DE19602436B4 - Verfahren zur Montage eines Rahmens auf ein Trägermaterial und Vorrichtung zur Durchführung des Verfahrens - Google Patents

Verfahren zur Montage eines Rahmens auf ein Trägermaterial und Vorrichtung zur Durchführung des Verfahrens Download PDF

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Publication number
DE19602436B4
DE19602436B4 DE1996102436 DE19602436A DE19602436B4 DE 19602436 B4 DE19602436 B4 DE 19602436B4 DE 1996102436 DE1996102436 DE 1996102436 DE 19602436 A DE19602436 A DE 19602436A DE 19602436 B4 DE19602436 B4 DE 19602436B4
Authority
DE
Germany
Prior art keywords
frame
carrier material
station
adhesive
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1996102436
Other languages
German (de)
English (en)
Other versions
DE19602436A1 (de
Inventor
Jürgen Fischer
Helmut Graf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Priority to DE1996102436 priority Critical patent/DE19602436B4/de
Priority to PCT/DE1997/000079 priority patent/WO1997027625A1/de
Priority to IN144CA1997 priority patent/IN191873B/en
Publication of DE19602436A1 publication Critical patent/DE19602436A1/de
Application granted granted Critical
Publication of DE19602436B4 publication Critical patent/DE19602436B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/474—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially non-flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4835—Heat curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Credit Cards Or The Like (AREA)
DE1996102436 1996-01-24 1996-01-24 Verfahren zur Montage eines Rahmens auf ein Trägermaterial und Vorrichtung zur Durchführung des Verfahrens Expired - Fee Related DE19602436B4 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE1996102436 DE19602436B4 (de) 1996-01-24 1996-01-24 Verfahren zur Montage eines Rahmens auf ein Trägermaterial und Vorrichtung zur Durchführung des Verfahrens
PCT/DE1997/000079 WO1997027625A1 (de) 1996-01-24 1997-01-17 Verfahren zur montage eines rahmens auf ein trägermaterial und vorrichtung zur durchführung des verfahrens
IN144CA1997 IN191873B (enrdf_load_stackoverflow) 1996-01-24 1997-01-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1996102436 DE19602436B4 (de) 1996-01-24 1996-01-24 Verfahren zur Montage eines Rahmens auf ein Trägermaterial und Vorrichtung zur Durchführung des Verfahrens

Publications (2)

Publication Number Publication Date
DE19602436A1 DE19602436A1 (de) 1997-07-31
DE19602436B4 true DE19602436B4 (de) 2006-09-14

Family

ID=7783535

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1996102436 Expired - Fee Related DE19602436B4 (de) 1996-01-24 1996-01-24 Verfahren zur Montage eines Rahmens auf ein Trägermaterial und Vorrichtung zur Durchführung des Verfahrens

Country Status (3)

Country Link
DE (1) DE19602436B4 (enrdf_load_stackoverflow)
IN (1) IN191873B (enrdf_load_stackoverflow)
WO (1) WO1997027625A1 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29818829U1 (de) 1998-10-22 1999-03-25 Lohn, Silke, 65346 Eltville Schutzvorrichtung für Chipkarten
DE10134989B4 (de) * 2001-07-18 2006-03-23 Infineon Technologies Ag Chipkarte mit einem Kartenkörper

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989004552A1 (en) * 1987-10-30 1989-05-18 Lsi Logic Corporation Method and means of fabricating a semiconductor device package
US5057679A (en) * 1988-03-22 1991-10-15 Schlumberger Industries Technique for attaching an electronic module to a card body to form an electronic memory card
DD298170A5 (de) * 1989-07-24 1992-02-06 Schneider,Edgar,De Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten
US5147982A (en) * 1989-04-07 1992-09-15 Sgs-Thomson Microelectronics S.A. Encapsulation of electronic modules
DE4325458A1 (de) * 1993-07-29 1995-02-09 Orga Bond Technik Gmbh Trägerelement für einen IC-Baustein
EP0766197A1 (en) * 1995-04-13 1997-04-02 Dai Nippon Printing Co., Ltd. Ic card and ic module
DE19535989C3 (de) * 1995-09-27 2003-03-27 Siemens Ag Chipmodul

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4344297A1 (de) * 1993-12-23 1995-06-29 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Ausweiskarten
JPH07214958A (ja) * 1994-02-07 1995-08-15 Ibiden Co Ltd Ｉｃカード用プリント配線板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989004552A1 (en) * 1987-10-30 1989-05-18 Lsi Logic Corporation Method and means of fabricating a semiconductor device package
US5057679A (en) * 1988-03-22 1991-10-15 Schlumberger Industries Technique for attaching an electronic module to a card body to form an electronic memory card
US5147982A (en) * 1989-04-07 1992-09-15 Sgs-Thomson Microelectronics S.A. Encapsulation of electronic modules
DD298170A5 (de) * 1989-07-24 1992-02-06 Schneider,Edgar,De Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten
DE4325458A1 (de) * 1993-07-29 1995-02-09 Orga Bond Technik Gmbh Trägerelement für einen IC-Baustein
EP0766197A1 (en) * 1995-04-13 1997-04-02 Dai Nippon Printing Co., Ltd. Ic card and ic module
DE19535989C3 (de) * 1995-09-27 2003-03-27 Siemens Ag Chipmodul

Also Published As

Publication number Publication date
IN191873B (enrdf_load_stackoverflow) 2004-01-10
DE19602436A1 (de) 1997-07-31
WO1997027625A1 (de) 1997-07-31

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8127 New person/name/address of the applicant

Owner name: INFINEON TECHNOLOGIES AG, 81669 MUENCHEN, DE

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee