GB1193945A - Method of Dicing Semiconductor Wafers - Google Patents

Method of Dicing Semiconductor Wafers

Info

Publication number
GB1193945A
GB1193945A GB7610/69A GB761069A GB1193945A GB 1193945 A GB1193945 A GB 1193945A GB 7610/69 A GB7610/69 A GB 7610/69A GB 761069 A GB761069 A GB 761069A GB 1193945 A GB1193945 A GB 1193945A
Authority
GB
United Kingdom
Prior art keywords
wafer
scribed
cavity
face
along
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7610/69A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of GB1193945A publication Critical patent/GB1193945A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • B28D5/0047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking using fluid or gas pressure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
GB7610/69A 1968-02-23 1969-02-12 Method of Dicing Semiconductor Wafers Expired GB1193945A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70786668A 1968-02-23 1968-02-23

Publications (1)

Publication Number Publication Date
GB1193945A true GB1193945A (en) 1970-06-03

Family

ID=24843475

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7610/69A Expired GB1193945A (en) 1968-02-23 1969-02-12 Method of Dicing Semiconductor Wafers

Country Status (4)

Country Link
US (1) US3507426A (enExample)
DE (1) DE1908597A1 (enExample)
FR (1) FR1595496A (enExample)
GB (1) GB1193945A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110039397A1 (en) * 2009-08-17 2011-02-17 Huilong Zhu Structures and methods to separate microchips from a wafer
CN102729340A (zh) * 2011-04-15 2012-10-17 隆达电子股份有限公司 晶粒劈裂工艺
CN115871114A (zh) * 2021-09-28 2023-03-31 山东浪潮华光光电子股份有限公司 一种晶圆切割装置及晶圆切割方法

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1297954A (enExample) * 1969-05-01 1972-11-29
US3747204A (en) * 1969-12-04 1973-07-24 Advanced Technology Center Inc Method for making an acoustic transducer
US3727282A (en) * 1970-02-05 1973-04-17 Burroughs Corp Semiconductor handling apparatus
US3743148A (en) * 1971-03-08 1973-07-03 H Carlson Wafer breaker
US3730410A (en) * 1971-06-16 1973-05-01 T Altshuler Wafer breaker
US3786973A (en) * 1972-03-28 1974-01-22 Ncr Method and apparatus for breaking semiconductor wafers
US3815802A (en) * 1972-09-29 1974-06-11 American Home Prod Scored tablet breaker
US3880337A (en) * 1973-06-08 1975-04-29 Ford Motor Co Vacuum glass stripping apparatus
US3920168A (en) * 1975-01-15 1975-11-18 Barrie F Regan Apparatus for breaking semiconductor wafers
US4247031A (en) * 1979-04-10 1981-01-27 Rca Corporation Method for cracking and separating pellets formed on a wafer
US4428518A (en) 1980-10-29 1984-01-31 Morton Glass Works Glass breaking tool
DE3137301A1 (de) * 1981-09-18 1983-04-14 Presco Inc., Beverly Hills, Calif. "verfahren und vorrichtung zur handhabung kleiner teile in der fertigung"
FR2516848A1 (fr) * 1981-11-25 1983-05-27 Radiotechnique Compelec Procede et machine pour subdiviser une plaque de ceramiqueŸa
US4409843A (en) * 1982-03-11 1983-10-18 Hoechst-Roussel Pharmaceuticals Inc. Device for measuring tablet breaking force
KR920004514B1 (ko) * 1987-05-01 1992-06-08 스미도모덴기고오교오 가부시기가이샤 반도체소자 제조장치
DE3838627A1 (de) * 1988-11-15 1990-05-17 Heinrich Ulrich Maulschluessel fuer schrauben, muttern oder dergl.
US5133491A (en) * 1990-12-20 1992-07-28 Die Tech, Inc. Substrate breaker
US5310104A (en) * 1991-12-16 1994-05-10 General Electric Company Method and apparatus for cleaving a semiconductor wafer into individual die and providing for low stress die removal
US5792566A (en) * 1996-07-02 1998-08-11 American Xtal Technology Single crystal wafers
US6685073B1 (en) * 1996-11-26 2004-02-03 Texas Instruments Incorporated Method and apparatus for stretching and processing saw film tape after breaking a partially sawn wafer
FR2860178B1 (fr) * 2003-09-30 2005-11-04 Commissariat Energie Atomique Procede de separation de plaques collees entre elles pour constituer une structure empilee.
CA2490849C (en) * 2004-12-22 2009-12-22 Ibm Canada Limited - Ibm Canada Limitee An automated singularization tool for brittle insulating arrays
US20090061597A1 (en) * 2007-08-30 2009-03-05 Kavlico Corporation Singulator method and apparatus
US20180323105A1 (en) * 2017-05-02 2018-11-08 Psemi Corporation Simultaneous Break and Expansion System for Integrated Circuit Wafers

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3040489A (en) * 1959-03-13 1962-06-26 Motorola Inc Semiconductor dicing
US3182873A (en) * 1961-09-11 1965-05-11 Motorola Inc Method for dicing semiconductor material
US3396452A (en) * 1965-06-02 1968-08-13 Nippon Electric Co Method and apparatus for breaking a semiconductor wafer into elementary pieces

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110039397A1 (en) * 2009-08-17 2011-02-17 Huilong Zhu Structures and methods to separate microchips from a wafer
CN102729340A (zh) * 2011-04-15 2012-10-17 隆达电子股份有限公司 晶粒劈裂工艺
CN115871114A (zh) * 2021-09-28 2023-03-31 山东浪潮华光光电子股份有限公司 一种晶圆切割装置及晶圆切割方法

Also Published As

Publication number Publication date
DE1908597A1 (de) 1969-09-18
FR1595496A (enExample) 1970-06-08
US3507426A (en) 1970-04-21

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees