DE1533707U - - Google Patents

Info

Publication number
DE1533707U
DE1533707U DENDAT1533707D DE1533707DU DE1533707U DE 1533707 U DE1533707 U DE 1533707U DE NDAT1533707 D DENDAT1533707 D DE NDAT1533707D DE 1533707D U DE1533707D U DE 1533707DU DE 1533707 U DE1533707 U DE 1533707U
Authority
DE
Germany
Prior art keywords
eimm
tmf
xmtdmmtihwpredom
wwmt
voraohlusa
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DENDAT1533707D
Other languages
German (de)
English (en)
Publication of DE1533707U publication Critical patent/DE1533707U/de
Active legal-status Critical Current

Links

Landscapes

  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
DENDAT1533707D Active DE1533707U (enrdf_load_html_response)

Publications (1)

Publication Number Publication Date
DE1533707U true DE1533707U (enrdf_load_html_response)

Family

ID=834062

Family Applications (1)

Application Number Title Priority Date Filing Date
DENDAT1533707D Active DE1533707U (enrdf_load_html_response)

Country Status (1)

Country Link
DE (1) DE1533707U (enrdf_load_html_response)

Similar Documents

Publication Publication Date Title
EP1764810B1 (en) Acceptor doped barium titanate based thin film capacitors formed on metal foils and methods for making thereof
EP2414562B1 (de) Verfahren zum herstellen eines mit einem metallischen, vor korrosion schützenden überzug versehenen stahlbauteils und stahlbauteil
DE1533707U (enrdf_load_html_response)
JPH0799252A (ja) 強誘電体膜の製造方法及びそれを用いた半導体装置
US20020134300A1 (en) Method of depositing buffer layers on biaxially textured metal substrates
EP0210437B1 (de) Verfahren zur chemischen Metallisierung eines elektrisch schlecht leitenden Trägerkörpers aus einem anorganischen Material
DE102009037855A1 (de) Verfahren zur Oberflächenbehandlung von Aluminium oder Aluminiumlegierung
CN102779642A (zh) 电子部件
US5668060A (en) Outer lead for a semiconductor IC package and a method of fabricating the same
KR20020057965A (ko) 지르코늄계 합금, 및 이를 사용한 핵 연료 어셈블리용부재의 제조방법
DE102020115315A1 (de) Piezoelektrische Baugruppe und Prozess zum Bilden einer piezoelektrischen Baugruppe
EP0960674B1 (en) Method for preparing a composite nickel powder
EP0676384B1 (de) Perowskithaltiger Verbundwerkstoff, Verfahren zu seiner Herstellung, elektronisches Bauelement und Modul
US8183108B2 (en) Glass flux assisted sintering of chemical solution deposited thin dielectric films
US4964875A (en) Process for after-treatment of dyed polyamide textile materials with polyurethane containing quaternary ammonium groups
JP2007184622A (ja) 高キャパシタンス薄膜キャパシタの製造方法
CN111647777B (zh) 一种玻璃隔条铝带及其制备方法
DE2346616A1 (de) Bad zum stromlosen abscheiden von duktilem kupfer
US5807495A (en) Bi-based dielectric thin films, and compositions and method for forming them
CN101599526B (zh) 制备涂布导体用成形衬底的工艺及使用该衬底的涂布导体
Bel-Hadj-Tahar Morphological and electrical investigations of lead zirconium titanate thin films processed at low temperature by a novel sol-gel system
JP2022169922A (ja) 高温超電導線材の接続構造
DE2057757A1 (de) Komplexbildner und ihre Anwendung in stromlos arbeitenden Metallisierungsbaedern
CN1196758A (zh) 磁屏蔽材料、其制造方法及组装有该材料的彩色显象管
JPS60251227A (ja) 低熱膨張Fe−Ni系鋼板の製造方法