DE19581448T1 - Autohandler und Verfahren der Messung von Vorrichtungen unter Verwendung des Autohandlers - Google Patents

Autohandler und Verfahren der Messung von Vorrichtungen unter Verwendung des Autohandlers

Info

Publication number
DE19581448T1
DE19581448T1 DE19581448T DE19581448T DE19581448T1 DE 19581448 T1 DE19581448 T1 DE 19581448T1 DE 19581448 T DE19581448 T DE 19581448T DE 19581448 T DE19581448 T DE 19581448T DE 19581448 T1 DE19581448 T1 DE 19581448T1
Authority
DE
Germany
Prior art keywords
car dealer
measuring devices
dealer
car
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19581448T
Other languages
English (en)
Other versions
DE19581448C2 (de
Inventor
Toshio Goto
Aritomo Kikuchi
Hisao Hayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of DE19581448T1 publication Critical patent/DE19581448T1/de
Application granted granted Critical
Publication of DE19581448C2 publication Critical patent/DE19581448C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE19581448T 1994-10-06 1995-10-02 Vorrichtungen und Verfahren zum automatischen Testen von Bauelementen Expired - Fee Related DE19581448C2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6268230A JPH08105937A (ja) 1994-10-06 1994-10-06 デバイス・テスタ用オートハンドラ及びその装置のデバイス測定方法
PCT/JP1995/002004 WO1996011392A1 (fr) 1994-10-06 1995-10-02 Automate programmable et son procede de mise en application dans la mesure de dispositifs

Publications (2)

Publication Number Publication Date
DE19581448T1 true DE19581448T1 (de) 1997-03-27
DE19581448C2 DE19581448C2 (de) 2002-06-20

Family

ID=17455720

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19581448T Expired - Fee Related DE19581448C2 (de) 1994-10-06 1995-10-02 Vorrichtungen und Verfahren zum automatischen Testen von Bauelementen

Country Status (6)

Country Link
JP (1) JPH08105937A (de)
KR (1) KR0162001B1 (de)
CN (1) CN1102239C (de)
DE (1) DE19581448C2 (de)
MY (1) MY121566A (de)
WO (1) WO1996011392A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112008003262B4 (de) * 2007-12-03 2013-05-16 Shibaura Mechatronics Corp. Prüfvorrichtung und Prüfverfahren für Substratoberflächen

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL133696A (en) * 1999-12-23 2006-04-10 Orbotech Ltd Cam reference inspection of multi-color and contour images
KR100339014B1 (ko) * 2000-06-02 2002-06-03 김종현 메모리 모듈 비전 검사기
JP4588913B2 (ja) * 2001-04-13 2010-12-01 ヤマハ発動機株式会社 部品搬送装置
JP4566482B2 (ja) * 2001-09-07 2010-10-20 ヤマハ発動機株式会社 部品試験装置
KR100468867B1 (ko) * 2002-05-02 2005-01-29 삼성테크윈 주식회사 부품 검사 및, 분류 방법
JP4372599B2 (ja) * 2004-03-31 2009-11-25 株式会社 東京ウエルズ ワークの分類排出方法
KR100934029B1 (ko) * 2007-06-18 2009-12-28 (주)테크윙 테스트핸들러의 로딩방법
KR101168316B1 (ko) * 2009-12-01 2012-07-25 삼성전자주식회사 발광다이오드 검사 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4019226A1 (de) * 1990-06-15 1991-12-19 Grundig Emv Vorrichtung zur beleuchtung von leiterplatten in leiterplattenpruefeinrichtungen
US5105149A (en) * 1989-07-17 1992-04-14 Matsushita Electric Industrial Co., Ltd. Apparatus for inspecting electronic devices mounted on a circuit board
EP0491663A1 (de) * 1990-12-19 1992-06-24 Ciba-Geigy Ag Verfahren und Vorrichtung zur Prüfung von optischen Bauteilen, insbesondere augenoptischen Bauteilen und Einrichtung zum Beleuchten von klar-transparenten Prüfobjekten
JPH05275570A (ja) * 1992-03-27 1993-10-22 Nippon Steel Corp 半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62174889A (ja) * 1986-01-27 1987-07-31 Fujitsu Ltd 照明条件解析方法および装置
JPH01236640A (ja) * 1988-03-17 1989-09-21 Tokyo Electron Ltd 半導体チップの外観検査装置
JP2587998B2 (ja) * 1988-06-08 1997-03-05 株式会社日立製作所 外観検査装置
JPH05340889A (ja) * 1992-06-10 1993-12-24 Nippon Avionics Co Ltd 対象物のモニタ画像表示方法およびその装置
JPH06167459A (ja) * 1992-11-30 1994-06-14 Hitachi Ltd 半導体装置の検査装置およびそれに使用されるローディング装置、トレイ段積み装置、保持装置、位置決め装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5105149A (en) * 1989-07-17 1992-04-14 Matsushita Electric Industrial Co., Ltd. Apparatus for inspecting electronic devices mounted on a circuit board
DE4019226A1 (de) * 1990-06-15 1991-12-19 Grundig Emv Vorrichtung zur beleuchtung von leiterplatten in leiterplattenpruefeinrichtungen
EP0491663A1 (de) * 1990-12-19 1992-06-24 Ciba-Geigy Ag Verfahren und Vorrichtung zur Prüfung von optischen Bauteilen, insbesondere augenoptischen Bauteilen und Einrichtung zum Beleuchten von klar-transparenten Prüfobjekten
JPH05275570A (ja) * 1992-03-27 1993-10-22 Nippon Steel Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112008003262B4 (de) * 2007-12-03 2013-05-16 Shibaura Mechatronics Corp. Prüfvorrichtung und Prüfverfahren für Substratoberflächen

Also Published As

Publication number Publication date
KR0162001B1 (ko) 1999-03-30
DE19581448C2 (de) 2002-06-20
MY121566A (en) 2006-02-28
KR960706633A (ko) 1996-12-09
JPH08105937A (ja) 1996-04-23
CN1102239C (zh) 2003-02-26
WO1996011392A1 (fr) 1996-04-18
CN1138898A (zh) 1996-12-25

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20110502