DE1813034A1 - Fassung zum Haltern und Anschliessen eines mit Kontaktstiften versehenen elektrischen Bausteins - Google Patents
Fassung zum Haltern und Anschliessen eines mit Kontaktstiften versehenen elektrischen BausteinsInfo
- Publication number
- DE1813034A1 DE1813034A1 DE19681813034 DE1813034A DE1813034A1 DE 1813034 A1 DE1813034 A1 DE 1813034A1 DE 19681813034 DE19681813034 DE 19681813034 DE 1813034 A DE1813034 A DE 1813034A DE 1813034 A1 DE1813034 A1 DE 1813034A1
- Authority
- DE
- Germany
- Prior art keywords
- fit
- block
- pins
- module
- side walls
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011810 insulating material Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000010985 leather Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000012858 resilient material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920005439 Perspex® Polymers 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/023—Stackable modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
- H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB5541367 | 1967-12-06 | ||
GB5725167 | 1967-12-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE1813034A1 true DE1813034A1 (de) | 1969-07-03 |
DE1813034B2 DE1813034B2 (enrdf_load_stackoverflow) | 1971-01-07 |
Family
ID=26267549
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19681813034 Pending DE1813034A1 (de) | 1967-12-06 | 1968-12-06 | Fassung zum Haltern und Anschliessen eines mit Kontaktstiften versehenen elektrischen Bausteins |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE1813034A1 (enrdf_load_stackoverflow) |
GB (1) | GB1227529A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3126825A1 (de) * | 1980-07-18 | 1982-04-22 | Thomas & Betts Corp., 08869 Raritan, N.J. | Behaeltnis fuer elektronische baugruppen |
-
1967
- 1967-12-06 GB GB1227529D patent/GB1227529A/en not_active Expired
-
1968
- 1968-12-06 DE DE19681813034 patent/DE1813034A1/de active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3126825A1 (de) * | 1980-07-18 | 1982-04-22 | Thomas & Betts Corp., 08869 Raritan, N.J. | Behaeltnis fuer elektronische baugruppen |
Also Published As
Publication number | Publication date |
---|---|
DE1813034B2 (enrdf_load_stackoverflow) | 1971-01-07 |
GB1227529A (enrdf_load_stackoverflow) | 1971-04-07 |
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