DE19646369A1 - Keramische Mehrlagenschaltung und Verfahren zu ihrer Herstellung - Google Patents
Keramische Mehrlagenschaltung und Verfahren zu ihrer HerstellungInfo
- Publication number
- DE19646369A1 DE19646369A1 DE19646369A DE19646369A DE19646369A1 DE 19646369 A1 DE19646369 A1 DE 19646369A1 DE 19646369 A DE19646369 A DE 19646369A DE 19646369 A DE19646369 A DE 19646369A DE 19646369 A1 DE19646369 A1 DE 19646369A1
- Authority
- DE
- Germany
- Prior art keywords
- conductor tracks
- ceramic
- layer
- foils
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 34
- 239000011888 foil Substances 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000005245 sintering Methods 0.000 claims abstract description 6
- 239000004020 conductor Substances 0.000 claims description 38
- 239000010410 layer Substances 0.000 claims description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 24
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 20
- 229910052709 silver Inorganic materials 0.000 claims description 20
- 239000004332 silver Substances 0.000 claims description 20
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 18
- 229910052737 gold Inorganic materials 0.000 claims description 18
- 239000010931 gold Substances 0.000 claims description 18
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 239000011241 protective layer Substances 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 2
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 8
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- PQTCMBYFWMFIGM-UHFFFAOYSA-N gold silver Chemical compound [Ag].[Au] PQTCMBYFWMFIGM-UHFFFAOYSA-N 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- IHWJXGQYRBHUIF-UHFFFAOYSA-N [Ag].[Pt] Chemical compound [Ag].[Pt] IHWJXGQYRBHUIF-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
Claims (9)
- - in ungebrannte keramische Folien Durchkontaktierlöcher (1) eingestanzt werden,
- - die Durchkontaktierlöcher mit einer Leiterbahnpaste, insbesondere einer Silberpaste, aufgefüllt werden,
- - in einem weiteren Schritt Leiterbahnen (2) aus elektrisch leitendem Material, insbesondere Silber, auf die Folien gedruckt werden,
- - die keramischen Folien anschließend zu einem Folienstapel (3) gestapelt und in einem Preßvorgang miteinander verbunden werden,
- - in einem weiteren Schritt ein Sintervorgang erfolgt,
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19646369A DE19646369B4 (de) | 1996-11-09 | 1996-11-09 | Keramische Mehrlagenschaltung und Verfahren zu ihrer Herstellung |
US08/956,666 US5937321A (en) | 1996-11-09 | 1997-10-23 | Method for manufacturing ceramic multilayer circuit |
JP9305764A JPH10145042A (ja) | 1996-11-09 | 1997-11-07 | セラミック多層回路の製造方法および該回路 |
DE19817359A DE19817359B4 (de) | 1996-11-09 | 1998-04-18 | Keramische Mehrlagenschaltung und Verfahren zu ihrer Herstellung |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19655275 | 1996-11-09 | ||
DE19646369A DE19646369B4 (de) | 1996-11-09 | 1996-11-09 | Keramische Mehrlagenschaltung und Verfahren zu ihrer Herstellung |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19646369A1 true DE19646369A1 (de) | 1998-05-14 |
DE19646369B4 DE19646369B4 (de) | 2008-07-31 |
Family
ID=7811203
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19646369A Revoked DE19646369B4 (de) | 1996-11-09 | 1996-11-09 | Keramische Mehrlagenschaltung und Verfahren zu ihrer Herstellung |
DE19817359A Expired - Lifetime DE19817359B4 (de) | 1996-11-09 | 1998-04-18 | Keramische Mehrlagenschaltung und Verfahren zu ihrer Herstellung |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19817359A Expired - Lifetime DE19817359B4 (de) | 1996-11-09 | 1998-04-18 | Keramische Mehrlagenschaltung und Verfahren zu ihrer Herstellung |
Country Status (3)
Country | Link |
---|---|
US (1) | US5937321A (de) |
JP (1) | JPH10145042A (de) |
DE (2) | DE19646369B4 (de) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999063566A2 (de) * | 1998-06-03 | 1999-12-09 | Siemens Aktiengesellschaft | Vorrichtung zur formung eines elektronenstrahls, verfahren zur herstellung der vorrichtung und anwendung |
DE10030468B4 (de) * | 1999-06-25 | 2007-05-03 | Delphi Technologies, Inc., Troy | Dickfilmschaltungen und Metallisierungsprozeß |
DE19817359B4 (de) * | 1996-11-09 | 2009-02-05 | Robert Bosch Gmbh | Keramische Mehrlagenschaltung und Verfahren zu ihrer Herstellung |
EP2161748A2 (de) * | 2008-09-08 | 2010-03-10 | BIOTRONIK CRM Patent AG | LTCC-Substratstruktur und Verfahren zur Herstellung derselben |
DE102020103487A1 (de) | 2020-02-11 | 2021-08-12 | Koa Corporation | Hybrides Verdrahtungssubstrat und Herstellung desselben |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6030860A (en) * | 1997-12-19 | 2000-02-29 | Advanced Micro Devices, Inc. | Elevated substrate formation and local interconnect integrated fabrication |
KR100268424B1 (ko) * | 1998-08-07 | 2000-10-16 | 윤종용 | 반도체 장치의 배선 형성 방법 |
US6545359B1 (en) * | 1998-12-18 | 2003-04-08 | Semiconductor Energy Laboratory Co., Ltd. | Wiring line and manufacture process thereof, and semiconductor device and manufacturing process thereof |
US6205032B1 (en) * | 1999-03-16 | 2001-03-20 | Cts Corporation | Low temperature co-fired ceramic with improved registration |
US6590283B1 (en) * | 2000-02-28 | 2003-07-08 | Agere Systems Inc. | Method for hermetic leadless device interconnect using a submount |
JP4172566B2 (ja) | 2000-09-21 | 2008-10-29 | Tdk株式会社 | セラミック多層基板の表面電極構造及び表面電極の製造方法 |
US6800815B1 (en) | 2001-01-16 | 2004-10-05 | National Semiconductor Corporation | Materials and structure for a high reliability bga connection between LTCC and PB boards |
JP2002231721A (ja) * | 2001-02-06 | 2002-08-16 | Mitsubishi Electric Corp | 半導体装置 |
KR100393592B1 (ko) * | 2001-07-05 | 2003-08-02 | 엘지전자 주식회사 | 도전성 페이스트 및 이를 이용한 집적 회로 장치 |
US6711029B2 (en) * | 2002-05-21 | 2004-03-23 | Cts Corporation | Low temperature co-fired ceramic with improved shrinkage control |
US6900395B2 (en) * | 2002-11-26 | 2005-05-31 | International Business Machines Corporation | Enhanced high-frequency via interconnection for improved reliability |
DE10333439A1 (de) * | 2003-07-23 | 2005-02-17 | Robert Bosch Gmbh | Verfahren zur Herstellung eines aus mehreren Verdrahtungsebenen bestehenden Hybrid-Produktes |
GB2417127A (en) * | 2004-08-12 | 2006-02-15 | Vetco Gray Controls Ltd | Surface metallization of contact pads |
GB2418538A (en) * | 2004-09-22 | 2006-03-29 | Vetco Gray Controls Ltd | Thick-film printed circuit |
DE102007015399A1 (de) | 2007-03-30 | 2008-10-02 | Robert Bosch Gmbh | Verfahren zur Herstellung einer keramischen Mehrlagen-Schaltungsanordnung und entsprechende Mehrlagen-Schaltungsanordnung |
DE102007022336A1 (de) * | 2007-05-12 | 2008-11-20 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitersubstrat mit Metallkontaktschicht sowie Herstellungsverfahren hierzu |
US8552311B2 (en) | 2010-07-15 | 2013-10-08 | Advanced Bionics | Electrical feedthrough assembly |
US8386047B2 (en) | 2010-07-15 | 2013-02-26 | Advanced Bionics | Implantable hermetic feedthrough |
CN102856213B (zh) * | 2012-08-24 | 2014-12-10 | 中国兵器工业集团第二一四研究所苏州研发中心 | 一种基于ltcc基板薄膜多层布线制作方法 |
EP2750488A1 (de) * | 2012-12-28 | 2014-07-02 | Heraeus Precious Metals GmbH & Co. KG | Verfahren zum Drucken von dünnen Metallschichten in einem Keramikschichtaufbau und diesen beinhaltende elektronische Bauteile |
CN109168274A (zh) * | 2018-10-15 | 2019-01-08 | 安徽银点电子科技有限公司 | 一种制备电路板的方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0247617A2 (de) * | 1986-05-29 | 1987-12-02 | Narumi China Corporation | Keramisches Mehrschichtsubstrat mit Schaltungsmustern |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5852900A (ja) * | 1981-09-24 | 1983-03-29 | 株式会社日立製作所 | セラミツク多層配線板の製造方法 |
JPS62287658A (ja) * | 1986-06-06 | 1987-12-14 | Hitachi Ltd | セラミックス多層回路板 |
US5340947A (en) * | 1992-06-22 | 1994-08-23 | Cirqon Technologies Corporation | Ceramic substrates with highly conductive metal vias |
DE19646369B4 (de) * | 1996-11-09 | 2008-07-31 | Robert Bosch Gmbh | Keramische Mehrlagenschaltung und Verfahren zu ihrer Herstellung |
-
1996
- 1996-11-09 DE DE19646369A patent/DE19646369B4/de not_active Revoked
-
1997
- 1997-10-23 US US08/956,666 patent/US5937321A/en not_active Expired - Lifetime
- 1997-11-07 JP JP9305764A patent/JPH10145042A/ja active Pending
-
1998
- 1998-04-18 DE DE19817359A patent/DE19817359B4/de not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0247617A2 (de) * | 1986-05-29 | 1987-12-02 | Narumi China Corporation | Keramisches Mehrschichtsubstrat mit Schaltungsmustern |
Non-Patent Citations (1)
Title |
---|
MOSSLER, B.H., et.al.: LTCC - die zwingende Alternative, productronic 8, 1995, S. 40-46 * |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19817359B4 (de) * | 1996-11-09 | 2009-02-05 | Robert Bosch Gmbh | Keramische Mehrlagenschaltung und Verfahren zu ihrer Herstellung |
WO1999063566A2 (de) * | 1998-06-03 | 1999-12-09 | Siemens Aktiengesellschaft | Vorrichtung zur formung eines elektronenstrahls, verfahren zur herstellung der vorrichtung und anwendung |
WO1999063566A3 (de) * | 1998-06-03 | 2000-08-24 | Siemens Ag | Vorrichtung zur formung eines elektronenstrahls, verfahren zur herstellung der vorrichtung und anwendung |
US6570320B1 (en) | 1998-06-03 | 2003-05-27 | Siemens Aktiengesellschaft | Device for shaping an electron beam, method for producing said device and use thereof |
DE10030468B4 (de) * | 1999-06-25 | 2007-05-03 | Delphi Technologies, Inc., Troy | Dickfilmschaltungen und Metallisierungsprozeß |
EP2161748A2 (de) * | 2008-09-08 | 2010-03-10 | BIOTRONIK CRM Patent AG | LTCC-Substratstruktur und Verfahren zur Herstellung derselben |
DE102008041873A1 (de) * | 2008-09-08 | 2010-03-11 | Biotronik Crm Patent Ag | LTCC-Substratstruktur und Verfahren zur Herstellung derselben |
US8250748B2 (en) | 2008-09-08 | 2012-08-28 | Biotronik Crm Patent Ag | Method for producing an LTCC substrate |
DE102020103487A1 (de) | 2020-02-11 | 2021-08-12 | Koa Corporation | Hybrides Verdrahtungssubstrat und Herstellung desselben |
DE102020103487B4 (de) | 2020-02-11 | 2022-05-12 | Koa Corporation | Verfahren zur Herstellung eines Glas-Keramik-Verbundsubstrates |
Also Published As
Publication number | Publication date |
---|---|
JPH10145042A (ja) | 1998-05-29 |
DE19817359A1 (de) | 1999-10-21 |
US5937321A (en) | 1999-08-10 |
DE19817359B4 (de) | 2009-02-05 |
DE19646369B4 (de) | 2008-07-31 |
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R037 | Decision of examining division or of federal patent court revoking patent now final | ||
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Effective date: 20140724 |