717 A1 DE2022717 A1 DE 2022717A1
Authority
DE
Germany
Prior art keywords
semiconductor body
metallic
contact pin
connecting wire
end section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19702022717
Other languages
German (de)
English (en)
Inventor
Johannes Dipl-Phys Dr Nier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE19702022717 priority Critical patent/DE2022717A1/de
Priority to JP11526270A priority patent/JPS4914786B1/ja
Priority to US3720999D priority patent/US3720999A/en
Priority to GB1315771A priority patent/GB1348521A/en
Priority to FR7116382A priority patent/FR2088459B2/fr
Priority to NL7106298A priority patent/NL7106298A/xx
Priority to IT2424271A priority patent/IT982341B/it
Publication of DE2022717A1 publication Critical patent/DE2022717A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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    • H01L2224/732—Location after the connecting process
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/00—Metal working
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    • Y10T29/49002—Electrical device making
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    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
DE19702022717 1970-05-09 1970-05-09 Halbleiterbauelement Pending DE2022717A1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE19702022717 DE2022717A1 (de) 1970-05-09 1970-05-09 Halbleiterbauelement
JP11526270A JPS4914786B1 (enExample) 1970-05-09 1970-12-22
US3720999D US3720999A (en) 1970-05-09 1971-04-29 Method of assembling transistors
GB1315771A GB1348521A (en) 1970-05-09 1971-05-05 Methods of making semiconductor components
FR7116382A FR2088459B2 (enExample) 1970-05-09 1971-05-06
NL7106298A NL7106298A (enExample) 1970-05-09 1971-05-07
IT2424271A IT982341B (it) 1970-05-09 1971-05-07 Componente a semiconduttori

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702022717 DE2022717A1 (de) 1970-05-09 1970-05-09 Halbleiterbauelement

Publications (1)

Publication Number Publication Date
DE2022717A1 true DE2022717A1 (de) 1971-12-02

Family

ID=5770671

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19702022717 Pending DE2022717A1 (de) 1970-05-09 1970-05-09 Halbleiterbauelement

Country Status (7)

Country Link
US (1) US3720999A (enExample)
JP (1) JPS4914786B1 (enExample)
DE (1) DE2022717A1 (enExample)
FR (1) FR2088459B2 (enExample)
GB (1) GB1348521A (enExample)
IT (1) IT982341B (enExample)
NL (1) NL7106298A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5245176Y2 (enExample) * 1973-09-19 1977-10-14
DE3401404A1 (de) * 1984-01-17 1985-07-25 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
DE3513530A1 (de) * 1984-06-01 1985-12-05 Bbc Brown Boveri & Cie Verfahren zur herstellung von leistungshalbleitermodulen mit isoliertem aufbau
US4689866A (en) * 1984-12-18 1987-09-01 American Telephone And Telegraph Company, At&T Technologies, Inc. Methods for transferring spring clips
US4582245A (en) * 1984-12-18 1986-04-15 At&T Technologies, Inc. Method and apparatus for automated spring clip insertion and removal
US4674166A (en) * 1984-12-18 1987-06-23 At&T Technologies, Inc. Spring clip transfer apparatus
US4948375A (en) * 1987-08-25 1990-08-14 Howard Lawrence Adaptor assembly for circuit boards
US20210398936A1 (en) * 2020-06-23 2021-12-23 Amkor Technology Singapore Holding Pte. Ltd. Laser bonded devices, laser bonding tools, and related methods

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2371754A (en) * 1942-04-22 1945-03-20 North American Aviation Inc Stiffened material
US2666874A (en) * 1950-08-25 1954-01-19 Rca Corp Construction of semiconductor devices
GB818464A (en) * 1956-03-12 1959-08-19 Gen Electric Co Ltd Improvements in or relating to semiconductor devices
US3065525A (en) * 1957-09-13 1962-11-27 Sylvania Electric Prod Method and device for making connections in transistors
US3005257A (en) * 1958-08-28 1961-10-24 Bell Telephone Labor Inc Fabrication of semiconductor devices
US3161811A (en) * 1960-02-15 1964-12-15 Clevite Corp Semiconductor device mount
US3209450A (en) * 1962-07-03 1965-10-05 Bell Telephone Labor Inc Method of fabricating semiconductor contacts
US3267409A (en) * 1963-12-30 1966-08-16 Gen Instrument Corp Terminal for electronic component
US3390450A (en) * 1966-06-09 1968-07-02 Rca Corp Method of fabricating semiconductor devices

Also Published As

Publication number Publication date
JPS4914786B1 (enExample) 1974-04-10
GB1348521A (en) 1974-03-20
US3720999A (en) 1973-03-20
IT982341B (it) 1974-10-21
NL7106298A (enExample) 1971-11-11
FR2088459A2 (enExample) 1972-01-07
FR2088459B2 (enExample) 1974-03-08

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