DE19826756C2 - Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver - Google Patents

Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver

Info

Publication number
DE19826756C2
DE19826756C2 DE19826756A DE19826756A DE19826756C2 DE 19826756 C2 DE19826756 C2 DE 19826756C2 DE 19826756 A DE19826756 A DE 19826756A DE 19826756 A DE19826756 A DE 19826756A DE 19826756 C2 DE19826756 C2 DE 19826756C2
Authority
DE
Germany
Prior art keywords
solder metal
solder
powder
hydrophobic
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19826756A
Other languages
German (de)
English (en)
Other versions
DE19826756A1 (de
Inventor
Juergen Schulze
Walter Protsch
Klaus Wiener
Wolfgang Scheel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WC Heraus GmbH and Co KG
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE19826756A priority Critical patent/DE19826756C2/de
Application filed by Individual filed Critical Individual
Priority to DE59906970T priority patent/DE59906970D1/de
Priority to KR1020007013564A priority patent/KR100549612B1/ko
Priority to DK99939356T priority patent/DK1094915T3/da
Priority to IL14005399A priority patent/IL140053A0/xx
Priority to AT99939356T priority patent/ATE249308T1/de
Priority to PCT/DE1999/001777 priority patent/WO1999065640A1/de
Priority to US09/719,281 priority patent/US6416863B1/en
Priority to CA002335002A priority patent/CA2335002C/en
Priority to IDW20002606A priority patent/ID27425A/id
Priority to NZ508383A priority patent/NZ508383A/xx
Priority to JP2000554502A priority patent/JP3783031B2/ja
Priority to BR9911173-0A priority patent/BR9911173A/pt
Priority to EP99939356A priority patent/EP1094915B1/de
Priority to CN99807440A priority patent/CN1106905C/zh
Publication of DE19826756A1 publication Critical patent/DE19826756A1/de
Priority to IL140053A priority patent/IL140053A/en
Application granted granted Critical
Publication of DE19826756C2 publication Critical patent/DE19826756C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2984—Microcapsule with fluid core [includes liposome]
    • Y10T428/2985—Solid-walled microcapsule from synthetic polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31609—Particulate metal or metal compound-containing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Polymerisation Methods In General (AREA)
  • Image Analysis (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
DE19826756A 1998-06-15 1998-06-15 Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver Expired - Fee Related DE19826756C2 (de)

Priority Applications (16)

Application Number Priority Date Filing Date Title
DE19826756A DE19826756C2 (de) 1998-06-15 1998-06-15 Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver
NZ508383A NZ508383A (en) 1998-06-15 1999-06-15 Method for encapsulating fine solder metal powders
DK99939356T DK1094915T3 (da) 1998-06-15 1999-06-15 Fremgangsmåde til indkapsling af loddemetalpulvere og loddemetalpulvere fremstillet verd denne fremgangsmåde
IL14005399A IL140053A0 (en) 1998-06-15 1999-06-15 Method for encapsulating solder metal powders and solder metal powders produced according to this method
AT99939356T ATE249308T1 (de) 1998-06-15 1999-06-15 Verfahren zum verkapseln von lotmetallpulver und danach hergestelltes lotmetallpulver
PCT/DE1999/001777 WO1999065640A1 (de) 1998-06-15 1999-06-15 Verfahren zum verkapseln von lotmetallpulver und danach hergestellte lotmetallpulver
US09/719,281 US6416863B1 (en) 1998-06-15 1999-06-15 Method for encapsulating solder metal powders and solder metal powders produced according to this method
CA002335002A CA2335002C (en) 1998-06-15 1999-06-15 Method for encapsulating solder metal powders and solder metal powders produced according to this method
DE59906970T DE59906970D1 (de) 1998-06-15 1999-06-15 Verfahren zum verkapseln von lotmetallpulver und danach hergestelltes lotmetallpulver
KR1020007013564A KR100549612B1 (ko) 1998-06-15 1999-06-15 땜납 금속 분말 캡슐화 방법 및 그 방법에 따라 제조된땜납 금속 분말
JP2000554502A JP3783031B2 (ja) 1998-06-15 1999-06-15 軟ろう粉末をカプセル化する方法およびそれによって製造される軟ろう粉末
BR9911173-0A BR9911173A (pt) 1998-06-15 1999-06-15 Método para encapsular pós metálicos de solda e pós metálicos de solda produzidos de acordo com este método
EP99939356A EP1094915B1 (de) 1998-06-15 1999-06-15 Verfahren zum verkapseln von lotmetallpulver und danach hergestelltes lotmetallpulver
CN99807440A CN1106905C (zh) 1998-06-15 1999-06-15 焊料金属粉末的封装方法和按此方法制得的焊料金属粉末
IDW20002606A ID27425A (id) 1998-06-15 1999-06-15 Metode untuk pengkapsulan serbuk-logam patri dan serbuk-logam-patri yang dihasilkan dengan metode ini
IL140053A IL140053A (en) 1998-06-15 2000-12-03 Method for encapsulation of solder metal powders and solder metal powders produced by this method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19826756A DE19826756C2 (de) 1998-06-15 1998-06-15 Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver

Publications (2)

Publication Number Publication Date
DE19826756A1 DE19826756A1 (de) 2000-01-13
DE19826756C2 true DE19826756C2 (de) 2002-04-18

Family

ID=7871020

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19826756A Expired - Fee Related DE19826756C2 (de) 1998-06-15 1998-06-15 Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver
DE59906970T Expired - Fee Related DE59906970D1 (de) 1998-06-15 1999-06-15 Verfahren zum verkapseln von lotmetallpulver und danach hergestelltes lotmetallpulver

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE59906970T Expired - Fee Related DE59906970D1 (de) 1998-06-15 1999-06-15 Verfahren zum verkapseln von lotmetallpulver und danach hergestelltes lotmetallpulver

Country Status (14)

Country Link
US (1) US6416863B1 (https=)
EP (1) EP1094915B1 (https=)
JP (1) JP3783031B2 (https=)
KR (1) KR100549612B1 (https=)
CN (1) CN1106905C (https=)
AT (1) ATE249308T1 (https=)
BR (1) BR9911173A (https=)
CA (1) CA2335002C (https=)
DE (2) DE19826756C2 (https=)
DK (1) DK1094915T3 (https=)
ID (1) ID27425A (https=)
IL (2) IL140053A0 (https=)
NZ (1) NZ508383A (https=)
WO (1) WO1999065640A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7780875B2 (en) 2005-01-13 2010-08-24 Cinvention Ag Composite materials containing carbon nanoparticles

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3888573B2 (ja) * 2001-06-29 2007-03-07 富士電機ホールディングス株式会社 ハンダ組成物
ES2498718T3 (es) 2008-11-21 2014-09-25 Henkel US IP LLC Polvos metálicos recubiertos de polímero térmicamente descomponible
US20120183775A1 (en) 2009-10-15 2012-07-19 Yoichi Shinba Process for production of core-shell particles, core-shell particles, and paste composition and sheet composition which contain same
US9682447B2 (en) 2010-08-20 2017-06-20 Henkel IP & Holding GmbH Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes
GB2491387A (en) * 2011-06-02 2012-12-05 Magnequench Ltd Rare earth material capsule used in making a magnet
CN102220550B (zh) * 2011-06-13 2012-07-04 苏州国通科技有限公司 一种锡熔液保护剂
EP2753442B1 (en) 2011-09-06 2019-10-30 Henkel IP & Holding GmbH Di-or poly-functional electron deficient olefins coated metal powders for solder pastes
JP5947238B2 (ja) * 2013-03-25 2016-07-06 株式会社日立製作所 ペースト、アルミニウム電線体、アルミニウム電線体の製造方法、モータ及びモータの製造方法
JP6455508B2 (ja) * 2014-03-25 2019-01-23 住友金属鉱山株式会社 被覆はんだ材料およびその製造方法
US9878039B1 (en) 2016-09-01 2018-01-30 International Business Machines Corporation Microcapsule having a microcapsule shell material that is rupturable via a retro-dimerization reaction
US10328535B2 (en) 2016-11-07 2019-06-25 International Business Machines Corporation Self-heating solder flux material
CN108722000B (zh) * 2018-05-25 2020-09-29 中国人民解放军63908部队 十二烷基三甲基溴化铵在固-液云爆剂组分分离中的应用及方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0556864A1 (en) * 1992-02-21 1993-08-25 London Chemical Company, Inc. Solder powder coated with parylene
DE4402042A1 (de) * 1994-01-25 1994-06-09 Kunststoff Maschinen Handelsge Mikropartikulierte Reflow-Lötmittel und Verfahren zu deren Herstellung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3736653A (en) * 1970-05-07 1973-06-05 Ncr Co Process for soldering using pre-fluxed solder powder
JP2564152B2 (ja) 1987-10-27 1996-12-18 タムラ化研株式会社 はんだペースト
US4944326A (en) * 1989-09-08 1990-07-31 Su Yueh Hsieh Inlet valve for water tanks
US5922403A (en) 1996-03-12 1999-07-13 Tecle; Berhan Method for isolating ultrafine and fine particles

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0556864A1 (en) * 1992-02-21 1993-08-25 London Chemical Company, Inc. Solder powder coated with parylene
DE4402042A1 (de) * 1994-01-25 1994-06-09 Kunststoff Maschinen Handelsge Mikropartikulierte Reflow-Lötmittel und Verfahren zu deren Herstellung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DE-B.: Ullmanns Encyclopädie der technischen Chemie 4.Aufl., Bd.16, Verlag Chemie GmbH, Wein- heim 1978, S.675-682 "Mikrokapseln" *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7780875B2 (en) 2005-01-13 2010-08-24 Cinvention Ag Composite materials containing carbon nanoparticles

Also Published As

Publication number Publication date
DE19826756A1 (de) 2000-01-13
US6416863B1 (en) 2002-07-09
ATE249308T1 (de) 2003-09-15
IL140053A (en) 2006-04-10
DK1094915T3 (da) 2004-01-05
JP2002518182A (ja) 2002-06-25
NZ508383A (en) 2003-03-28
ID27425A (id) 2001-04-05
BR9911173A (pt) 2001-03-20
KR100549612B1 (ko) 2006-02-03
EP1094915A1 (de) 2001-05-02
CA2335002C (en) 2004-12-07
EP1094915B1 (de) 2003-09-10
DE59906970D1 (de) 2003-10-16
CN1305403A (zh) 2001-07-25
KR20010071362A (ko) 2001-07-28
CA2335002A1 (en) 1999-12-23
CN1106905C (zh) 2003-04-30
JP3783031B2 (ja) 2006-06-07
WO1999065640A1 (de) 1999-12-23
IL140053A0 (en) 2002-02-10

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: W.C. HERAEUS GMBH, 63450 HANAU, DE

8339 Ceased/non-payment of the annual fee