DE202021101753U1 - Vorrichtung zur Unterdrückung elektromagnetischer Störungen - Google Patents
Vorrichtung zur Unterdrückung elektromagnetischer Störungen Download PDFInfo
- Publication number
- DE202021101753U1 DE202021101753U1 DE202021101753.8U DE202021101753U DE202021101753U1 DE 202021101753 U1 DE202021101753 U1 DE 202021101753U1 DE 202021101753 U DE202021101753 U DE 202021101753U DE 202021101753 U1 DE202021101753 U1 DE 202021101753U1
- Authority
- DE
- Germany
- Prior art keywords
- electrically conductive
- electromagnetic interference
- cable
- end piece
- jacket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 230000001629 suppression Effects 0.000 description 17
- 230000005855 radiation Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000005684 electric field Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0018—Casings with provisions to reduce aperture leakages in walls, e.g. terminals, connectors, cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0098—Shielding materials for shielding electrical cables
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109209749 | 2020-07-30 | ||
TW109209749U TWM603256U (zh) | 2020-07-30 | 2020-07-30 | 電磁干擾抑制裝置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE202021101753U1 true DE202021101753U1 (de) | 2021-07-06 |
Family
ID=74094383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE202021101753.8U Active DE202021101753U1 (de) | 2020-07-30 | 2021-04-01 | Vorrichtung zur Unterdrückung elektromagnetischer Störungen |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3232719U (ja) |
KR (1) | KR200496359Y1 (ja) |
DE (1) | DE202021101753U1 (ja) |
TW (1) | TWM603256U (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115348816B (zh) * | 2022-10-18 | 2023-03-24 | 国网湖北省电力有限公司电力科学研究院 | 一种用于电力机器人等电位作业的电磁屏蔽方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5334955A (en) | 1993-03-01 | 1994-08-02 | Strnad Edward F | Cable signal interference suppressor |
TW200730086A (en) | 2006-01-16 | 2007-08-01 | Mitac Int Corp | Electronic equipment having layout restraining electromagnetic interference |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005142694A (ja) * | 2003-11-05 | 2005-06-02 | Yoshinori Seki | 低インピーダンス負荷による接続配線または接続ケーブルの高周波電流低減と電磁波輻射低減 |
KR102286202B1 (ko) * | 2017-04-26 | 2021-08-05 | 한화디펜스 주식회사 | 슬라이드형 커버를 포함하는 로봇 암 구조물 |
-
2020
- 2020-07-30 TW TW109209749U patent/TWM603256U/zh unknown
-
2021
- 2021-04-01 DE DE202021101753.8U patent/DE202021101753U1/de active Active
- 2021-04-21 KR KR2020210001245U patent/KR200496359Y1/ko active IP Right Grant
- 2021-04-22 JP JP2021001503U patent/JP3232719U/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5334955A (en) | 1993-03-01 | 1994-08-02 | Strnad Edward F | Cable signal interference suppressor |
TW200730086A (en) | 2006-01-16 | 2007-08-01 | Mitac Int Corp | Electronic equipment having layout restraining electromagnetic interference |
Also Published As
Publication number | Publication date |
---|---|
KR200496359Y1 (ko) | 2023-01-10 |
JP3232719U (ja) | 2021-07-01 |
KR20220000348U (ko) | 2022-02-08 |
TWM603256U (zh) | 2020-10-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R081 | Change of applicant/patentee |
Owner name: HIWIN TECHNOLOGIES CORP., TW Free format text: FORMER OWNER: HIWIN TECHNOLOGIES CORP., TAICHUNG, TW |
|
R082 | Change of representative |
Representative=s name: 2K PATENT- UND RECHTSANWAELTE PARTNERSCHAFT MB, DE |
|
R207 | Utility model specification | ||
R021 | Search request validly filed | ||
R163 | Identified publications notified | ||
R150 | Utility model maintained after payment of first maintenance fee after three years |