DE1639458B1 - Halbleiteranordnung - Google Patents

Halbleiteranordnung

Info

Publication number
DE1639458B1
DE1639458B1 DE19681639458D DE1639458DA DE1639458B1 DE 1639458 B1 DE1639458 B1 DE 1639458B1 DE 19681639458 D DE19681639458 D DE 19681639458D DE 1639458D A DE1639458D A DE 1639458DA DE 1639458 B1 DE1639458 B1 DE 1639458B1
Authority
DE
Germany
Prior art keywords
emitter
base
wire
length
transistor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19681639458D
Other languages
German (de)
English (en)
Inventor
Toshiro Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Publication of DE1639458B1 publication Critical patent/DE1639458B1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/226—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for HF amplifiers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Bipolar Transistors (AREA)
  • Wire Bonding (AREA)
DE19681639458D 1967-03-09 1968-03-08 Halbleiteranordnung Pending DE1639458B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1967019268U JPS4697Y1 (enExample) 1967-03-09 1967-03-09

Publications (1)

Publication Number Publication Date
DE1639458B1 true DE1639458B1 (de) 1971-08-05

Family

ID=11994681

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19681639458D Pending DE1639458B1 (de) 1967-03-09 1968-03-08 Halbleiteranordnung

Country Status (4)

Country Link
US (1) US3486082A (enExample)
JP (1) JPS4697Y1 (enExample)
DE (1) DE1639458B1 (enExample)
GB (1) GB1168209A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1789063A1 (de) * 1968-09-30 1971-12-30 Siemens Ag Traeger fuer Halbleiterbauelemente
US3671793A (en) * 1969-09-16 1972-06-20 Itt High frequency transistor structure having an impedance transforming network incorporated on the semiconductor chip
US3753056A (en) * 1971-03-22 1973-08-14 Texas Instruments Inc Microwave semiconductor device
US3893159A (en) * 1974-02-26 1975-07-01 Rca Corp Multiple cell high frequency power semiconductor device having bond wires of differing inductance from cell to cell
US4213141A (en) * 1978-05-12 1980-07-15 Solid State Scientific Inc. Hybrid transistor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2934685A (en) * 1957-01-09 1960-04-26 Texas Instruments Inc Transistors and method of fabricating same
FR1401089A (fr) * 1963-07-22 1965-05-28 Telefunken Patent Dispositif semi-conducteur
AT243320B (de) * 1963-05-27 1965-11-10 Siemens Ag Halbleiterbauelement mit mindestens drei Elektroden und einem zum Teil aus Metall bestehenden Gehäuse

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL110715C (enExample) * 1954-12-16 1900-01-01
US3325704A (en) * 1964-07-31 1967-06-13 Texas Instruments Inc High frequency coaxial transistor package
US3339127A (en) * 1964-11-18 1967-08-29 Motorola Inc Semiconductor housing
US3387190A (en) * 1965-08-19 1968-06-04 Itt High frequency power transistor having electrodes forming transmission lines

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2934685A (en) * 1957-01-09 1960-04-26 Texas Instruments Inc Transistors and method of fabricating same
AT243320B (de) * 1963-05-27 1965-11-10 Siemens Ag Halbleiterbauelement mit mindestens drei Elektroden und einem zum Teil aus Metall bestehenden Gehäuse
FR1401089A (fr) * 1963-07-22 1965-05-28 Telefunken Patent Dispositif semi-conducteur

Also Published As

Publication number Publication date
GB1168209A (en) 1969-10-22
US3486082A (en) 1969-12-23
JPS4697Y1 (enExample) 1971-01-06

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