DE202015103835U1 - Gehäusestruktur für eine Leuchtdiode - Google Patents

Gehäusestruktur für eine Leuchtdiode Download PDF

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Publication number
DE202015103835U1
DE202015103835U1 DE202015103835.6U DE202015103835U DE202015103835U1 DE 202015103835 U1 DE202015103835 U1 DE 202015103835U1 DE 202015103835 U DE202015103835 U DE 202015103835U DE 202015103835 U1 DE202015103835 U1 DE 202015103835U1
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Germany
Prior art keywords
emitting diode
light
fluorescent powder
light emitting
diode chip
Prior art date
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Active
Application number
DE202015103835.6U
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German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Prolight Opto Technology Corp
Original Assignee
Prolight Opto Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Prolight Opto Technology Corp filed Critical Prolight Opto Technology Corp
Publication of DE202015103835U1 publication Critical patent/DE202015103835U1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
DE202015103835.6U 2015-02-26 2015-07-21 Gehäusestruktur für eine Leuchtdiode Active DE202015103835U1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW104202961U TWM505707U (zh) 2015-02-26 2015-02-26 發光二極體之封裝結構
TW104202961 2015-02-26

Publications (1)

Publication Number Publication Date
DE202015103835U1 true DE202015103835U1 (de) 2015-10-29

Family

ID=54153492

Family Applications (1)

Application Number Title Priority Date Filing Date
DE202015103835.6U Active DE202015103835U1 (de) 2015-02-26 2015-07-21 Gehäusestruktur für eine Leuchtdiode

Country Status (2)

Country Link
DE (1) DE202015103835U1 (zh)
TW (1) TWM505707U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016124873A1 (de) * 2016-12-19 2018-06-21 Osram Opto Semiconductors Gmbh Weißlichtquelle und Verfahren zur Herstellung einer Weißlichtquelle

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI685988B (zh) * 2018-06-01 2020-02-21 宏齊科技股份有限公司 手持式電子裝置及其色溫可調控的倒裝式發光元件

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016124873A1 (de) * 2016-12-19 2018-06-21 Osram Opto Semiconductors Gmbh Weißlichtquelle und Verfahren zur Herstellung einer Weißlichtquelle
US10910353B2 (en) 2016-12-19 2021-02-02 Osram Oled Gmbh White light source and method of producing a white light source
DE102016124873B4 (de) 2016-12-19 2023-09-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Weißlichtquelle und Verfahren zur Herstellung einer Weißlichtquelle

Also Published As

Publication number Publication date
TWM505707U (zh) 2015-07-21

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R207 Utility model specification
R150 Utility model maintained after payment of first maintenance fee after three years
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Representative=s name: BECKER-KURIG-STRAUS PATENTANWAELTE PARTNERSCHA, DE

Representative=s name: 2K PATENT- UND RECHTSANWAELTE PARTNERSCHAFT MB, DE

R082 Change of representative

Representative=s name: 2K PATENT- UND RECHTSANWAELTE PARTNERSCHAFT MB, DE

R151 Utility model maintained after payment of second maintenance fee after six years
R152 Utility model maintained after payment of third maintenance fee after eight years