DE1908597A1 - Verfahren zum Zerteilen einer Halbleiterscheibe - Google Patents

Verfahren zum Zerteilen einer Halbleiterscheibe

Info

Publication number
DE1908597A1
DE1908597A1 DE19691908597 DE1908597A DE1908597A1 DE 1908597 A1 DE1908597 A1 DE 1908597A1 DE 19691908597 DE19691908597 DE 19691908597 DE 1908597 A DE1908597 A DE 1908597A DE 1908597 A1 DE1908597 A1 DE 1908597A1
Authority
DE
Germany
Prior art keywords
cavity
disc
semiconductor wafer
flexible
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19691908597
Other languages
German (de)
English (en)
Inventor
Bielen Joseph Michael
Morris Gilbert Victor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of DE1908597A1 publication Critical patent/DE1908597A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • B28D5/0047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking using fluid or gas pressure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
DE19691908597 1968-02-23 1969-02-20 Verfahren zum Zerteilen einer Halbleiterscheibe Pending DE1908597A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70786668A 1968-02-23 1968-02-23

Publications (1)

Publication Number Publication Date
DE1908597A1 true DE1908597A1 (de) 1969-09-18

Family

ID=24843475

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19691908597 Pending DE1908597A1 (de) 1968-02-23 1969-02-20 Verfahren zum Zerteilen einer Halbleiterscheibe

Country Status (4)

Country Link
US (1) US3507426A (enExample)
DE (1) DE1908597A1 (enExample)
FR (1) FR1595496A (enExample)
GB (1) GB1193945A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3137301A1 (de) * 1981-09-18 1983-04-14 Presco Inc., Beverly Hills, Calif. "verfahren und vorrichtung zur handhabung kleiner teile in der fertigung"
DE3838627A1 (de) * 1988-11-15 1990-05-17 Heinrich Ulrich Maulschluessel fuer schrauben, muttern oder dergl.
EP0289045A3 (en) * 1987-05-01 1991-01-16 Sumitomo Electric Industries Limited Apparatus for fabricating semiconductor devices
FR2860178A1 (fr) * 2003-09-30 2005-04-01 Commissariat Energie Atomique Procede de separation de plaques collees entre elles pour constituer une structure empilee.

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1297954A (enExample) * 1969-05-01 1972-11-29
US3747204A (en) * 1969-12-04 1973-07-24 Advanced Technology Center Inc Method for making an acoustic transducer
US3727282A (en) * 1970-02-05 1973-04-17 Burroughs Corp Semiconductor handling apparatus
US3743148A (en) * 1971-03-08 1973-07-03 H Carlson Wafer breaker
US3730410A (en) * 1971-06-16 1973-05-01 T Altshuler Wafer breaker
US3786973A (en) * 1972-03-28 1974-01-22 Ncr Method and apparatus for breaking semiconductor wafers
US3815802A (en) * 1972-09-29 1974-06-11 American Home Prod Scored tablet breaker
US3880337A (en) * 1973-06-08 1975-04-29 Ford Motor Co Vacuum glass stripping apparatus
US3920168A (en) * 1975-01-15 1975-11-18 Barrie F Regan Apparatus for breaking semiconductor wafers
US4247031A (en) * 1979-04-10 1981-01-27 Rca Corporation Method for cracking and separating pellets formed on a wafer
US4428518A (en) 1980-10-29 1984-01-31 Morton Glass Works Glass breaking tool
FR2516848A1 (fr) * 1981-11-25 1983-05-27 Radiotechnique Compelec Procede et machine pour subdiviser une plaque de ceramiqueŸa
US4409843A (en) * 1982-03-11 1983-10-18 Hoechst-Roussel Pharmaceuticals Inc. Device for measuring tablet breaking force
US5133491A (en) * 1990-12-20 1992-07-28 Die Tech, Inc. Substrate breaker
US5310104A (en) * 1991-12-16 1994-05-10 General Electric Company Method and apparatus for cleaving a semiconductor wafer into individual die and providing for low stress die removal
US5792566A (en) * 1996-07-02 1998-08-11 American Xtal Technology Single crystal wafers
US6685073B1 (en) * 1996-11-26 2004-02-03 Texas Instruments Incorporated Method and apparatus for stretching and processing saw film tape after breaking a partially sawn wafer
CA2490849C (en) * 2004-12-22 2009-12-22 Ibm Canada Limited - Ibm Canada Limitee An automated singularization tool for brittle insulating arrays
US20090061597A1 (en) * 2007-08-30 2009-03-05 Kavlico Corporation Singulator method and apparatus
US20110039397A1 (en) * 2009-08-17 2011-02-17 Huilong Zhu Structures and methods to separate microchips from a wafer
TW201241903A (en) * 2011-04-15 2012-10-16 Lextar Electronics Corp Die breaking process
US20180323105A1 (en) * 2017-05-02 2018-11-08 Psemi Corporation Simultaneous Break and Expansion System for Integrated Circuit Wafers
CN115871114A (zh) * 2021-09-28 2023-03-31 山东浪潮华光光电子股份有限公司 一种晶圆切割装置及晶圆切割方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3040489A (en) * 1959-03-13 1962-06-26 Motorola Inc Semiconductor dicing
US3182873A (en) * 1961-09-11 1965-05-11 Motorola Inc Method for dicing semiconductor material
US3396452A (en) * 1965-06-02 1968-08-13 Nippon Electric Co Method and apparatus for breaking a semiconductor wafer into elementary pieces

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3137301A1 (de) * 1981-09-18 1983-04-14 Presco Inc., Beverly Hills, Calif. "verfahren und vorrichtung zur handhabung kleiner teile in der fertigung"
EP0289045A3 (en) * 1987-05-01 1991-01-16 Sumitomo Electric Industries Limited Apparatus for fabricating semiconductor devices
US5104023A (en) * 1987-05-01 1992-04-14 Sumitomo Electric Industries, Ltd. Apparatus for fabrication semiconductor device
DE3838627A1 (de) * 1988-11-15 1990-05-17 Heinrich Ulrich Maulschluessel fuer schrauben, muttern oder dergl.
FR2860178A1 (fr) * 2003-09-30 2005-04-01 Commissariat Energie Atomique Procede de separation de plaques collees entre elles pour constituer une structure empilee.
EP1520669A1 (fr) * 2003-09-30 2005-04-06 Commissariat A L'energie Atomique Procédé de séparation de plaques collées entre elles pour constituer une structure empilée
US7264996B2 (en) 2003-09-30 2007-09-04 Commissariat A L'energie Atomique Method for separating wafers bonded together to form a stacked structure

Also Published As

Publication number Publication date
GB1193945A (en) 1970-06-03
FR1595496A (enExample) 1970-06-08
US3507426A (en) 1970-04-21

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