Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
  • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
  • B29C66/474—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially non-flat
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
  • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
  • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
  • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
  • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
  • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
  • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
  • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
  • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
  • B29C65/4835—Heat curing adhesives
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/01—General aspects dealing with the joint area or with the area to be joined
  • B29C66/05—Particular design of joint configurations
  • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
  • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
  • B29C66/112—Single lapped joints
  • B29C66/1122—Single lap to lap joints, i.e. overlap joints
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/80—General aspects of machine operations or constructions and parts thereof
  • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
  • B29C66/832—Reciprocating joining or pressing tools
  • B29C66/8322—Joining or pressing tools reciprocating along one axis
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
  • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
  • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

• the present invention relates to a method for mounting a frame on a carrier material according to the preamble of claim 1, i.e. a method for mounting a frame on a carrier material by gluing the frame to the carrier material by means of an adhesive having a curing time, and a device for mounting a frame on a carrier material according to the preamble of patent claim 3, i.e. a device for mounting a frame on a carrier material by gluing the frame to the carrier material by means of an adhesive having a curing time.
• the frames mentioned are, for example, stiffening frames as are used to protect a chip in a chip card.
• the chip and the stiffening frame protecting it are components of a chip module shown in cross section in FIG.
• the chip module 10 shown in FIG. 4 has a carrier element 11 consisting or emerging from said carrier material, a chip 12 and a stiffening frame 13 which protects the chip.
• the area enclosed by the stiffening frame 13 can be poured out by a casting compound, not shown in FIG. 4, for holding and / or additionally protecting the chip 12.
• the chip module 10 is intended to be mounted (implanted) in a chip card body having a corresponding recess.
• the carrier element 11 and the stiffening frame 13 are usually attached to one another by gluing. Various requirements meet here, the simultaneous fulfillment of which has not yet been achieved.
• the frames must assume exactly predetermined positions and orientations on the carrier material, and, on the other hand, that the gluing should be able to be carried out at a high speed suitable for mass production.
• the present invention is therefore based on the object of developing the method according to the preamble of patent claim 1 or the device according to the preamble of patent claim 3 in such a way that one exact and fast bonding of a carrier material with a frame to be mounted thereon is made possible.
• the frame and the carrier material are pressed together during the curing time of the adhesive using heatable pressing elements, and that the frame and / or the carrier material are heated by the pressing elements during pressing against one another (claim 1) or at least partially heatable pressing elements are provided, which are designed in such a way that the frame and the carrier material can be pressed against one another by the pressing elements while heating the frame and / or carrier material (claim 3).
• the curing time of the adhesive used is shortened, so that even if a high throughput is provided during production, it is not necessary to interrupt the pressing of the frame and carrier material before the adhesive has fully hardened.
• a method and a device for carrying out the same have therefore been created, which make it possible to carry out an equally precise and rapid bonding of a carrier material with a frame to be mounted thereon.
• FIG. 1 shows the schematic structure of an assembly system designed to carry out the method according to the invention
• FIG. 2 shows a carrier tape frame arrangement to be produced by the assembly system according to FIG. 1,
• FIG. 3 shows a schematic partial view of a frame assembly station of the assembly system shown in FIG. 1, and
• FIG. 4 shows a chip module in which a (stiffening) frame bonded to a carrier element is used.
• a carrier material in the form of a carrier tape is identified in each case by the reference number 20, and frames to be mounted thereon are designated by the reference number 25.
• the carrier tape 20 not yet equipped with the frame 25 is available in a form rolled onto an input roller 21.
• the carrier tape is unrolled from the input roller, passes through various work stations of the assembly system 30 shown in FIG. 1 and is finally rolled onto an output roller 22.
• the carrier tape 20 leaving the assembly system 30 (rolled up onto the output roll 22) is equipped with a frame 25 as shown in FIG.
• two superimposed rows of frames 25 are mounted on the carrier tape 20; the number of frame rows depends primarily on the carrier bandwidth and can of course be varied as desired.
• the carrier tape 20 On its way through the assembly system 30, the carrier tape 20 successively passes through an adhesive application layer. tion 31, a frame assembly station 32, a position control station 33 and a reject marking station 34.
• adhesive is stamped onto the carrier tape 20 by means of a doctor system 31a.
• the frames 25 are correctly aligned and positioned on the carrier tape 20 and pressed together.
• the pressing process in the frame assembly station 32 is illustrated in FIG. 3.
• the carrier tape 20 lies on a table 40 or is moved over a table 40.
• one or more frames 25 to be mounted on the carrier tape 20 are pressed straight onto the carrier tape 20 by a mounting head 41.
• the table 40 and the mounting head 41 act as pressing elements which clamp the carrier tape 20 and one or more frames 25 between them and thereby press them against one another.
• the table 40 and / or the mounting head 41 can be heated.
• the heating devices assigned to these elements are preferably integrated in them or arranged in the immediate vicinity of the same.
• the provision of the heatable pressing elements also makes it possible to restrict the heating of the carrier tape and / or frame selectively in terms of time and location to the respective carrier tape and / or frame sections to be heated, so that it is also very economical to use the energy is guaranteed.
• the pressing of the carrier tape and frame shown in FIG. 3 is ended after a predetermined time, preferably after the adhesive has completely hardened.
• the carrier tape and frame be aligned precisely in the X and Y directions, but also - regardless of any curvature of the carrier tape and / or fluctuating amounts of adhesive or adhesive distribution - the achievement of a constant Total thickness of the carrier tape-frame combination and an exact alignment in the Z direction can be achieved.
• the carrier tape As a result of the further transport of the carrier tape, it arrives in the position control station 33, where the position of the frames on the carrier tape is checked in the X and Y directions by an image recognition system or the like.
• the corresponding carrier tape section is specially marked in the reject marking station 33 following the position control station 33, for example by punching a so-called bad hole.
• the carrier tape 20 provided with the frame is rolled up onto the exit roller 22 already mentioned above.
• the frames 25 to be mounted on the carrier belt 20 are fed into the assembly plant 30 as bulk material and, by means of an oscillating conveyor 50 and a linear conveyor 51, are conveyed at the same time and to a removal station 52, where they can be picked up individually or in a matrix-like arrangement
• Mounting head 41 already mentioned above can be provided, for example, in a matrix or the like.
• the assembly head 41 removes one or more of the frames 25 provided in the removal station 52 and brings them to the carrier belt 20, where it can be positioned at given storage positions using an automatic detection system and, as already described above, a press Subjects operation.
• the frames 25 can be heated or heated by the mounting head 41 as soon as they come into contact when they are removed from the removal station.

Landscapes

• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Chemical & Material Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Physics & Mathematics (AREA)
• Chemical & Material Sciences (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Die Bonding (AREA)
• Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
• Credit Cards Or The Like (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=7783535

Family Applications (1)

Country Status (3)

Families Citing this family (2)

Citations (5)

Family Cites Families (4)

• 1996
  • 1996-01-24 DE DE1996102436 patent/DE19602436B4/de not_active Expired - Fee Related
• 1997
  • 1997-01-17 WO PCT/DE1997/000079 patent/WO1997027625A1/de active Application Filing
  • 1997-01-24 IN IN144CA1997 patent/IN191873B/en unknown

Patent Citations (6)

Non-Patent Citations (2)

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