FR1595496A - - Google Patents
Info
- Publication number
- FR1595496A FR1595496A FR1595496DA FR1595496A FR 1595496 A FR1595496 A FR 1595496A FR 1595496D A FR1595496D A FR 1595496DA FR 1595496 A FR1595496 A FR 1595496A
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
- B28D5/0047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking using fluid or gas pressure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/12—With preliminary weakening
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
- Y10T225/321—Preliminary weakener
- Y10T225/325—With means to apply moment of force to weakened work
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US70786668A | 1968-02-23 | 1968-02-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1595496A true FR1595496A (fr) | 1970-06-08 |
Family
ID=24843475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1595496D Expired FR1595496A (fr) | 1968-02-23 | 1968-12-26 |
Country Status (4)
Country | Link |
---|---|
US (1) | US3507426A (fr) |
DE (1) | DE1908597A1 (fr) |
FR (1) | FR1595496A (fr) |
GB (1) | GB1193945A (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2516848A1 (fr) * | 1981-11-25 | 1983-05-27 | Radiotechnique Compelec | Procede et machine pour subdiviser une plaque de ceramiquea |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1297954A (fr) * | 1969-05-01 | 1972-11-29 | ||
US3747204A (en) * | 1969-12-04 | 1973-07-24 | Advanced Technology Center Inc | Method for making an acoustic transducer |
US3727282A (en) * | 1970-02-05 | 1973-04-17 | Burroughs Corp | Semiconductor handling apparatus |
US3743148A (en) * | 1971-03-08 | 1973-07-03 | H Carlson | Wafer breaker |
US3730410A (en) * | 1971-06-16 | 1973-05-01 | T Altshuler | Wafer breaker |
US3786973A (en) * | 1972-03-28 | 1974-01-22 | Ncr | Method and apparatus for breaking semiconductor wafers |
US3815802A (en) * | 1972-09-29 | 1974-06-11 | American Home Prod | Scored tablet breaker |
US3880337A (en) * | 1973-06-08 | 1975-04-29 | Ford Motor Co | Vacuum glass stripping apparatus |
US3920168A (en) * | 1975-01-15 | 1975-11-18 | Barrie F Regan | Apparatus for breaking semiconductor wafers |
US4247031A (en) * | 1979-04-10 | 1981-01-27 | Rca Corporation | Method for cracking and separating pellets formed on a wafer |
DE3137301A1 (de) * | 1981-09-18 | 1983-04-14 | Presco Inc., Beverly Hills, Calif. | "verfahren und vorrichtung zur handhabung kleiner teile in der fertigung" |
US4409843A (en) * | 1982-03-11 | 1983-10-18 | Hoechst-Roussel Pharmaceuticals Inc. | Device for measuring tablet breaking force |
KR920004514B1 (ko) * | 1987-05-01 | 1992-06-08 | 스미도모덴기고오교오 가부시기가이샤 | 반도체소자 제조장치 |
DE3838627A1 (de) * | 1988-11-15 | 1990-05-17 | Heinrich Ulrich | Maulschluessel fuer schrauben, muttern oder dergl. |
US5133491A (en) * | 1990-12-20 | 1992-07-28 | Die Tech, Inc. | Substrate breaker |
US5310104A (en) * | 1991-12-16 | 1994-05-10 | General Electric Company | Method and apparatus for cleaving a semiconductor wafer into individual die and providing for low stress die removal |
US5792566A (en) * | 1996-07-02 | 1998-08-11 | American Xtal Technology | Single crystal wafers |
US6685073B1 (en) * | 1996-11-26 | 2004-02-03 | Texas Instruments Incorporated | Method and apparatus for stretching and processing saw film tape after breaking a partially sawn wafer |
FR2860178B1 (fr) * | 2003-09-30 | 2005-11-04 | Commissariat Energie Atomique | Procede de separation de plaques collees entre elles pour constituer une structure empilee. |
CA2490849C (fr) * | 2004-12-22 | 2009-12-22 | Ibm Canada Limited - Ibm Canada Limitee | Outil de division automatique pour matrices isolantes friables |
US20090061597A1 (en) * | 2007-08-30 | 2009-03-05 | Kavlico Corporation | Singulator method and apparatus |
US20110039397A1 (en) * | 2009-08-17 | 2011-02-17 | Huilong Zhu | Structures and methods to separate microchips from a wafer |
TW201241903A (en) * | 2011-04-15 | 2012-10-16 | Lextar Electronics Corp | Die breaking process |
US20180323105A1 (en) * | 2017-05-02 | 2018-11-08 | Psemi Corporation | Simultaneous Break and Expansion System for Integrated Circuit Wafers |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3040489A (en) * | 1959-03-13 | 1962-06-26 | Motorola Inc | Semiconductor dicing |
US3182873A (en) * | 1961-09-11 | 1965-05-11 | Motorola Inc | Method for dicing semiconductor material |
US3396452A (en) * | 1965-06-02 | 1968-08-13 | Nippon Electric Co | Method and apparatus for breaking a semiconductor wafer into elementary pieces |
-
1968
- 1968-02-23 US US707866A patent/US3507426A/en not_active Expired - Lifetime
- 1968-12-26 FR FR1595496D patent/FR1595496A/fr not_active Expired
-
1969
- 1969-02-12 GB GB7610/69A patent/GB1193945A/en not_active Expired
- 1969-02-20 DE DE19691908597 patent/DE1908597A1/de active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2516848A1 (fr) * | 1981-11-25 | 1983-05-27 | Radiotechnique Compelec | Procede et machine pour subdiviser une plaque de ceramiquea |
EP0080765A1 (fr) * | 1981-11-25 | 1983-06-08 | R.T.C. LA RADIOTECHNIQUE-COMPELEC Société anonyme dite: | Procédé et machine pour subdiviser une plaque de céramique |
Also Published As
Publication number | Publication date |
---|---|
US3507426A (en) | 1970-04-21 |
DE1908597A1 (de) | 1969-09-18 |
GB1193945A (en) | 1970-06-03 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |