DE202015008724U1 - Flüssigkeitskühlungs-Wärmeabfuhrstruktur - Google Patents

Flüssigkeitskühlungs-Wärmeabfuhrstruktur Download PDF

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Publication number
DE202015008724U1
DE202015008724U1 DE202015008724.8U DE202015008724U DE202015008724U1 DE 202015008724 U1 DE202015008724 U1 DE 202015008724U1 DE 202015008724 U DE202015008724 U DE 202015008724U DE 202015008724 U1 DE202015008724 U1 DE 202015008724U1
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Germany
Prior art keywords
heat
module
fluid
substrate
rib
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DE202015008724.8U
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German (de)
English (en)
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Cooler Master Co Ltd
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Cooler Master Co Ltd
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Publication date
Application filed by Cooler Master Co Ltd filed Critical Cooler Master Co Ltd
Publication of DE202015008724U1 publication Critical patent/DE202015008724U1/de
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE202015008724.8U 2015-02-13 2015-12-16 Flüssigkeitskühlungs-Wärmeabfuhrstruktur Active DE202015008724U1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510078550.XA CN105992498B (zh) 2015-02-13 2015-02-13 液体冷却式散热结构及其制作方法
CN201510078550.X 2015-02-13

Publications (1)

Publication Number Publication Date
DE202015008724U1 true DE202015008724U1 (de) 2016-02-05

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ID=55406388

Family Applications (1)

Application Number Title Priority Date Filing Date
DE202015008724.8U Active DE202015008724U1 (de) 2015-02-13 2015-12-16 Flüssigkeitskühlungs-Wärmeabfuhrstruktur

Country Status (2)

Country Link
CN (1) CN105992498B (zh)
DE (1) DE202015008724U1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3779640A4 (en) * 2018-05-24 2021-05-26 Huawei Technologies Co., Ltd. HEAT DRAINAGE DEVICE AND MANUFACTURING PROCESS FOR IT AND SERVER

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110234212A (zh) * 2019-04-01 2019-09-13 Oppo广东移动通信有限公司 散热板、散热组件、电子装置以及散热板的制备方法
CN109982550B (zh) * 2019-04-01 2021-03-26 Oppo广东移动通信有限公司 散热板、散热组件、电子装置以及散热板的制造方法
CN110012643B (zh) * 2019-04-04 2021-03-02 Oppo广东移动通信有限公司 散热组件、其制备方法以及电子设备
CN110267491B (zh) * 2019-06-10 2021-03-12 Oppo广东移动通信有限公司 中框组件及电子设备
CN110191625B (zh) * 2019-06-28 2021-02-12 Oppo广东移动通信有限公司 散热组件、其制备方法以及电子设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW390459U (en) * 1998-05-22 2000-05-11 Global Win Technology Co Ltd Improved folding heat radiator
TWI269146B (en) * 2005-01-20 2006-12-21 Asia Vital Components Co Ltd Heat dissipating unit for electronic components
CN101312640B (zh) * 2007-05-25 2012-05-30 鸿富锦精密工业（深圳）有限公司 散热装置
CN202617585U (zh) * 2012-05-29 2012-12-19 讯凯国际股份有限公司 水冷式散热装置
CN203313585U (zh) * 2013-06-24 2013-11-27 讯凯国际股份有限公司 水冷式散热装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3779640A4 (en) * 2018-05-24 2021-05-26 Huawei Technologies Co., Ltd. HEAT DRAINAGE DEVICE AND MANUFACTURING PROCESS FOR IT AND SERVER
US11490545B2 (en) 2018-05-24 2022-11-01 Huawei Technologies Co., Ltd. Heat dissipation apparatus and server
US11737242B2 (en) 2018-05-24 2023-08-22 Huawei Technologies Co., Ltd. Heat dissipation apparatus and server

Also Published As

Publication number Publication date
CN105992498A (zh) 2016-10-05
CN105992498B (zh) 2018-07-17

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R152 Utility model maintained after payment of third maintenance fee after eight years