DE1614012A1 - Anordnung zur Abfuehrung der in Halbleiterelementen,wie Dioden,Thyristoren u.dgl.erzeugten Waerme - Google Patents

Anordnung zur Abfuehrung der in Halbleiterelementen,wie Dioden,Thyristoren u.dgl.erzeugten Waerme

Info

Publication number
DE1614012A1
DE1614012A1 DE19671614012 DE1614012A DE1614012A1 DE 1614012 A1 DE1614012 A1 DE 1614012A1 DE 19671614012 DE19671614012 DE 19671614012 DE 1614012 A DE1614012 A DE 1614012A DE 1614012 A1 DE1614012 A1 DE 1614012A1
Authority
DE
Germany
Prior art keywords
heat
heat sink
arrangement according
semiconductor elements
thyristors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19671614012
Other languages
German (de)
English (en)
Inventor
Dipl-Ing Guenter Eckermann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THEODOR KIEPE ELEKTROTECHN FAB
Original Assignee
THEODOR KIEPE ELEKTROTECHN FAB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THEODOR KIEPE ELEKTROTECHN FAB filed Critical THEODOR KIEPE ELEKTROTECHN FAB
Priority to DE19671614012 priority Critical patent/DE1614012A1/de
Priority to CH1038467A priority patent/CH478456A/de
Priority to GB1229474D priority patent/GB1229474A/en
Publication of DE1614012A1 publication Critical patent/DE1614012A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE19671614012 1967-06-16 1967-06-16 Anordnung zur Abfuehrung der in Halbleiterelementen,wie Dioden,Thyristoren u.dgl.erzeugten Waerme Pending DE1614012A1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE19671614012 DE1614012A1 (de) 1967-06-16 1967-06-16 Anordnung zur Abfuehrung der in Halbleiterelementen,wie Dioden,Thyristoren u.dgl.erzeugten Waerme
CH1038467A CH478456A (de) 1967-06-16 1967-07-21 Anordnung mit mindestens einem Halbleiterelement und Mitteln zur Abführung der in diesem erzeugten Wärme
GB1229474D GB1229474A (enrdf_load_stackoverflow) 1967-06-16 1968-06-14

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEK0062573 1967-06-16
DE19671614012 DE1614012A1 (de) 1967-06-16 1967-06-16 Anordnung zur Abfuehrung der in Halbleiterelementen,wie Dioden,Thyristoren u.dgl.erzeugten Waerme

Publications (1)

Publication Number Publication Date
DE1614012A1 true DE1614012A1 (de) 1970-03-26

Family

ID=25753695

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19671614012 Pending DE1614012A1 (de) 1967-06-16 1967-06-16 Anordnung zur Abfuehrung der in Halbleiterelementen,wie Dioden,Thyristoren u.dgl.erzeugten Waerme

Country Status (3)

Country Link
CH (1) CH478456A (enrdf_load_stackoverflow)
DE (1) DE1614012A1 (enrdf_load_stackoverflow)
GB (1) GB1229474A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2638909A1 (de) * 1976-08-28 1978-03-02 Semikron Gleichrichterbau Halbleiteranordnung

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4499659A (en) * 1982-10-18 1985-02-19 Raytheon Company Semiconductor structures and manufacturing methods

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2638909A1 (de) * 1976-08-28 1978-03-02 Semikron Gleichrichterbau Halbleiteranordnung

Also Published As

Publication number Publication date
CH478456A (de) 1969-09-15
GB1229474A (enrdf_load_stackoverflow) 1971-04-21

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